JP6176294B2 - 支持体付き樹脂シート - Google Patents

支持体付き樹脂シート Download PDF

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Publication number
JP6176294B2
JP6176294B2 JP2015164030A JP2015164030A JP6176294B2 JP 6176294 B2 JP6176294 B2 JP 6176294B2 JP 2015164030 A JP2015164030 A JP 2015164030A JP 2015164030 A JP2015164030 A JP 2015164030A JP 6176294 B2 JP6176294 B2 JP 6176294B2
Authority
JP
Japan
Prior art keywords
resin
support
resin composition
resin sheet
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015164030A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017039305A (ja
Inventor
亮 宮本
亮 宮本
中村　茂雄
茂雄 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2015164030A priority Critical patent/JP6176294B2/ja
Priority to TW105124623A priority patent/TWI707611B/zh
Priority to KR1020160102739A priority patent/KR102511657B1/ko
Priority to CN201610682963.3A priority patent/CN106470524B/zh
Publication of JP2017039305A publication Critical patent/JP2017039305A/ja
Application granted granted Critical
Publication of JP6176294B2 publication Critical patent/JP6176294B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2015164030A 2015-08-21 2015-08-21 支持体付き樹脂シート Active JP6176294B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015164030A JP6176294B2 (ja) 2015-08-21 2015-08-21 支持体付き樹脂シート
TW105124623A TWI707611B (zh) 2015-08-21 2016-08-03 附支撐體之樹脂薄片，及使用其之零件內置電路板之製造方法
KR1020160102739A KR102511657B1 (ko) 2015-08-21 2016-08-12 지지체 부착 수지 시트
CN201610682963.3A CN106470524B (zh) 2015-08-21 2016-08-18 带支撑体的树脂片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015164030A JP6176294B2 (ja) 2015-08-21 2015-08-21 支持体付き樹脂シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017089867A Division JP6610612B2 (ja) 2017-04-28 2017-04-28 支持体付き樹脂シート

Publications (2)

Publication Number Publication Date
JP2017039305A JP2017039305A (ja) 2017-02-23
JP6176294B2 true JP6176294B2 (ja) 2017-08-09

Family

ID=58203754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015164030A Active JP6176294B2 (ja) 2015-08-21 2015-08-21 支持体付き樹脂シート

Country Status (4)

Country Link
JP (1) JP6176294B2 (zh)
KR (1) KR102511657B1 (zh)
CN (1) CN106470524B (zh)
TW (1) TWI707611B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7117681B2 (ja) * 2018-03-30 2022-08-15 日亜化学工業株式会社 発光モジュールの製造方法及び発光モジュール
JP7263701B2 (ja) * 2018-05-31 2023-04-25 味の素株式会社 支持体付き樹脂シート
JP7024672B2 (ja) 2018-09-12 2022-02-24 信越化学工業株式会社 熱硬化性樹脂組成物、熱硬化性樹脂フィルム及び半導体装置
JP7196551B2 (ja) * 2018-11-14 2022-12-27 味の素株式会社 支持体付き樹脂シート及び樹脂組成物層

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100556249C (zh) * 2008-07-30 2009-10-28 惠州中京电子科技有限公司 印刷电路板塞孔工艺
TWI610606B (zh) * 2013-02-21 2018-01-01 味之素股份有限公司 零件內建配線基板之製造方法及半導體裝置
JP6171604B2 (ja) 2013-06-17 2017-08-02 味の素株式会社 部品内蔵回路板の製造方法、および半導体装置
JP2015032648A (ja) * 2013-08-01 2015-02-16 日東電工株式会社 半導体装置の製造方法
TWI674972B (zh) * 2013-08-23 2019-10-21 日商味之素股份有限公司 零件封裝用薄膜之製造方法
JP6350093B2 (ja) * 2013-12-16 2018-07-04 味の素株式会社 部品内蔵基板の製造方法および半導体装置

Also Published As

Publication number Publication date
KR102511657B1 (ko) 2023-03-20
TW201720242A (zh) 2017-06-01
JP2017039305A (ja) 2017-02-23
KR20170022893A (ko) 2017-03-02
CN106470524B (zh) 2020-11-03
CN106470524A (zh) 2017-03-01
TWI707611B (zh) 2020-10-11

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