JP6225067B2 - 基板液処理装置及び基板液処理方法 - Google Patents

基板液処理装置及び基板液処理方法 Download PDF

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Publication number
JP6225067B2
JP6225067B2 JP2014086639A JP2014086639A JP6225067B2 JP 6225067 B2 JP6225067 B2 JP 6225067B2 JP 2014086639 A JP2014086639 A JP 2014086639A JP 2014086639 A JP2014086639 A JP 2014086639A JP 6225067 B2 JP6225067 B2 JP 6225067B2
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Japan
Prior art keywords
substrate
liquid
processing
treatment
droplet
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JP2014086639A
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English (en)
Japanese (ja)
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JP2015026814A5 (enExample
JP2015026814A (ja
Inventor
茂久 井上
茂久 井上
中山　大輔
大輔 中山
勝文 松木
勝文 松木
拓朗 増住
拓朗 増住
祐希 吉田
祐希 吉田
明徳 相原
明徳 相原
清瀬　浩巳
浩巳 清瀬
崇 烏野
崇 烏野
裕隆 丸山
裕隆 丸山
和也 ▲高▼山
和也 ▲高▼山
貴士 中澤
貴士 中澤
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2014086639A priority Critical patent/JP6225067B2/ja
Priority to US14/297,723 priority patent/US20140373877A1/en
Priority to TW103121008A priority patent/TWI584364B/zh
Priority to KR1020140074886A priority patent/KR102251256B1/ko
Publication of JP2015026814A publication Critical patent/JP2015026814A/ja
Publication of JP2015026814A5 publication Critical patent/JP2015026814A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2014086639A 2013-06-21 2014-04-18 基板液処理装置及び基板液処理方法 Active JP6225067B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014086639A JP6225067B2 (ja) 2013-06-21 2014-04-18 基板液処理装置及び基板液処理方法
US14/297,723 US20140373877A1 (en) 2013-06-21 2014-06-06 Liquid processing apparatus and liquid processing method
TW103121008A TWI584364B (zh) 2013-06-21 2014-06-18 Substrate liquid processing device and substrate liquid treatment method
KR1020140074886A KR102251256B1 (ko) 2013-06-21 2014-06-19 기판 액처리 장치 및 기판 액처리 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013130883 2013-06-21
JP2013130883 2013-06-21
JP2014086639A JP6225067B2 (ja) 2013-06-21 2014-04-18 基板液処理装置及び基板液処理方法

Publications (3)

Publication Number Publication Date
JP2015026814A JP2015026814A (ja) 2015-02-05
JP2015026814A5 JP2015026814A5 (enExample) 2016-11-04
JP6225067B2 true JP6225067B2 (ja) 2017-11-01

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JP2014086639A Active JP6225067B2 (ja) 2013-06-21 2014-04-18 基板液処理装置及び基板液処理方法

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US (1) US20140373877A1 (enExample)
JP (1) JP6225067B2 (enExample)
KR (1) KR102251256B1 (enExample)
TW (1) TWI584364B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170207079A1 (en) * 2016-01-15 2017-07-20 United Microelectronics Corp. Substrate cleaning method
US10388537B2 (en) 2016-04-15 2019-08-20 Samsung Electronics Co., Ltd. Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
KR20170128801A (ko) 2016-05-16 2017-11-24 삼성전자주식회사 기판 세정 방법 및 이를 수행하기 위한 장치
JP6980457B2 (ja) * 2017-08-23 2021-12-15 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
KR102862397B1 (ko) 2020-09-18 2025-09-22 삼성전자주식회사 기판 세정 방법 및 그를 포함하는 기판 제조 방법
TW202331909A (zh) * 2021-12-21 2023-08-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法

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KR100202761B1 (ko) * 1995-06-09 1999-06-15 니시무로 타이죠 반도체 기판의 세정 방법 및 세정 장치
US6348289B1 (en) * 1999-08-03 2002-02-19 Advanced Micro Devices, Inc. System and method for controlling polysilicon feature critical dimension during processing
US7364625B2 (en) * 2000-05-30 2008-04-29 Fsi International, Inc. Rinsing processes and equipment
JP4046486B2 (ja) * 2001-06-13 2008-02-13 Ｎｅｃエレクトロニクス株式会社 洗浄水及びウエハの洗浄方法
JP4053800B2 (ja) * 2002-03-25 2008-02-27 東京エレクトロン株式会社 基板処理装置
US6852173B2 (en) * 2002-04-05 2005-02-08 Boc, Inc. Liquid-assisted cryogenic cleaning
JP4702920B2 (ja) * 2002-11-12 2011-06-15 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP4312542B2 (ja) * 2003-07-29 2009-08-12 東京エレクトロン株式会社 ２流体ノズル装置、洗浄処理装置、およびミスト発生方法
WO2006035864A1 (ja) * 2004-09-30 2006-04-06 Shin-Etsu Handotai Co., Ltd. Ｓｏｉウエーハの洗浄方法
US7767026B2 (en) * 2005-03-29 2010-08-03 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method
JP2006286665A (ja) * 2005-03-31 2006-10-19 Toshiba Corp 電子デバイス洗浄方法及び電子デバイス洗浄装置
KR100682538B1 (ko) * 2006-02-07 2007-02-15 삼성전자주식회사 반도체 웨이퍼 세정설비 및 세정방법
TW200739710A (en) * 2006-04-11 2007-10-16 Dainippon Screen Mfg Substrate processing method and substrate processing apparatus
JP2007311559A (ja) * 2006-05-18 2007-11-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008226900A (ja) * 2007-03-08 2008-09-25 Hitachi Kokusai Electric Inc 基板洗浄方法、半導体装置の製造方法及び基板洗浄装置。
WO2009072529A1 (ja) * 2007-12-04 2009-06-11 Mitsubishi Chemical Corporation 半導体デバイス用基板の洗浄方法及び洗浄液
US20100258142A1 (en) * 2009-04-14 2010-10-14 Mark Naoshi Kawaguchi Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate
US8415254B2 (en) * 2008-11-20 2013-04-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method for removing dummy poly in a gate last process
KR101044409B1 (ko) * 2009-05-27 2011-06-27 세메스 주식회사 기판 세정 방법
JP2011192779A (ja) * 2010-03-15 2011-09-29 Kurita Water Ind Ltd 電子材料の洗浄方法および洗浄システム
CN110189995A (zh) * 2010-12-10 2019-08-30 东京毅力科创Fsi公司 用于从衬底选择性地移除氮化物的方法
KR101907510B1 (ko) * 2011-11-07 2018-10-16 삼성전자주식회사 기판 세척 방법 및 기판 세척 장치

Also Published As

Publication number Publication date
US20140373877A1 (en) 2014-12-25
KR102251256B1 (ko) 2021-05-11
KR20140148330A (ko) 2014-12-31
TW201515081A (zh) 2015-04-16
TWI584364B (zh) 2017-05-21
JP2015026814A (ja) 2015-02-05

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