JP6160077B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP6160077B2
JP6160077B2 JP2012281837A JP2012281837A JP6160077B2 JP 6160077 B2 JP6160077 B2 JP 6160077B2 JP 2012281837 A JP2012281837 A JP 2012281837A JP 2012281837 A JP2012281837 A JP 2012281837A JP 6160077 B2 JP6160077 B2 JP 6160077B2
Authority
JP
Japan
Prior art keywords
substrate
vibration
stage
unit
aligner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012281837A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014127532A (ja
JP2014127532A5 (enExample
Inventor
窪田　泰仁
泰仁 窪田
伊藤　真信
真信 伊藤
勤 松崎
勤 松崎
義昭 鬼頭
義昭 鬼頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2012281837A priority Critical patent/JP6160077B2/ja
Publication of JP2014127532A publication Critical patent/JP2014127532A/ja
Publication of JP2014127532A5 publication Critical patent/JP2014127532A5/ja
Application granted granted Critical
Publication of JP6160077B2 publication Critical patent/JP6160077B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012281837A 2012-12-25 2012-12-25 基板処理装置 Active JP6160077B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012281837A JP6160077B2 (ja) 2012-12-25 2012-12-25 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012281837A JP6160077B2 (ja) 2012-12-25 2012-12-25 基板処理装置

Publications (3)

Publication Number Publication Date
JP2014127532A JP2014127532A (ja) 2014-07-07
JP2014127532A5 JP2014127532A5 (enExample) 2016-02-04
JP6160077B2 true JP6160077B2 (ja) 2017-07-12

Family

ID=51406817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012281837A Active JP6160077B2 (ja) 2012-12-25 2012-12-25 基板処理装置

Country Status (1)

Country Link
JP (1) JP6160077B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107134423B (zh) * 2016-02-29 2020-11-20 上海微电子装备（集团）股份有限公司 倒装芯片键合装置及其键合方法
JP7019975B2 (ja) * 2017-06-21 2022-02-16 株式会社ニコン 位置合わせ方法、位置合わせ装置およびプログラム
CN116913855B (zh) 2023-09-08 2023-12-19 广州市艾佛光通科技有限公司 一种芯片键合装置及其固定组件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040057817A1 (en) * 2002-09-24 2004-03-25 Hazelton Andrew J. Switchable damping mechanism for use in a stage apparatus
JP2009231671A (ja) * 2008-03-25 2009-10-08 Nikon Corp アラインメント装置
JP5540605B2 (ja) * 2009-08-28 2014-07-02 株式会社ニコン 位置合わせ装置および基板貼り合わせ装置
JP5845618B2 (ja) * 2011-04-27 2016-01-20 株式会社ニコン 基板貼り合わせ装置、基板貼り合わせ方法および重ね合わせ基板

Also Published As

Publication number Publication date
JP2014127532A (ja) 2014-07-07

Similar Documents

Publication Publication Date Title
JP6112016B2 (ja) 基板ホルダ及び基板貼り合わせ装置
JP5540605B2 (ja) 位置合わせ装置および基板貼り合わせ装置
US9539800B2 (en) Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate
KR102414568B1 (ko) 접합 방법, 접합 장치, 및 유지 부재
JP5434910B2 (ja) 接合装置および接合方法
KR20240154103A (ko) 기판 겹침 장치 및 기판 겹침 방법
JP6160077B2 (ja) 基板処理装置
CN1981370A (zh) 移载装置
JP5845618B2 (ja) 基板貼り合わせ装置、基板貼り合わせ方法および重ね合わせ基板
JP2014127533A (ja) 搬送装置、基板貼り合わせ装置および搬送装置駆動プログラム
JP5754261B2 (ja) 基板貼り合わせ装置、基板貼り合わせ方法および積層半導体装置の製造方法
JP2011192676A (ja) 基板処理装置、積層半導体装置製造方法及び積層半導体装置
JP6135113B2 (ja) 基板貼合装置、基板貼合方法および基板貼合プログラム
JP5428638B2 (ja) ステージ装置、基板貼り合わせ装置、基板貼り合わせ方法、半導体製造方法および基板ホルダ
JP5630020B2 (ja) 基板重ね合わせ装置および重ね合わせ方法
JP5471031B2 (ja) ステージ装置、位置合わせ装置および基板貼り合わせ装置
JP5440106B2 (ja) 基板貼り合せ装置および積層半導体装置の製造方法
JP6268702B2 (ja) 基板処理装置および基板処理方法
JPH03219141A (ja) 能動制振台
JP2011049320A (ja) ステージ支持装置および基板貼り合わせ装置
TW201305042A (zh) 在低壓底材鍵結系統中降低機械性干擾
JP2014126414A (ja) 基板処理装置および基板処理方法
JP5569192B2 (ja) 基板重ね合わせ装置およびデバイスの製造方法
JP6492528B2 (ja) 加熱装置、基板接合装置、加熱方法および積層半導体装置の製造方法
TWI905998B (zh) 振動衰減設備及方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151211

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151211

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161011

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20161013

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161209

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170516

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170529

R150 Certificate of patent or registration of utility model

Ref document number: 6160077

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360