WO2009072529A1 - 半導体デバイス用基板の洗浄方法及び洗浄液 - Google Patents

半導体デバイス用基板の洗浄方法及び洗浄液 Download PDF

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Publication number
WO2009072529A1
WO2009072529A1 PCT/JP2008/071982 JP2008071982W WO2009072529A1 WO 2009072529 A1 WO2009072529 A1 WO 2009072529A1 JP 2008071982 W JP2008071982 W JP 2008071982W WO 2009072529 A1 WO2009072529 A1 WO 2009072529A1
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WO
WIPO (PCT)
Prior art keywords
substrate
washing
semiconductor device
ultrasonic waves
contaminants
Prior art date
Application number
PCT/JP2008/071982
Other languages
English (en)
French (fr)
Inventor
Hideaki Mochizuki
Makoto Ishikawa
Noriyuki Saito
Original Assignee
Mitsubishi Chemical Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corporation filed Critical Mitsubishi Chemical Corporation
Priority to CN2008801188519A priority Critical patent/CN101884092A/zh
Priority to US12/746,025 priority patent/US20100294306A1/en
Priority to JP2009507257A priority patent/JPWO2009072529A1/ja
Publication of WO2009072529A1 publication Critical patent/WO2009072529A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)

Abstract

　基板表面に付着した微小パーティクルや有機物の汚染、金属汚染及び有機物と金属による複合汚染の除去性と再付着防止性に優れ、基板表面を腐食することなく、強力な超音波をかけなくても高度に清浄化することができる半導体デバイス用基板洗浄方法を提供する。 　超音波照射基板１cm２あたり０．２W以上１．５W以下の強度の超音波を施しながら、以下の成分（Ａ）～（Ｄ）を含有する洗浄液を用いて半導体デバイス用基板を洗浄する半導体デバイス用の基板の洗浄方法。 （Ａ）過酸化水素　 （Ｂ）アルカリ （Ｃ）水 （Ｄ）下記一般式（１）で表される化合物 　Ｒ１－Ｏ－（－Ｒ２－Ｏ－）ｎ－Ｈ　　（１） （式中、Ｒ１は炭素数１～４のアルキル基を表し、Ｒ２は炭素数２～３のアルキレン基を表し、ｎは１～３の整数を表す。）
PCT/JP2008/071982 2007-12-04 2008-12-03 半導体デバイス用基板の洗浄方法及び洗浄液 WO2009072529A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801188519A CN101884092A (zh) 2007-12-04 2008-12-03 半导体器件用基板的清洗方法及清洗液
US12/746,025 US20100294306A1 (en) 2007-12-04 2008-12-03 Method and solution for cleaning semiconductor device substrate
JP2009507257A JPWO2009072529A1 (ja) 2007-12-04 2008-12-03 半導体デバイス用基板の洗浄方法及び洗浄液

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-313487 2007-12-04
JP2007313487 2007-12-04

Publications (1)

Publication Number Publication Date
WO2009072529A1 true WO2009072529A1 (ja) 2009-06-11

Family

ID=40717708

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071982 WO2009072529A1 (ja) 2007-12-04 2008-12-03 半導体デバイス用基板の洗浄方法及び洗浄液

Country Status (6)

Country Link
US (1) US20100294306A1 (ja)
JP (1) JPWO2009072529A1 (ja)
KR (1) KR20100100841A (ja)
CN (1) CN101884092A (ja)
TW (1) TW200933728A (ja)
WO (1) WO2009072529A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011155407A1 (ja) * 2010-06-07 2013-08-01 セントラル硝子株式会社 保護膜形成用薬液
US9228120B2 (en) 2010-06-07 2016-01-05 Central Glass Company, Limited Liquid chemical for forming protecting film
JPWO2017208767A1 (ja) * 2016-06-03 2019-03-28 富士フイルム株式会社 処理液、基板洗浄方法およびレジストの除去方法

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KR101829399B1 (ko) * 2010-03-04 2018-03-30 삼성전자주식회사 감광성 수지 제거제 조성물 및 이를 이용하는 반도체 제조 공정
US20120009690A1 (en) * 2010-07-12 2012-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. In-situ spectrometry
JP5817139B2 (ja) 2011-02-18 2015-11-18 富士通株式会社 化合物半導体装置の製造方法及び洗浄剤
US20150111134A1 (en) * 2012-03-14 2015-04-23 Hoya Corporation Mask blank and method of manufacturing a transfer mask
US20150079502A1 (en) * 2012-03-14 2015-03-19 Hoya Corporation Mask blank and method of manufacturing a transfer mask
JP6300139B2 (ja) * 2012-05-15 2018-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム
JP6289241B2 (ja) * 2013-06-20 2018-03-07 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
JP6225067B2 (ja) * 2013-06-21 2017-11-01 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6260441B2 (ja) * 2014-04-30 2018-01-17 旭硝子株式会社 樹脂層の除去方法
CN104152296B (zh) * 2014-08-08 2018-04-10 深圳市爱康泉水处理服务有限公司 一种清洗剂用组合物和清洗剂及其应用
CN104194985B (zh) * 2014-08-08 2018-04-10 深圳市爱康泉水处理服务有限公司 一种清洗剂用组合物和清洗剂及其应用
EP3221883A4 (en) * 2014-11-17 2018-07-25 Sage Electrochromics, Inc. Multiple barrier layer encapsulation stack
KR101678072B1 (ko) * 2014-12-04 2016-11-21 주식회사 이엔에프테크놀로지 세정제 조성물
CN104810255A (zh) * 2015-02-28 2015-07-29 株洲南车时代电气股份有限公司 一种用于碳化硅器件表面碳保护膜去除的方法
CN107871651A (zh) * 2016-09-26 2018-04-03 东莞新科技术研究开发有限公司 金属硅化物的清洗方法

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JP2003213463A (ja) * 2002-01-17 2003-07-30 Sumitomo Chem Co Ltd 金属腐食防止剤および洗浄液

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TWI276682B (en) * 2001-11-16 2007-03-21 Mitsubishi Chem Corp Substrate surface cleaning liquid mediums and cleaning method
GB2392917A (en) * 2002-09-10 2004-03-17 Reckitt Benckiser Inc Two-part composition containing hydrogen peroxide
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Patent Citations (1)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011155407A1 (ja) * 2010-06-07 2013-08-01 セントラル硝子株式会社 保護膜形成用薬液
JP5821844B2 (ja) * 2010-06-07 2015-11-24 セントラル硝子株式会社 保護膜形成用薬液
US9228120B2 (en) 2010-06-07 2016-01-05 Central Glass Company, Limited Liquid chemical for forming protecting film
JP2016036038A (ja) * 2010-06-07 2016-03-17 セントラル硝子株式会社 保護膜形成用薬液
US9748092B2 (en) 2010-06-07 2017-08-29 Central Glass Company, Limited Liquid chemical for forming protecting film
JPWO2017208767A1 (ja) * 2016-06-03 2019-03-28 富士フイルム株式会社 処理液、基板洗浄方法およびレジストの除去方法
JP2021052186A (ja) * 2016-06-03 2021-04-01 富士フイルム株式会社 処理液、基板洗浄方法およびレジストの除去方法
US11397383B2 (en) 2016-06-03 2022-07-26 Fujifilm Corporation Treatment liquid, method for washing substrate, and method for removing resist
US11899369B2 (en) 2016-06-03 2024-02-13 Fujifilm Corporation Treatment liquid, method for washing substrate, and method for removing resist

Also Published As

Publication number Publication date
CN101884092A (zh) 2010-11-10
US20100294306A1 (en) 2010-11-25
JPWO2009072529A1 (ja) 2011-04-28
KR20100100841A (ko) 2010-09-15
TW200933728A (en) 2009-08-01

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