JP6220632B2 - 基板の接合方法及び封止体の作製方法 - Google Patents

基板の接合方法及び封止体の作製方法 Download PDF

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JP6220632B2
JP6220632B2 JP2013221818A JP2013221818A JP6220632B2 JP 6220632 B2 JP6220632 B2 JP 6220632B2 JP 2013221818 A JP2013221818 A JP 2013221818A JP 2013221818 A JP2013221818 A JP 2013221818A JP 6220632 B2 JP6220632 B2 JP 6220632B2
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glass layer
substrate
light
layer
glass
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JP2013221818A
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Japanese (ja)
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JP2014103109A5 (enExample
JP2014103109A (ja
Inventor
深井　修次
修次 深井
勇介 窪田
勇介 窪田
美佳 軸丸
美佳 軸丸
毅 西
毅 西
下村　明久
明久 下村
庸治 永野
庸治 永野
太紀 中村
太紀 中村
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
JP2013221818A 2012-10-26 2013-10-25 基板の接合方法及び封止体の作製方法 Expired - Fee Related JP6220632B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013221818A JP6220632B2 (ja) 2012-10-26 2013-10-25 基板の接合方法及び封止体の作製方法

Applications Claiming Priority (3)

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JP2012236832 2012-10-26
JP2012236832 2012-10-26
JP2013221818A JP6220632B2 (ja) 2012-10-26 2013-10-25 基板の接合方法及び封止体の作製方法

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JP2014103109A JP2014103109A (ja) 2014-06-05
JP2014103109A5 JP2014103109A5 (enExample) 2016-12-08
JP6220632B2 true JP6220632B2 (ja) 2017-10-25

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JP2013221818A Expired - Fee Related JP6220632B2 (ja) 2012-10-26 2013-10-25 基板の接合方法及び封止体の作製方法

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US (1) US9362522B2 (enExample)
JP (1) JP6220632B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102160829B1 (ko) 2012-11-02 2020-09-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 밀봉체 및 밀봉체의 제작 방법
JP6429465B2 (ja) 2013-03-07 2018-11-28 株式会社半導体エネルギー研究所 装置及びその作製方法
KR102096053B1 (ko) * 2013-07-25 2020-04-02 삼성디스플레이 주식회사 유기발광표시장치의 제조방법
CN104882556B (zh) * 2015-06-08 2017-06-27 京东方科技集团股份有限公司 一种封装件及其封装方法、oled装置
KR101730537B1 (ko) * 2015-11-30 2017-04-26 엘지디스플레이 주식회사 표시장치와 그의 제조방법
CN111862797B (zh) * 2019-04-25 2021-12-14 华为技术有限公司 贴合方法、贴合设备及可读存储介质
CN112420955A (zh) * 2020-11-18 2021-02-26 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置

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US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7078726B2 (en) * 2004-09-09 2006-07-18 Osram Opto Semiconductors Gmbh Sealing of electronic device using absorbing layer for glue line
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KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100787463B1 (ko) 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
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KR100867925B1 (ko) 2007-03-08 2008-11-10 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP2009117500A (ja) * 2007-11-05 2009-05-28 Canon Inc 有機ｅｌ素子
EP2348002A4 (en) * 2008-11-14 2012-04-18 Asahi Glass Co Ltd METHOD FOR PRODUCING A GLASS ELEMENT WITH A SEALING MATERIAL LAYER AND METHOD FOR PRODUCING AN ELECTRONIC DEVICE
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
US8505337B2 (en) * 2009-07-17 2013-08-13 Corning Incorporated Methods for forming fritted cover sheets and glass packages comprising the same
JP2011065895A (ja) 2009-09-17 2011-03-31 Toshiba Corp ガラス封止体、発光装置及びガラス封止体の製造方法
JP2011070797A (ja) 2009-09-24 2011-04-07 Toshiba Corp 封止体の製造方法および有機ｅｌ装置
JP5257314B2 (ja) * 2009-09-29 2013-08-07 大日本印刷株式会社 積層体、準備用支持体、積層体の製造方法、及びデバイスの製造方法
JP6111022B2 (ja) 2011-06-17 2017-04-05 株式会社半導体エネルギー研究所 封止体の作製方法および発光装置の作製方法

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US9362522B2 (en) 2016-06-07
US20140116614A1 (en) 2014-05-01
JP2014103109A (ja) 2014-06-05

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