JP6223903B2 - カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法 - Google Patents

カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法 Download PDF

Info

Publication number
JP6223903B2
JP6223903B2 JP2014093341A JP2014093341A JP6223903B2 JP 6223903 B2 JP6223903 B2 JP 6223903B2 JP 2014093341 A JP2014093341 A JP 2014093341A JP 2014093341 A JP2014093341 A JP 2014093341A JP 6223903 B2 JP6223903 B2 JP 6223903B2
Authority
JP
Japan
Prior art keywords
carbon nanotube
nanotube sheet
carbon
sheet
constricted portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014093341A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015211180A5 (enExample
JP2015211180A (ja
Inventor
卓也 黒澤
卓也 黒澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014093341A priority Critical patent/JP6223903B2/ja
Priority to US14/689,484 priority patent/US9644128B2/en
Publication of JP2015211180A publication Critical patent/JP2015211180A/ja
Publication of JP2015211180A5 publication Critical patent/JP2015211180A5/ja
Application granted granted Critical
Publication of JP6223903B2 publication Critical patent/JP6223903B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y10S977/742—Carbon nanotubes, CNTs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y10S977/742—Carbon nanotubes, CNTs
    • Y10S977/75—Single-walled

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
JP2014093341A 2014-04-30 2014-04-30 カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法 Active JP6223903B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014093341A JP6223903B2 (ja) 2014-04-30 2014-04-30 カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法
US14/689,484 US9644128B2 (en) 2014-04-30 2015-04-17 Carbon nanotube sheet, electronic device, method of manufacturing carbon nanotube sheet, and method of manufacturing electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014093341A JP6223903B2 (ja) 2014-04-30 2014-04-30 カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法

Publications (3)

Publication Number Publication Date
JP2015211180A JP2015211180A (ja) 2015-11-24
JP2015211180A5 JP2015211180A5 (enExample) 2017-02-02
JP6223903B2 true JP6223903B2 (ja) 2017-11-01

Family

ID=54354786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014093341A Active JP6223903B2 (ja) 2014-04-30 2014-04-30 カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法

Country Status (2)

Country Link
US (1) US9644128B2 (enExample)
JP (1) JP6223903B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法
WO2017155971A1 (en) * 2016-03-07 2017-09-14 Carbice Corporation Phase change material-carbon nanotube-metal substrate composites for thermal storage and control of heat generating devices
KR20190021230A (ko) * 2016-06-28 2019-03-05 니폰 제온 가부시키가이샤 방열 장치
JP6870538B2 (ja) * 2017-08-30 2021-05-12 トヨタ自動車株式会社 放熱シート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238708A (ja) * 2004-02-27 2005-09-08 Mitsubishi Heavy Ind Ltd カーボンナノチューブ強化樹脂構造体およびその製造方法
US20050255304A1 (en) * 2004-05-14 2005-11-17 Damon Brink Aligned nanostructure thermal interface material
CN100404242C (zh) * 2005-04-14 2008-07-23 清华大学 热界面材料及其制造方法
US9487877B2 (en) * 2007-02-01 2016-11-08 Purdue Research Foundation Contact metallization of carbon nanotubes
JP5104688B2 (ja) * 2007-10-22 2012-12-19 富士通株式会社 シート状構造体及びその製造方法並びに電子機器
JP5266491B2 (ja) * 2007-12-25 2013-08-21 ニッタ株式会社 カーボンナノチューブの製造方法
JP5146256B2 (ja) * 2008-03-18 2013-02-20 富士通株式会社 シート状構造体及びその製造方法、並びに電子機器及びその製造方法
JP5239768B2 (ja) * 2008-11-14 2013-07-17 富士通株式会社 放熱材料並びに電子機器及びその製造方法
JP5447069B2 (ja) * 2010-03-24 2014-03-19 富士通株式会社 シート状構造体、電子機器及び電子機器の製造方法
JP5842349B2 (ja) * 2011-03-18 2016-01-13 富士通株式会社 シート状構造体、シート状構造体の製造方法、電子機器及び電子機器の製造方法
JP5788771B2 (ja) * 2011-11-17 2015-10-07 トヨタ自動車株式会社 略垂直配向カーボンナノチューブ付き基材

Also Published As

Publication number Publication date
US9644128B2 (en) 2017-05-09
US20150315451A1 (en) 2015-11-05
JP2015211180A (ja) 2015-11-24

Similar Documents

Publication Publication Date Title
JP5146256B2 (ja) シート状構造体及びその製造方法、並びに電子機器及びその製造方法
CN102792441B (zh) 散热结构及其制造方法
JP6132768B2 (ja) 放熱材料及びその製造方法
JP5104688B2 (ja) シート状構造体及びその製造方法並びに電子機器
JP5276565B2 (ja) 放熱用部品
JP6127417B2 (ja) 放熱材料の製造方法
JP5293561B2 (ja) 熱伝導性シート及び電子機器
CN104810335B (zh) 碳纳米管片以及半导体装置、碳纳米管片的制造方法以及半导体装置的制造方法
JP6283293B2 (ja) カーボンナノチューブシートの製造方法
JP5013116B2 (ja) シート状構造体及びその製造方法並びに電子機器
JP6223903B2 (ja) カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法
JP5343620B2 (ja) 放熱材料及びその製造方法並びに電子機器及びその製造方法
JP6202104B2 (ja) シート状構造体、これを用いた電子機器、シート状構造体の製造方法、及び電子機器の製造方法
JP2011035046A (ja) シート状構造体及びその製造方法
JP5760668B2 (ja) シート状構造体及びその製造方法並びに電子機器及びその製造方法
KR20090040847A (ko) 시트 형상 구조체와 그 제조 방법 및 전자기기
JP5768786B2 (ja) シート状構造体及び電子機器
JP6354235B2 (ja) 電子機器とその組み立て方法、及びシート状構造体とその製造方法
JP5864486B2 (ja) シート状構造体及びその製造方法
JP5935302B2 (ja) シート状構造体及びその製造方法並びに電子機器及びその製造方法
JP2013201261A (ja) 放熱シートおよび半導体装置、放熱シートの製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161214

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170831

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170919

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20171004

R150 Certificate of patent or registration of utility model

Ref document number: 6223903

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150