JP6180512B2 - 研磨剤粒子を有する印刷による化学機械研磨パッド - Google Patents

研磨剤粒子を有する印刷による化学機械研磨パッド Download PDF

Info

Publication number
JP6180512B2
JP6180512B2 JP2015508994A JP2015508994A JP6180512B2 JP 6180512 B2 JP6180512 B2 JP 6180512B2 JP 2015508994 A JP2015508994 A JP 2015508994A JP 2015508994 A JP2015508994 A JP 2015508994A JP 6180512 B2 JP6180512 B2 JP 6180512B2
Authority
JP
Japan
Prior art keywords
layer
polishing
pad
layers
abrasive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015508994A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015517922A5 (OSRAM
JP2015517922A (ja
Inventor
ラジーブ バジャージ，
ラジーブ バジャージ，
バリー リー チン，
バリー リー チン，
テランス ワイ． リー，
テランス ワイ． リー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2015517922A publication Critical patent/JP2015517922A/ja
Publication of JP2015517922A5 publication Critical patent/JP2015517922A5/ja
Application granted granted Critical
Publication of JP6180512B2 publication Critical patent/JP6180512B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205—Means for applying layers
    • B29C64/209—Heads; Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0002—Condition, form or state of moulded material or of the material to be shaped monomers or prepolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
    • B29K2509/02—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2015508994A 2012-04-25 2013-04-05 研磨剤粒子を有する印刷による化学機械研磨パッド Active JP6180512B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261638461P 2012-04-25 2012-04-25
US61/638,461 2012-04-25
US13/591,051 2012-08-21
US13/591,051 US9067299B2 (en) 2012-04-25 2012-08-21 Printed chemical mechanical polishing pad
PCT/US2013/035513 WO2013162856A1 (en) 2012-04-25 2013-04-05 Printed chemical mechanical polishing pad

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2017116092A Division JP6697419B2 (ja) 2012-04-25 2017-06-13 印刷による化学機械研磨パッド
JP2017116093A Division JP6620125B2 (ja) 2012-04-25 2017-06-13 バッキング層および研磨層を有する印刷による化学機械研磨パッド

Publications (3)

Publication Number Publication Date
JP2015517922A JP2015517922A (ja) 2015-06-25
JP2015517922A5 JP2015517922A5 (OSRAM) 2016-06-02
JP6180512B2 true JP6180512B2 (ja) 2017-08-16

Family

ID=49476099

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2015508994A Active JP6180512B2 (ja) 2012-04-25 2013-04-05 研磨剤粒子を有する印刷による化学機械研磨パッド
JP2017116093A Active JP6620125B2 (ja) 2012-04-25 2017-06-13 バッキング層および研磨層を有する印刷による化学機械研磨パッド
JP2017116092A Active JP6697419B2 (ja) 2012-04-25 2017-06-13 印刷による化学機械研磨パッド
JP2019070349A Active JP6898379B2 (ja) 2012-04-25 2019-04-02 印刷による化学機械研磨パッド

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2017116093A Active JP6620125B2 (ja) 2012-04-25 2017-06-13 バッキング層および研磨層を有する印刷による化学機械研磨パッド
JP2017116092A Active JP6697419B2 (ja) 2012-04-25 2017-06-13 印刷による化学機械研磨パッド
JP2019070349A Active JP6898379B2 (ja) 2012-04-25 2019-04-02 印刷による化学機械研磨パッド

Country Status (8)

Country Link
US (8) US9067299B2 (OSRAM)
EP (2) EP2842157B1 (OSRAM)
JP (4) JP6180512B2 (OSRAM)
KR (6) KR102209101B1 (OSRAM)
CN (2) CN104285281B (OSRAM)
SG (2) SG10201700369XA (OSRAM)
TW (7) TWI823764B (OSRAM)
WO (1) WO2013162856A1 (OSRAM)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
WO2015120430A1 (en) * 2014-02-10 2015-08-13 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
US9738032B2 (en) * 2014-06-06 2017-08-22 Xerox Corporation System for controlling operation of a printer during three-dimensional object printing with reference to a distance from the surface of object
JP6329437B2 (ja) * 2014-06-10 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
CN106536165B (zh) * 2014-07-09 2020-10-13 应用材料公司 增材制造中的层状加热、线状加热、等离子体加热及多重馈给材料
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
WO2016057075A1 (en) * 2014-10-09 2016-04-14 Applied Materials, Inc. Chemical mechanical polishing pad with internal channels
TWI685896B (zh) * 2014-10-09 2020-02-21 美商應用材料股份有限公司 具有內部通道的化學機械研磨墊之製造方法
US10875145B2 (en) * 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
WO2016061585A1 (en) * 2014-10-17 2016-04-21 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10821573B2 (en) * 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875153B2 (en) * 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) * 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) * 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
WO2016130709A1 (en) * 2015-02-10 2016-08-18 Optomec, Inc. Fabrication of three-dimensional structures by in-flight curing of aerosols
JP6046865B1 (ja) * 2015-05-13 2016-12-21 バンドー化学株式会社 研磨パッド及び研磨パッドの製造方法
EP3313617B1 (en) 2015-06-25 2023-06-14 3M Innovative Properties Company Methods of making metal bond abrasive articles and metal bond abrasive articles
US9969049B2 (en) * 2015-06-29 2018-05-15 Iv Technologies Co., Ltd. Polishing layer of polishing pad and method of forming the same and polishing method
EP3362224B1 (en) * 2015-10-16 2024-08-14 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
JP6940495B2 (ja) * 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) * 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
KR20240015161A (ko) * 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
TWI727011B (zh) * 2016-03-09 2021-05-11 美商應用材料股份有限公司 添加劑製造系統、用於添加劑製造系統之電腦程式產品、以及利用添加劑製造系統來製造物體的方法
US12325208B2 (en) 2016-07-22 2025-06-10 Virginia Tech Intellectual Properties, Inc. Corrugated three dimensional (3D) additive manufacturing
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
US20180079153A1 (en) 2016-09-20 2018-03-22 Applied Materials, Inc. Control of dispensing operations for additive manufacturing of a polishing pad
CN106239943B (zh) * 2016-09-26 2018-10-16 华侨大学 一种针对熔融沉积制造fdm成型件的抛光机及其使用方法
TWI647070B (zh) * 2017-02-20 2019-01-11 詠巨科技有限公司 組合式修整器及其製造方法
WO2018160297A1 (en) 2017-02-28 2018-09-07 3M Innovative Properties Company Metal bond abrasive articles and methods of making metal bond abrasive articles
US20180304539A1 (en) * 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11084143B2 (en) 2017-05-25 2021-08-10 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using modified edge
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
DE202018104180U1 (de) 2017-07-20 2018-10-25 DIT Diamanttechnik GmbH & Co. KG Generativ gefertigtes Schleifwerkzeug zur Bearbeitung von Hartstoffen und Composites
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN111448071A (zh) 2017-10-02 2020-07-24 巴斯夫欧洲公司 具有可控机械和化学性能的uv可固化组合物，其制备方法及相关制品
JP2020536768A (ja) * 2017-10-10 2020-12-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造のための選択的な粉末供給
EP3723909B1 (en) 2017-11-13 2023-10-25 Optomec, Inc. Shuttering of aerosol streams
JP2019107839A (ja) * 2017-12-20 2019-07-04 キヤノン株式会社 画像処理装置、画像処理方法及びプログラム
CN108274123B (zh) * 2017-12-28 2020-07-07 北京航空航天大学 一种用于激光增材构件内壁的增材-抛光一体化加工方法
KR20200108098A (ko) 2018-02-05 2020-09-16 어플라이드 머티어리얼스, 인코포레이티드 3d 프린트된 cmp 패드들을 위한 압전 엔드포인팅
KR20200140931A (ko) 2018-05-07 2020-12-16 어플라이드 머티어리얼스, 인코포레이티드 친수성 및 제타 전위 조정가능한 화학적 기계적 연마 패드들
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
JP7177932B6 (ja) * 2018-11-19 2022-12-16 アプライド マテリアルズ インコーポレイテッド ３ｄ印刷のための低粘度ｕｖ硬化性調合物
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
WO2020243196A1 (en) 2019-05-31 2020-12-03 Applied Materials, Inc. Polishing platens and polishing platen manufacturing methods
US11367643B2 (en) * 2019-06-28 2022-06-21 Applied Materials, Inc. Method for substrate registration and anchoring in inkjet printing
KR20220047636A (ko) 2019-08-21 2022-04-18 어플라이드 머티어리얼스, 인코포레이티드 연마 패드들의 적층 제조
US12006442B2 (en) * 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
WO2021076986A1 (en) * 2019-10-16 2021-04-22 Saint-Gobain Abrasives, Inc. Abrasive articles and methods of forming
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN113070810A (zh) * 2020-01-03 2021-07-06 铨科光电材料股份有限公司 晶圆抛光垫
JP7479668B2 (ja) * 2020-01-28 2024-05-09 株式会社東邦鋼機製作所 触媒パッド、その製造方法および製造装置
CN115666852A (zh) * 2020-04-21 2023-01-31 美商智能垫有限责任公司 具有凸出结构的化学机械抛光垫
US11612978B2 (en) 2020-06-09 2023-03-28 Applied Materials, Inc. Additive manufacturing of polishing pads
US11638979B2 (en) 2020-06-09 2023-05-02 Applied Materials, Inc. Additive manufacturing of polishing pads
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022051521A1 (en) 2020-09-03 2022-03-10 Basf Se Reactive polyurethane elastomer
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
EP4301551A4 (en) 2021-03-05 2025-01-08 Saint-Gobain Abrasives, Inc. GRINDING ARTICLES AND METHODS FOR FORMING THEM
TW202247905A (zh) 2021-04-29 2022-12-16 美商阿普托麥克股份有限公司 用於氣溶膠噴射裝置之高可靠性鞘護輸送路徑
US12220784B2 (en) 2021-10-13 2025-02-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US11679531B2 (en) 2021-10-13 2023-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
WO2023107567A1 (en) 2021-12-08 2023-06-15 Basf Se Photocurable resins with high heat deflection temperatures
US12064850B2 (en) 2021-12-30 2024-08-20 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
EP4457058A1 (en) 2021-12-30 2024-11-06 Saint-gobain Abrasives, Inc Abrasive articles and methods for forming same
WO2023145933A1 (ja) 2022-01-31 2023-08-03 株式会社クラレ ３ｄプリンタによる樹脂シートの製造方法、及びそれにより得られた研磨層を有する研磨パッド
US20240227120A1 (en) * 2022-12-22 2024-07-11 Applied Materials, Inc. Uv curable printable formulations for high performance 3d printed cmp pads
US12500094B2 (en) 2023-09-01 2025-12-16 Applied Materials, Inc. Modular fluid delivery assembly
CN118305724B (zh) * 2024-05-15 2025-10-14 安徽禾臣新材料有限公司 一种用于晶体表面抛光的压纹白垫及其生产工艺

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387380A (en) * 1989-12-08 1995-02-07 Massachusetts Institute Of Technology Three-dimensional printing techniques
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5906863A (en) * 1994-08-08 1999-05-25 Lombardi; John Methods for the preparation of reinforced three-dimensional bodies
JPH0950974A (ja) * 1995-08-07 1997-02-18 Sony Corp 研磨布及び半導体装置の製造方法
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6244575B1 (en) * 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same
EP0984846B1 (en) 1997-01-13 2004-11-24 Rodel, Inc. Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern
US5940674A (en) * 1997-04-09 1999-08-17 Massachusetts Institute Of Technology Three-dimensional product manufacture using masks
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
DE19834559A1 (de) * 1998-07-31 2000-02-03 Friedrich Schiller Uni Jena Bu Verfahren zur Herstellung von Werkzeugen für die Bearbeitung von Oberflächen
WO2001064396A1 (en) * 2000-02-28 2001-09-07 Rodel Holdings, Inc. Polishing pad surface texture formed by solid phase droplets
US6569373B2 (en) 2000-03-13 2003-05-27 Object Geometries Ltd. Compositions and methods for use in three dimensional model printing
US7300619B2 (en) 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
WO2001072502A1 (en) * 2000-03-24 2001-10-04 Generis Gmbh Method for manufacturing a structural part by deposition technique
JP4959901B2 (ja) 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
KR100867339B1 (ko) 2000-12-01 2008-11-06 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US20020111707A1 (en) * 2000-12-20 2002-08-15 Zhimin Li Droplet deposition method for rapid formation of 3-D objects from non-cross-linking reactive polymers
GB0103754D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
GB0127252D0 (en) * 2001-11-13 2002-01-02 Vantico Ag Production of composite articles composed of thin layers
DE10224981B4 (de) * 2002-06-05 2004-08-19 Generis Gmbh Verfahren zum schichtweisen Aufbau von Modellen
US20060111807A1 (en) * 2002-09-12 2006-05-25 Hanan Gothait Device, system and method for calibration in three-dimensional model printing
US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
IL156094A0 (en) 2003-05-25 2003-12-23 J G Systems Inc Fixed abrasive cmp pad with built-in additives
US20050012247A1 (en) * 2003-07-18 2005-01-20 Laura Kramer Systems and methods for using multi-part curable materials
US7120512B2 (en) * 2003-08-25 2006-10-10 Hewlett-Packard Development Company, L.P. Method and a system for solid freeform fabricating using non-reactive powder
WO2005021248A1 (ja) * 2003-08-27 2005-03-10 Fuji Photo Film Co., Ltd. 三次元造形物の製造方法
GB0323462D0 (en) * 2003-10-07 2003-11-05 Fujifilm Electronic Imaging Providing a surface layer or structure on a substrate
KR20050038835A (ko) * 2003-10-23 2005-04-29 동부아남반도체 주식회사 패드 그루브 구조
KR100576465B1 (ko) 2003-12-01 2006-05-08 주식회사 하이닉스반도체 연마입자 함침 조성물을 이용한 연마 패드
US7216009B2 (en) 2004-06-14 2007-05-08 Micron Technology, Inc. Machine vision systems for use with programmable material consolidation system and associated methods and structures
JP2006095680A (ja) * 2004-09-14 2006-04-13 Zhiguo Long 切割研磨シートとその製造方法
KR100606457B1 (ko) 2004-11-11 2006-11-23 한국기계연구원 3차원 프린팅 조형시스템
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7524345B2 (en) 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7829000B2 (en) * 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
KR20130109259A (ko) 2005-10-12 2013-10-07 세이가가쿠 고교 가부시키가이샤 점막에 적용하는 작용제 및 그것의 제조 방법
KR100761847B1 (ko) * 2005-12-07 2007-09-28 삼성전자주식회사 연마 입자가 내재된 연마 패드, 이의 제조 방법, 및 이를포함하는 화학적 기계적 연마 장치
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US20070212979A1 (en) 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
US20070235904A1 (en) * 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering
KR100842486B1 (ko) 2006-10-30 2008-07-01 동부일렉트로닉스 주식회사 Ｃｍｐ 장비의 폴리싱패드와 이의 제조장치
US7862320B2 (en) * 2007-07-17 2011-01-04 Seiko Epson Corporation Three-dimensional object forming apparatus and method for forming three dimensional object
WO2009013751A2 (en) * 2007-07-25 2009-01-29 Objet Geometries Ltd. Solid freeform fabrication using a plurality of modeling materials
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
EP2305454B1 (en) * 2008-05-26 2017-03-22 Sony Corporation Shaping apparatus and shaping method
US8282866B2 (en) * 2008-06-30 2012-10-09 Seiko Epson Corporation Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device
KR20100073095A (ko) * 2008-12-22 2010-07-01 주식회사 하이닉스반도체 화학기계적 연마용 연마 패드
WO2010082992A2 (en) * 2009-01-16 2010-07-22 Applied Materials, Inc. Polishing pad and system with window support
JP2012094559A (ja) * 2010-10-22 2012-05-17 Sumco Corp 硬脆性ウェーハの平坦化加工方法および平坦化加工用パッド
US8793522B2 (en) 2011-06-11 2014-07-29 Aliphcom Power management in a data-capable strapband
WO2013128452A1 (en) 2012-03-01 2013-09-06 Stratasys Ltd. Cationic polymerizable compositions and methods of use thereof
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein

Also Published As

Publication number Publication date
US9457520B2 (en) 2016-10-04
EP3961675A1 (en) 2022-03-02
US20220105602A1 (en) 2022-04-07
US20180304534A1 (en) 2018-10-25
JP2017193047A (ja) 2017-10-26
TW202235251A (zh) 2022-09-16
CN107030595B (zh) 2020-06-12
TWI731225B (zh) 2021-06-21
SG11201406448UA (en) 2014-12-30
US10843306B2 (en) 2020-11-24
KR102460581B1 (ko) 2022-10-27
US10029405B2 (en) 2018-07-24
JP6898379B2 (ja) 2021-07-07
US11673225B2 (en) 2023-06-13
KR102209101B1 (ko) 2021-01-27
TW201831271A (zh) 2018-09-01
TW201350265A (zh) 2013-12-16
US20230278159A1 (en) 2023-09-07
US20210069856A1 (en) 2021-03-11
KR20220150418A (ko) 2022-11-10
CN104285281B (zh) 2017-06-30
JP6620125B2 (ja) 2019-12-11
TWI729578B (zh) 2021-06-01
KR20230141957A (ko) 2023-10-10
TW202023797A (zh) 2020-07-01
JP2017205869A (ja) 2017-11-24
JP2019141997A (ja) 2019-08-29
TWI767681B (zh) 2022-06-11
US11207758B2 (en) 2021-12-28
KR20210158884A (ko) 2021-12-31
US20170355140A1 (en) 2017-12-14
US20130283700A1 (en) 2013-10-31
JP6697419B2 (ja) 2020-05-20
WO2013162856A1 (en) 2013-10-31
TW201720584A (zh) 2017-06-16
US9744724B2 (en) 2017-08-29
TW202323015A (zh) 2023-06-16
CN107030595A (zh) 2017-08-11
TWI823764B (zh) 2023-11-21
KR20210013766A (ko) 2021-02-05
KR101975979B1 (ko) 2019-05-07
US20150273770A1 (en) 2015-10-01
US9067299B2 (en) 2015-06-30
TWI574783B (zh) 2017-03-21
US20160347002A1 (en) 2016-12-01
EP2842157A4 (en) 2016-05-04
EP2842157B1 (en) 2021-12-01
TW202140246A (zh) 2021-11-01
KR102585716B1 (ko) 2023-10-05
TWI795287B (zh) 2023-03-01
KR20190045422A (ko) 2019-05-02
KR102344467B1 (ko) 2021-12-27
SG10201700369XA (en) 2017-02-27
TWI620617B (zh) 2018-04-11
KR20150005665A (ko) 2015-01-14
CN104285281A (zh) 2015-01-14
EP2842157A1 (en) 2015-03-04
JP2015517922A (ja) 2015-06-25
US12011801B2 (en) 2024-06-18

Similar Documents

Publication Publication Date Title
US12011801B2 (en) Printing a chemical mechanical polishing pad

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160405

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160405

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170123

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170131

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20170427

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170613

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170627

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170718

R150 Certificate of patent or registration of utility model

Ref document number: 6180512

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250