JP6209043B2 - ゲートバルブおよび基板処理装置 - Google Patents

ゲートバルブおよび基板処理装置 Download PDF

Info

Publication number
JP6209043B2
JP6209043B2 JP2013205210A JP2013205210A JP6209043B2 JP 6209043 B2 JP6209043 B2 JP 6209043B2 JP 2013205210 A JP2013205210 A JP 2013205210A JP 2013205210 A JP2013205210 A JP 2013205210A JP 6209043 B2 JP6209043 B2 JP 6209043B2
Authority
JP
Japan
Prior art keywords
opening
valve body
seal
gate valve
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013205210A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015068468A (ja
Inventor
田中　誠治
誠治 田中
新悟 出口
新悟 出口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2013205210A priority Critical patent/JP6209043B2/ja
Priority to CN201410437458.3A priority patent/CN104514891B/zh
Priority to TW103132796A priority patent/TWI630671B/zh
Priority to KR1020140129214A priority patent/KR101867125B1/ko
Publication of JP2015068468A publication Critical patent/JP2015068468A/ja
Application granted granted Critical
Publication of JP6209043B2 publication Critical patent/JP6209043B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/32—Details
    • F16K1/34—Cutting-off parts, e.g. valve members, seats
    • F16K1/36—Valve members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/32—Details
    • F16K1/34—Cutting-off parts, e.g. valve members, seats
    • F16K1/42—Valve seats
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/32—Details
    • F16K1/34—Cutting-off parts, e.g. valve members, seats
    • F16K1/46—Attachment of sealing rings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/32—Details
    • F16K1/34—Cutting-off parts, e.g. valve members, seats
    • F16K1/46—Attachment of sealing rings
    • F16K1/465—Attachment of sealing rings to the valve seats
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
    • F16K11/04—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only lift valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/04—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with pivoted closure members
    • F16K3/06—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with pivoted closure members in the form of closure plates arranged between supply and discharge passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sliding Valves (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Valves (AREA)
JP2013205210A 2013-09-30 2013-09-30 ゲートバルブおよび基板処理装置 Active JP6209043B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013205210A JP6209043B2 (ja) 2013-09-30 2013-09-30 ゲートバルブおよび基板処理装置
CN201410437458.3A CN104514891B (zh) 2013-09-30 2014-08-29 闸阀和基板处理装置
TW103132796A TWI630671B (zh) 2013-09-30 2014-09-23 Gate valve and substrate processing device
KR1020140129214A KR101867125B1 (ko) 2013-09-30 2014-09-26 게이트 밸브 및 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013205210A JP6209043B2 (ja) 2013-09-30 2013-09-30 ゲートバルブおよび基板処理装置

Publications (2)

Publication Number Publication Date
JP2015068468A JP2015068468A (ja) 2015-04-13
JP6209043B2 true JP6209043B2 (ja) 2017-10-04

Family

ID=52790606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013205210A Active JP6209043B2 (ja) 2013-09-30 2013-09-30 ゲートバルブおよび基板処理装置

Country Status (4)

Country Link
JP (1) JP6209043B2 (zh)
KR (1) KR101867125B1 (zh)
CN (1) CN104514891B (zh)
TW (1) TWI630671B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102174064B1 (ko) * 2013-12-26 2020-11-04 세메스 주식회사 기판 처리 장치
CN107429857B (zh) * 2015-03-27 2019-05-17 Vat控股公司 真空阀
DE102015106916A1 (de) * 2015-05-04 2016-11-10 M. Braun Inertgas-Systeme Gmbh Transferventil
KR102013669B1 (ko) * 2016-11-14 2019-08-26 세메스 주식회사 기판 처리 장치 및 방법
JP6877177B2 (ja) * 2017-02-22 2021-05-26 株式会社アルバック 仕切りバルブ及び真空処理装置
JP6902409B2 (ja) * 2017-06-23 2021-07-14 東京エレクトロン株式会社 プラズマ処理装置
JP6392479B1 (ja) * 2018-04-27 2018-09-19 株式会社ブイテックス 真空バルブ駆動制御方法
CN115136290A (zh) * 2020-03-24 2022-09-30 周星工程股份有限公司 基板处理设备
KR102544775B1 (ko) * 2020-11-05 2023-06-20 주식회사 케이씨텍 기판 처리 장치
WO2024083493A1 (en) * 2022-10-18 2024-04-25 Asml Netherlands B.V. A slit valve assembly for use in a vacuum chamber, for example in a vacuum chamber of a substrate processing system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05196150A (ja) 1991-09-30 1993-08-06 Tokyo Electron Yamanashi Kk ゲートバルブ
CH687986A5 (de) * 1993-05-03 1997-04-15 Balzers Hochvakuum Plasmabehandlungsanlage und Verfahren zu deren Betrieb.
JPH10335297A (ja) * 1997-06-03 1998-12-18 Hitachi Ltd 基板洗浄装置
JP2006005008A (ja) * 2004-06-15 2006-01-05 Matsushita Electric Ind Co Ltd プラズマ処理装置
KR20060083515A (ko) * 2005-01-17 2006-07-21 삼성전자주식회사 슬릿 밸브와 이를 포함하는 반도체 제조 장치
TWI381470B (zh) * 2007-05-08 2013-01-01 Tokyo Electron Ltd And a treatment device provided with the valve
JP2009109006A (ja) * 2007-10-10 2009-05-21 Tokyo Electron Ltd ゲートバルブ及びそれを用いた基板処理装置
WO2009058562A1 (en) * 2007-11-01 2009-05-07 Applied Materials, Inc. Method and apparatus for sealing an opening of a processing chamber
KR101027325B1 (ko) * 2008-11-24 2011-04-06 주식회사 아토 기판처리장치
US8877001B2 (en) * 2009-05-07 2014-11-04 Applied Materials, Inc. Shuttered gate valve
JP5847487B2 (ja) * 2011-08-19 2016-01-20 東京エレクトロン株式会社 弁体、ゲートバルブ、及び基板処理システム
JP6172442B2 (ja) * 2013-04-30 2017-08-02 Smc株式会社 ゲートバルブ

Also Published As

Publication number Publication date
CN104514891A (zh) 2015-04-15
CN104514891B (zh) 2019-04-16
JP2015068468A (ja) 2015-04-13
TWI630671B (zh) 2018-07-21
TW201526140A (zh) 2015-07-01
KR101867125B1 (ko) 2018-06-12
KR20150037590A (ko) 2015-04-08

Similar Documents

Publication Publication Date Title
JP6209043B2 (ja) ゲートバルブおよび基板処理装置
US7637477B2 (en) Gate valve apparatus of vacuum processing system
JP4010314B2 (ja) ゲートバルブ装置、処理システム及びシール部材の交換方法
TW202329241A (zh) 維護裝置
KR100666894B1 (ko) 게이트밸브 및 진공 게이트밸브
TWI523140B (zh) Loading port
TWI629744B (zh) Surrounding gas replacement device, substrate transfer device, substrate transfer system, and EFEM
JP2008297584A (ja) 成膜装置
KR20180006473A (ko) 게이트 밸브 장치 및 플라즈마 처리 장치
US20150098788A1 (en) Substrate transfer chamber and container connecting mechanism
TW201326455A (zh) 光罩儲存與基材承載室及用於操作該光罩儲存與基材承載室之方法
US20090035098A1 (en) Lid opening/closing system for closed container and substrate processing method using same
JP4885023B2 (ja) ロードロック装置および基板の処理システム
KR20070109298A (ko) 반도체 제조 장치 및 이를 이용한 반도체 기판의 이송 방법
JP4403882B2 (ja) 成膜システム
KR20090108998A (ko) 분리형 블레이드 및 이를 포함하는 슬롯밸브
TW201543599A (zh) 立式熱處理裝置
JP5262406B2 (ja) スパッタリング装置及びそのメンテナンス方法
KR20110016639A (ko) 기판처리장치
KR20210022968A (ko) 밸브 장치 및 성막 장치
JP2001077172A (ja) 基板の処理装置、基板の搬送体、並びに電子部品の製造方法
JP3000179B2 (ja) 搬送駆動装置
KR20020072362A (ko) 양산용 다층 박막 제작장치
WO2014034247A1 (ja) ゲートバルブおよび基板処理システム
KR20020077308A (ko) 액정 표시 장치용 기판을 위한 플라즈마 처리 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160729

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170531

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170606

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170725

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170829

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170908

R150 Certificate of patent or registration of utility model

Ref document number: 6209043

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250