JP6161295B2 - 固体撮像装置及びその製造方法 - Google Patents
固体撮像装置及びその製造方法 Download PDFInfo
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- JP6161295B2 JP6161295B2 JP2013005601A JP2013005601A JP6161295B2 JP 6161295 B2 JP6161295 B2 JP 6161295B2 JP 2013005601 A JP2013005601 A JP 2013005601A JP 2013005601 A JP2013005601 A JP 2013005601A JP 6161295 B2 JP6161295 B2 JP 6161295B2
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013005601A JP6161295B2 (ja) | 2013-01-16 | 2013-01-16 | 固体撮像装置及びその製造方法 |
| US14/154,883 US9252183B2 (en) | 2013-01-16 | 2014-01-14 | Solid state image pickup apparatus and method for manufacturing the same |
| CN201410020040.2A CN103928480B (zh) | 2013-01-16 | 2014-01-16 | 固态图像拾取设备及其制造方法 |
| US14/983,062 US9806124B2 (en) | 2013-01-16 | 2015-12-29 | Solid state image pickup apparatus and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013005601A JP6161295B2 (ja) | 2013-01-16 | 2013-01-16 | 固体撮像装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014138066A JP2014138066A (ja) | 2014-07-28 |
| JP2014138066A5 JP2014138066A5 (enExample) | 2016-02-18 |
| JP6161295B2 true JP6161295B2 (ja) | 2017-07-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013005601A Expired - Fee Related JP6161295B2 (ja) | 2013-01-16 | 2013-01-16 | 固体撮像装置及びその製造方法 |
Country Status (1)
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| JP (1) | JP6161295B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018186240A (ja) * | 2017-04-27 | 2018-11-22 | 株式会社東芝 | 半導体装置の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4707218A (en) * | 1986-10-28 | 1987-11-17 | International Business Machines Corporation | Lithographic image size reduction |
| US5143855A (en) * | 1991-06-17 | 1992-09-01 | Eastman Kodak Company | Method for making contact openings in color image sensor passivation layer |
| JP3560990B2 (ja) * | 1993-06-30 | 2004-09-02 | 株式会社東芝 | 固体撮像装置 |
| JP2006351775A (ja) * | 2005-06-15 | 2006-12-28 | Fujifilm Holdings Corp | カラーフィルタの製造方法、固体撮像素子の製造方法およびこれを用いた固体撮像素子 |
| JP4971616B2 (ja) * | 2005-09-27 | 2012-07-11 | キヤノン株式会社 | 撮像装置 |
| JP4550126B2 (ja) * | 2008-04-25 | 2010-09-22 | 東京エレクトロン株式会社 | エッチングマスク形成方法、エッチング方法、および半導体デバイスの製造方法 |
| JP2010085756A (ja) * | 2008-09-30 | 2010-04-15 | Fujifilm Corp | カラーフィルタの製造方法及び固体撮像装置 |
| JP4741015B2 (ja) * | 2009-03-27 | 2011-08-03 | 富士フイルム株式会社 | 撮像素子 |
| JP5430387B2 (ja) * | 2009-12-22 | 2014-02-26 | キヤノン株式会社 | 固体撮像装置及び固体撮像装置の製造方法 |
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- 2013-01-16 JP JP2013005601A patent/JP6161295B2/ja not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2014138066A (ja) | 2014-07-28 |
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