JP6164908B2 - 液体吐出ヘッドの製造方法 - Google Patents
液体吐出ヘッドの製造方法 Download PDFInfo
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- JP6164908B2 JP6164908B2 JP2013090807A JP2013090807A JP6164908B2 JP 6164908 B2 JP6164908 B2 JP 6164908B2 JP 2013090807 A JP2013090807 A JP 2013090807A JP 2013090807 A JP2013090807 A JP 2013090807A JP 6164908 B2 JP6164908 B2 JP 6164908B2
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- recess
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- dummy
- discharge head
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- 239000007788 liquid Substances 0.000 title claims description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims description 111
- 238000001020 plasma etching Methods 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 description 24
- 150000002500 ions Chemical class 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000007789 gas Substances 0.000 description 7
- 238000003672 processing method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000012495 reaction gas Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920002614 Polyether block amide Polymers 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Physics & Mathematics (AREA)
- Micromachines (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
Description
Claims (7)
- 配列方向に所定の間隔で配列した凹部が形成された基板に対して、前記凹部の底部に反応性イオンエッチングを行い、前記凹部の底部に穴を形成する工程を有する液体吐出ヘッドの製造方法であって、
前記凹部の底部に穴を形成する工程は、前記底部に穴を形成する凹部の配列方向における両隣に前記所定の間隔で凹部が形成されるように、前記底部に穴を形成する凹部の配列方向における少なくとも片隣にダミーとなるダミー凹部を設けた基板を用意し、用意した基板の前記凹部の底部に対して反応性イオンエッチングを行う工程であり、
前記凹部の底部に穴を形成する工程で形成した前記底部に穴を形成した凹部と前記ダミー凹部との間で基板を切断する工程を有し、前記ダミー凹部を有する基板を液体吐出ヘッドの基板として用いず、前記底部に穴を形成する凹部を有する基板を液体吐出ヘッドの基板として用いることを特徴とする液体吐出ヘッドの製造方法。 - 前記ダミー凹部は、前記配列方向に配列した底部に穴を形成する凹部のうち端部の凹部の外側に形成されている請求項1に記載の液体吐出ヘッドの製造方法。
- 前記ダミー凹部は、前記配列方向に配列した底部に穴を形成する凹部を囲むように形成されている請求項1または2に記載の液体吐出ヘッドの製造方法。
- 前記基板はシリコンで形成されたシリコン基板である請求項1乃至3のいずれかに記載の液体吐出ヘッドの製造方法。
- 前記凹部はウェットエッチングで形成されたものである請求項1乃至4のいずれかに記載の液体吐出ヘッドの製造方法。
- 前記穴は前記凹部の底部から前記基板を貫通する穴である請求項1乃至5のいずれかに記載の液体吐出ヘッドの製造方法。
- 前記ダミー凹部の底部には穴を形成しない請求項1乃至6のいずれかに記載の液体吐出ヘッドの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013090807A JP6164908B2 (ja) | 2013-04-23 | 2013-04-23 | 液体吐出ヘッドの製造方法 |
US14/256,743 US9333750B2 (en) | 2013-04-23 | 2014-04-18 | Method of processing substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013090807A JP6164908B2 (ja) | 2013-04-23 | 2013-04-23 | 液体吐出ヘッドの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014213485A JP2014213485A (ja) | 2014-11-17 |
JP6164908B2 true JP6164908B2 (ja) | 2017-07-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013090807A Active JP6164908B2 (ja) | 2013-04-23 | 2013-04-23 | 液体吐出ヘッドの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9333750B2 (ja) |
JP (1) | JP6164908B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10624412B2 (en) | 2016-06-01 | 2020-04-21 | Nike, Inc. | Printing over stitching |
BE1024344B1 (nl) * | 2016-07-04 | 2018-02-02 | PharmaFluidics N.V. | Productie van chemische reactoren |
JP2018013397A (ja) * | 2016-07-20 | 2018-01-25 | 株式会社デンソー | ダイアフラム構造体の製造方法 |
JP7076966B2 (ja) * | 2017-08-09 | 2022-05-30 | キヤノン株式会社 | 基板および半導体デバイスの製造方法 |
JP7195792B2 (ja) * | 2018-07-05 | 2022-12-26 | キヤノン株式会社 | 基板の加工方法、並びに、液体吐出ヘッド用基板およびその製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6317528A (ja) * | 1986-07-09 | 1988-01-25 | Toshiba Corp | 半導体装置の製造方法 |
JP3515830B2 (ja) * | 1994-07-14 | 2004-04-05 | 富士写真フイルム株式会社 | インク噴射記録ヘッドチップの製造方法、インク噴射記録ヘッドの製造方法および記録装置 |
US6375858B1 (en) * | 1997-05-14 | 2002-04-23 | Seiko Epson Corporation | Method of forming nozzle for injection device and method of manufacturing inkjet head |
US6555480B2 (en) | 2001-07-31 | 2003-04-29 | Hewlett-Packard Development Company, L.P. | Substrate with fluidic channel and method of manufacturing |
JP2004042433A (ja) * | 2002-07-11 | 2004-02-12 | Sharp Corp | ノズルプレートの製造方法およびインクジェットヘッド |
JP2005066994A (ja) * | 2003-08-22 | 2005-03-17 | Fuji Xerox Co Ltd | インクジェット記録ヘッド用チップ、このインクジェット記録ヘッド用チップを有するインクジェット記録ヘッド、このインクジェット記録ヘッドを有するインクジェット記録装置、及び、インクジェット記録ヘッド用チップの製造方法 |
JP2005079200A (ja) * | 2003-08-28 | 2005-03-24 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
WO2006046200A1 (en) * | 2004-10-29 | 2006-05-04 | Koninklijke Philips Electronics N.V. | Preparation of dispersions of particles for use as contrast agents in ultrasound imaging |
US20070182777A1 (en) * | 2006-02-08 | 2007-08-09 | Eastman Kodak Company | Printhead and method of forming same |
DE602007004770D1 (de) * | 2006-05-31 | 2010-04-01 | Konica Minolta Holdings Inc | Verfahren zur Herstellung einer Siliciumdüsenplatte und Verfahren zur Herstellung eines Tintenstrahlkopfs |
JP4821466B2 (ja) * | 2006-07-03 | 2011-11-24 | 富士ゼロックス株式会社 | 液滴吐出ヘッド |
JP4905696B2 (ja) * | 2007-04-09 | 2012-03-28 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP5224771B2 (ja) * | 2007-10-16 | 2013-07-03 | キヤノン株式会社 | 記録ヘッド基板の製造方法 |
WO2009134225A1 (en) * | 2008-04-29 | 2009-11-05 | Hewlett-Packard Development Company, L.P. | Printing device |
JP5814654B2 (ja) * | 2010-07-27 | 2015-11-17 | キヤノン株式会社 | シリコン基板の加工方法及び液体吐出ヘッドの製造方法 |
-
2013
- 2013-04-23 JP JP2013090807A patent/JP6164908B2/ja active Active
-
2014
- 2014-04-18 US US14/256,743 patent/US9333750B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20140315335A1 (en) | 2014-10-23 |
JP2014213485A (ja) | 2014-11-17 |
US9333750B2 (en) | 2016-05-10 |
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