JP6160077B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus.

In manufacturing a semiconductor element, a substrate or the like is aligned with high accuracy using an interferometer (see Patent Document 1).
[Patent Document 1] JP 2010-147253 A

  When a plurality of substrates are overlapped, it is desired to suppress vibration of the interferometer itself.

  In one embodiment of the present invention, a substrate processing apparatus for overlapping a first substrate and a second substrate with each other, the first stage holding the first substrate, the second substrate, A second stage that moves toward the first stage and superimposes the first substrate and the second substrate on each other; an interferometer that is coupled to the first stage and measures the position of the second stage; There is provided a vibration suppression unit that suppresses vibrations generated by the two substrates coming into contact with each other and transmitted toward the interferometer.

  The above summary of the present invention does not enumerate all necessary features of the present invention. A sub-combination of these feature groups can also be an invention.

1 is a schematic plan view of a substrate bonding apparatus 10. FIG. 2 is a perspective view of a substrate 210. FIG. 5 is a perspective view of a substrate holder 220. FIG. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. 2 is a schematic cross-sectional view of an aligner 150. FIG. 2 is a schematic cross-sectional view of an aligner 150. FIG. 2 is a schematic cross-sectional view of an aligner 150. FIG. It is a typical sectional view of other aligner 501. FIG. 10 is a schematic cross-sectional view of another aligner 502. It is a typical sectional view of other aligner 503. It is a typical sectional view of other aligner 504. It is a typical sectional view of other aligner 505. It is a typical sectional view of other aligner 506.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a schematic plan view of the substrate bonding apparatus 10. A stacked substrate 230 is manufactured by bonding the pair of substrates 210 together. Examples of the substrate 210 to be bonded include a silicon wafer, a compound semiconductor wafer, and a glass substrate. Further, the substrate 210 to be bonded may be a substrate having a laminated structure manufactured by bonding.

  The substrate bonding apparatus 10 includes an atmospheric environment unit 100 and a vacuum environment unit 300. The atmospheric environment unit 100 includes transfer robots 130, 160, 180, a pre-aligner 140, an aligner 150, a separation unit 170, and a holder rack 190 housed in the environment chamber 110. Inside the environmental chamber 110, the temperature, humidity, etc. of a clean atmosphere are managed.

  A control unit 112 and a substrate cassette 120 are disposed outside the environmental chamber 110. The control part 112 controls operation | movement of the board | substrate bonding apparatus 10 whole. The substrate cassette 120 accommodates a substrate 210 to be bonded and a laminated substrate 230 manufactured by bonding. The substrate cassette 120 can be removed from the substrate bonding apparatus 10 and used as a container when the substrate 210 or the laminated substrate 230 is transported.

  In the atmospheric environment unit 100, the pre-aligner 140 causes the substrate holder 220 to hold the substrate 210 taken out from the substrate cassette 120. The aligner 150 has a fixed stage 151 and a moving stage 152 that face each other, and aligns and superposes a pair of substrates 210 held by the substrate holder 220. The holder rack 190 accommodates unused substrate holders 220.

  The separation unit 170 separates the laminated substrate 230 manufactured by bonding the substrates 210 from the substrate holder 220. The substrate holder 220 separated from the laminated substrate 230 may be stored in the holder rack 190 and waited, or may be transported to the pre-aligner 140 to hold the next substrate 210.

  Each of the transfer robots 130, 160, and 180 includes fingers 132, 162, and 182 and arms 134, 164, and 184. The fingers 132, 162, and 182 hold at least one of the substrate 210, the substrate holder 220, and the laminated substrate 230. The arms 134, 164, 184 support and move the fingers 132, 162, 182.

  The transfer robot 130 that is disposed in the immediate vicinity of the substrate cassette 120 and is surrounded by the pre-aligner 140, the aligner 150, and the holder rack 190 sequentially carries the substrate holder 220 and the substrate 210 into the pre-aligner 140. Further, the transfer robot 130 carries the substrate holder 220 holding the substrate 210 in the pre-aligner 140 into the aligner 150. Further, the transfer robot 130 carries the laminated substrate 230 separated from the substrate holder 220 in the separation unit 170 into the substrate cassette 120.

  The transfer robot 160 arranged on the opposite side of the transfer robot 130 with respect to the aligner 150 transfers the stack 201 formed by overlapping the substrate holder 220 holding the substrate 210 in the aligner 150 to the vacuum environment unit 300. To do. Further, the transfer robot 160 carries the laminated body 201 processed in the vacuum environment unit 300 to the atmospheric environment unit 100 again.

  The transfer robot 180 arranged along the side of the aligner 150 in the drawing moves the substrate holder 220 and the stacked substrate 230 separated by the separation unit 170 from the stacked body 201 carried out by the transfer robot 160 to the substrate cassette 120 side. Transport toward you.

  The vacuum environment unit 300 in the substrate bonding apparatus 10 includes a load lock 310, a robot chamber 320, a heating and pressing unit 340, and a cooling chamber 360. The load lock 310 allows communication between the inside of the environmental chamber 110 in the atmospheric environment unit 100 and the inside of the robot chamber 320 of the vacuum environment unit 300.

  The load lock 310 has an access door 312 and a gate valve 314 that open and close individually. Therefore, by supplying or exhausting air while both the access door 312 and the gate valve 314 are closed, the interior of the load lock 310 can be made an atmospheric environment or a vacuum environment.

  When the interior of the load lock 310 is in an atmospheric environment, the load lock 310 and the atmospheric environment unit 100 can be communicated with each other by opening the access door 312 with the gate valve 314 closed. As a result, the transfer robot 160 can carry the laminate 201 into or out of the load lock 310 while maintaining the environment of the atmospheric environment unit 100.

  Further, when the inside of the load lock 310 is in a vacuum environment, the load lock 310 can be communicated with the vacuum environment unit 300 by opening the gate valve 314 with the access door 312 closed. Accordingly, the stacked body 201 can be carried into or out of the load lock 310 from the vacuum environment unit 300 side while the environment of the vacuum environment unit 300 is maintained by the transfer robots 330 and 350.

  The robot chamber 320 includes a pair of transfer robots 330 and 350 that are individually controlled. Each of the transfer robots 330 and 350 includes fingers 332 and 352 that hold the stacked body 201, and arms 334 and 354 that support and move the fingers 332 and 352.

  Each of the plurality of heating and pressurizing units 340 and the single cooling chamber 360 includes heat insulating containers 349 and 369 and individually communicates with the robot chamber 320. The heating and pressurizing unit 340 and the cooling chamber 360 and the robot chamber 320 can be hermetically blocked by gate valves 342 and 362 that can be individually opened and closed. Thereby, the heating and pressurizing unit 340 and the cooling chamber 360 can independently maintain individual temperature environments.

  The heating and pressing unit 340 includes a heating unit and a pressing unit, and heats and pressurizes the loaded stacked body 201. As a result, the substrates 210 stacked in the stacked body 201 are bonded together to form a single stacked substrate 230. Note that the heating and pressing unit 340 may have a function of cooling the stacked body 201 after heating and pressing to some extent. Thereby, the temperature change which each arises with the laminated body 201 carried out from the heat pressurization part 340 and the laminated body 201 carried in into the heat pressurization part 340 can be suppressed.

  The cooling chamber 360 cools the temperature of the stacked body 201 carried out from the heating and pressurizing unit 340 to a temperature substantially equal to the environmental temperature of the atmospheric environment unit 100. Thereby, while preventing the increase in the thermal load of the atmospheric environment part 100, the temperature change of the laminated body 201 carried in from the vacuum environment part 300 to the atmospheric environment part 100 can be suppressed.

  In the vacuum environment unit 300, when one of the transfer robots 330 and 350 carries out the stacked body 201 from one of the heating and pressurizing units 340, the other of the transfer robots 330 and 350 heats the other stacked body 201. The pressure part 340 can be immediately carried in. Thereby, the waiting time of the heating and pressing unit 340 can be shortened, and the throughput of the substrate bonding apparatus 10 can be improved.

  FIG. 2 is a conceptual perspective view of a pair of substrates 210 to be bonded together in the substrate bonding apparatus 10. Each of the substrates 210 has a disk shape that is partially cut out by the notch 214. Each of the substrates 210 has a plurality of element regions 216 and a plurality of alignment marks 218.

  The notch 214 is provided as an index indicating the crystal orientation of the substrate 210 and the like. Therefore, the pre-aligner 140 detects the direction of the element region 216 formed in the substrate 210 by detecting the position of the notch 214.

  The element region 216 is periodically arranged on the surface of the substrate 210. A semiconductor device formed by a photolithography technique or the like is mounted on each element region 216. Each element region 216 also includes pads, bumps, and the like that serve as connection terminals when the substrate 210 is bonded to another substrate 210.

  In the substrate 210, there is a blank area where no functional elements such as elements and circuits are arranged between the plurality of element areas 216. A scribe line 212 that is cut when the substrate 210 is cut into the element regions 216 is disposed in the blank region.

  Furthermore, on the scribe line 212, an alignment mark 218 serving as an index when the substrate 210 to be bonded is aligned is disposed. Since the scribe line 212 disappears as a saw margin in the process of cutting the substrate 210 into a die, the effective area of the substrate 210 is not pressed by providing the alignment mark 218.

  Although the element regions 216 and the alignment marks 218 are drawn large in the drawing, the number of element regions 216 formed on the substrate 210 having a diameter of 300 mm, for example, may reach several hundreds or more. In some cases, a wiring pattern or the like formed in the element region 216 is used as the alignment mark 218.

  FIG. 3 is a perspective view of a pair of substrate holders 220 used when a pair of substrates 210 are bonded inside the substrate bonding apparatus 10. The aligner 150 is an example of a substrate processing apparatus.

  The substrate holder 220 is formed of a hard material such as alumina ceramics. Each of the substrate holders 220 has circular holding surfaces 227 and 228 that are in contact with the substrate 210 to be held, and edge portions 221 and 222 that extend radially outward of the holding surfaces 227 and 228.

  In each of the substrate holders 220, electrostatic chucks 225 and 226 that attract the substrate 210 are embedded in the holding surfaces 227 and 228. Thereby, the substrate holder 220 adsorbs and holds the substrate 210, respectively.

  In the set of substrate holders 220, one has a magnet piece 223 disposed on the edge portion 221, and the other has a magnetic piece 224 disposed on the edge portion 222. Accordingly, the pair of substrate holders 220 can autonomously maintain a state of being coupled to each other with the substrate 210 interposed therebetween.

  4, FIG. 5, FIG. 6 and FIG. 7 are diagrams showing the transition of the substrate 210 to the laminated substrate 230 in the substrate bonding apparatus 10 step by step. The operation of the substrate bonding apparatus 10 will be described with reference to these drawings.

  As shown in FIG. 4, each of the substrates 210 to be bonded is mounted on the substrate holder 220 one by one in the pre-aligner 140. At this stage, the substrate 210 is held on the substrate holder 220 by the electrostatic force of the electrostatic chucks 225 and 226.

  The substrate holder 220 holding the substrate 210 in the pre-aligner 140 is carried into the aligner 150 by the transfer robot 130. In the aligner 150, the substrate holder 220 held by the fixed stage 151 and the substrate holder 220 held by the moving stage face each other as shown in FIG. Accordingly, the pair of substrates 210 to be bonded also face each other.

  Subsequently, in the aligner 150, the pair of substrates 210 are aligned and overlapped. Thereby, as shown in FIG. 6, a laminate 201 is formed by the pair of substrates 210 and the pair of substrate holders 220.

  In the stacked body 201, the pair of substrate holders 220 are coupled by the magnet pieces 223 and the magnetic body pieces 224 that are attracted to each other, and maintain the relative position of the pair of stacked substrates 210. However, in the stacked body 201 at the stage of being unloaded from the aligner 150, the pair of substrates 210 is merely overlapped, and is not bonded.

  Such a laminate 201 is heated and pressurized in the heating and pressing unit 340. Thus, the pair of substrates 210 included in the stacked body 201 are bonded to each other to form the stacked substrate 230. As shown in FIG. 7, the substrate 210 that has become the laminated substrate 230 is separated from the substrate holder 220 by the separation unit 170 and stored in the substrate cassette 120.

  In the above example, the substrate holder 220 having the magnet piece 223 is drawn on the upper side, and the substrate holder 220 having the magnetic piece 224 is drawn on the lower side. However, the arrangement of the substrate holder 220 is not limited to this. Further, the member that couples the pair of substrate holders 220 is not limited to the combination of the magnet piece 223 and the magnetic piece 224, and a clip or the like that elastically holds the pair of substrate holders 220 may be used. .

  Further, in the above-described substrate bonding apparatus 10, the laminated substrate 230 is formed by bonding the substrates 210 overlapped in the aligner 150 in the heating and pressing unit 340. However, for example, if the substrate 210 is highly mirror-polished, the laminated substrate 230 can be formed by superposition in the aligner 150 without heating and pressing. Alternatively, the stacked substrate 230 can be formed by bonding the substrates 210 using an adhesive.

  FIG. 8 is a schematic longitudinal sectional view of an aligner 150 included in the substrate bonding apparatus 10. The aligner 150 includes a frame 159, a fixed stage 151, a moving stage 152, and an upper interferometer 258. The frame 159 forms a rectangular parallelepiped space that accommodates other members.

  The fixed stage 151 is fixed downward in the figure with respect to the ceiling surface of the frame body 159 via the load cell 259 and the vibration attenuator 410. A microscope 254 is fixed to the side of the fixed stage 151 downward in the figure.

  The fixed stage 151 has an adsorption device such as an electrostatic chuck or a vacuum chuck, and adsorbs and holds the substrate holder 220 holding the substrate 210. As a result, in the aligner 150, the substrate 210 is held downward on the fixed stage 151.

  The load cell 259 detects the load applied to the substrate 210 held on the fixed stage 151 from below. The microscope 254 observes the alignment mark 218 on the substrate 210 at a position facing the fixed stage 151. The vibration attenuator 410 forms a vibration suppressing unit that attenuates and suppresses vibration generated in the fixed stage 151.

  That is, the vibration attenuator 410 includes a cylinder coupled to one of the frame body 159 and the fixed stage 151, and a piston rod having one end coupled to a piston moving within the cylinder and the other end coupled to the frame body. And have. Since the cylinder is filled with a fluid having viscosity such as silicone oil, when the displacement of the frame body 159 and the fixed stage 151 is caused by vibration, the piston moves while being immersed in the fluid. To do. Thereby, the vibration of the fixed stage 151 with respect to the frame 159 is absorbed by the vibration attenuator 410 and attenuated. Therefore, the vibration generated in the fixed stage 151 is attenuated early. Further, vibration generated in the fixed stage 151 is prevented from being transmitted to the frame body 159.

  Although a single vibration attenuator 410 is illustrated in the drawing, a plurality of vibration attenuators 410 may be provided. Thereby, the vibration attenuator 410 can contribute not only to vibrations in the Z-axis direction of the fixed stage 151 but also to vibrations in other directions, vibrations due to the vibrations, and suppression of propagation thereof.

  The moving stage 152 is supported by a coarse movement unit 251, a fine movement unit 252, and an elevating unit 253 that are sequentially stacked from the bottom surface of the frame 159. The coarse moving unit 251 and the fine moving unit 252 move the moving stage 152 in the X direction and the Y direction indicated by arrows in the drawing, respectively. Thereby, the moving stage 152 can move two-dimensionally in the aligner 150.

  A microscope 255 is fixed upward on the side of the moving stage 152. The microscope 255 can observe the alignment mark 218 on the substrate 210 at a position facing the moving stage 152. A reflecting mirror 256 is also fixed to the side of the moving stage 152. The reflecting mirror 256 reflects the laser beam generated by the upper interferometer 258 and returns it to the upper interferometer 258 again. Thereby, the upper interferometer 258 can detect the position of the moving stage 152 inside the frame 159 with high accuracy.

  The moving stage 152 has a suction device such as an electrostatic chuck or a vacuum chuck, and sucks and holds the substrate holder 220 holding the substrate 210. As a result, in the aligner 150, the substrate 210 is held upward on the moving stage 152.

  In the board | substrate bonding apparatus 10, the control part 112 controls the movement amount of the fine movement part 252 with high precision with reference to the detection result by the upper interferometer 258. FIG. However, the movement speed of fine movement part 252 is lower than the movement speed of coarse movement part 251.

  The moving stage 152 is supported from the elevating unit 253 via a spherical seat. Therefore, the moving stage 152 can be rotated around the X, Y, and Z axes in addition to translational movements in the X, Y, and Z directions indicated by arrows in the drawing.

  FIG. 9 shows a state where the moving stage 152 has moved to a position facing the fixed stage 151 in the aligner 150. That is, in the substrate bonding apparatus 10, the control unit 112 moves the moving stage 152 to a position facing the fixed stage 151 exclusively using the coarse movement unit 251. In addition, the control unit 112 detects misalignment between the substrate 210 held on the fixed stage 151 and the substrate 210 held on the moving stage 152 using the microscopes 254 and 255 in the process of moving the moving stage 152. To do.

  The relative position of the upper microscope 254 with respect to the fixed stage 151 is known in advance and does not change due to the operation of the aligner 150. Therefore, the control unit 112 can detect the relative position between the substrate 210 and the fixed stage 151 by observing the alignment mark 218 of the substrate 210 held on the moving stage 152 with the microscope 254.

  Similarly, the relative position of the lower microscope 255 with respect to the moving stage 152 is known in advance and does not change due to the operation of the aligner 150. Therefore, the control unit 112 can detect the relative position between the substrate 210 and the moving stage 152 by observing the alignment mark 218 of the substrate 210 held on the fixed stage 151 with the microscope 255.

  Furthermore, the control unit 112 can initialize the relative positions of the microscopes 254 and 255 by causing the pair of microscopes 254 and 255 to face each other. Therefore, the control unit 112 can calculate the positional deviation amount of the pair of substrates 210 based on the initialized relative position. Further, the control unit 112 moves the moving stage 152 to compensate for the detected displacement amount, and aligns the substrate 210 held on the fixed stage 151 and the substrate 210 held on the moving stage 152. .

  FIG. 10 is a schematic cross-sectional view of the aligner 150. In the aligner 150, the elevating unit 253 moves the moving stage 152 up and down in the Z direction indicated by an arrow in the drawing. Therefore, when the pair of opposing substrates 210 are aligned, the control unit 112 raises the moving stage 152 by the elevating unit 253 so that the pair of substrates 210 are brought into close contact with each other. In this way, the stacked body 201 is formed by the pair of substrates 210 and the pair of substrate holders 220 sandwiching the substrates.

  Note that the control unit 112 uses the upper interferometer 258 to position the moving stage 152 while the moving stage 152 moves upward toward the fixed stage 151 and until the pair of substrates 210 that are initially in partial contact with each other. Continue to detect. Further, feedback control of the moving stage 152 based on the detected position is continued.

  Next, after releasing the suction of the substrate holder 220 by the fixed stage 151, the control unit 112 lowers the moving stage 152 to separate the stacked body 201 from the fixed stage 151, and unloads it from the aligner 150 by the transfer robot 160. The transported laminate 201 is transported into the load lock 310 by the transport robot 160.

  In the process of superimposing the substrates 210 as described above, the moving stage 152 may move while the substrate 210 held by the fixed stage 151 and the substrate 210 held by the moving stage 152 are in contact with each other. In such a case, the elastic deformation of the load cell 259 is excited by the displacement of the moving stage 152, and the fixed stage 151 is vibrated.

  Even if the rigidity of the frame 159 is increased, the vibration generated in the fixed stage 151 is transmitted to the upper interferometer 258 through the frame 159. When the vibration of the fixed stage 151 is propagated to the upper interferometer 258, the accuracy of the position detection of the moving stage 152 by the upper interferometer 258 decreases. Thereby, since the alignment accuracy of the substrate 210 is lowered, the yield of the multilayer substrate 230 is lowered. Moreover, when waiting for the vibration of the fixed stage 151 to attenuate for the purpose of avoiding the accuracy reduction of the upper interferometer 258, the time required for alignment in the aligner 150 increases, and the throughput of the substrate bonding apparatus 10 decreases.

  In the present embodiment, the aligner 150 includes a vibration attenuator 410 that couples between the fixed stage 151 and the frame body 159. The vibration attenuator 410 absorbs vibration energy by viscous resistance or friction and rapidly attenuates the vibration of the fixed stage 151. Further, the transmission of rolling from the fixed stage 151 to the frame body 159 is suppressed. As a result, vibration generated in the fixed stage 151 is prevented from being transmitted to the upper interferometer 258. As described above, the vibration attenuator 410 forms a damping unit that attenuates the vibration of the fixed stage 151.

  In other words, by coupling the vibration attenuator 410 to the fixed stage 151, it is possible to quickly attenuate the vibration of the fixed stage 151 and to quickly start the alignment of the substrate 210. Thereby, the control part 112 can improve the throughput of the board | substrate bonding apparatus 10. FIG. Further, by providing the vibration attenuator 410 between the fixed stage 151 and the frame body 159, the propagation of vibration can be suppressed, and the lowering of the position detection accuracy by the upper interferometer 258 can be prevented. Thereby, the alignment precision of the board | substrate 210 can be improved and the yield of the board | substrate bonding apparatus 10 can be improved.

  FIG. 11 is a schematic cross-sectional view of an aligner 501 having another structure. The aligner 501 has the same structure as the aligner 150 except for the parts described below. Therefore, common elements are denoted by the same reference numerals, and redundant description is omitted.

  In the aligner 501, the vibration attenuator 410 between the fixed stage 151 and the frame body 159 is omitted. However, the aligner 501 includes a vibration attenuator 420 that couples between the frame body 159 and the upper interferometer 258, and the vibration attenuator 420 forms a vibration suppressing unit.

  Therefore, when the vibration generated in the fixed stage 151 is transmitted to the upper interferometer 258 through the frame 159, the vibration energy is absorbed by the vibration attenuator 420, and the vibration of the upper interferometer 258 is rapidly decelerated. Thereby, since the control part 112 can attenuate | dampen the vibration of the upper interferometer 258 at an early stage and can start the alignment of the board | substrate 210, the throughput of the board | substrate bonding apparatus 10 can be improved.

  As described above, the vibration attenuators 410 and 420 are inserted into the system from the fixed stage 151 that generates vibration to the upper interferometer 258 in which the influence of vibration becomes obvious, and vibration is generated between the fixed stage 151 and the upper interferometer 258. By sandwiching the attenuators 410 and 420, the influence of vibration on the upper interferometer 258 can be suppressed. Thereby, the throughput and yield of the substrate bonding apparatus 10 can be improved.

  FIG. 12 is a schematic cross-sectional view showing the structure of another aligner 502. The aligner 502 has the same structure as the aligner 501 except for the parts described below. Therefore, common elements are denoted by the same reference numerals, and redundant description is omitted.

  The aligner 502 includes a mass damper 430, and the mass damper 430 forms a vibration suppressing unit. The mass damper 430 includes an elastic body 432 and a mass portion 434.

  In the mass damper 430, the rod-like elastic body 432 is arranged vertically in the figure, and the upper end is fixed to the bottom of the upper interferometer 258. Thereby, when the upper interferometer 258 is displaced, the upper end of the elastic body 432 is displaced integrally with the upper interferometer 258.

  The mass portion 434 is coupled to the elastic body 432 at a position away from the upper interferometer 258. When the elastic body 432 is displaced together with the upper interferometer 258 by vibration, the mass unit 434 elastically deforms the elastic body 432 due to inertia and vibrates at a phase different from that of the upper interferometer 258. Therefore, by adjusting the spring constant of the elastic body 432 and the mass of the mass portion 434 in advance, the natural vibration of the system formed by the fixed stage 151, the frame body 159, and the upper interferometer 258 can be rapidly attenuated.

  As a result, the system including the upper interferometer 258 and the system formed by the mass damper 430 are anti-resonant, and the mechanical impedance of the upper interferometer 258 is increased. Therefore, the vibration of the upper interferometer 258 is suppressed, the decrease in the position detection accuracy of the moving stage 152 is suppressed, and this contributes to the improvement of the throughput and yield of the entire substrate bonding apparatus 10.

  Note that the number of mass dampers 430 provided in the aligner 502 is not limited to one. Further, when a plurality of mass dampers 430 are provided on the aligner 502, the weight of the mass portion 434 and the elastic modulus of the elastic body 432 may be different from each other. Thereby, the range of the vibration which can be suppressed can be expanded.

  FIG. 13 is a schematic cross-sectional view showing the structure of another aligner 503. The aligner 503 has the same structure as the aligner 502 described above except for the parts described below. Therefore, common elements are denoted by the same reference numerals, and redundant description is omitted.

  The aligner 503 includes a mass damper 440 disposed on the top surface of the frame body 159, and the mass damper 440 forms a vibration suppressing portion. The mass damper 440 includes an elastic body 442, a mass portion 444, and a stopper 446.

  In the mass damper 440, the mass portion 444 moves smoothly along the upper surface of the frame body 159. The mass portion 444 is sandwiched between at least a pair of elastic bodies 442. The other ends of the elastic bodies 442 are fixed to the frame body 159 by stoppers 446, respectively. Therefore, when the upper part of the frame 159 is displaced horizontally in the figure, the mass part 444 tries to maintain the initial position due to inertia.

  However, since the elastic body 442 is fixed to the frame body 159 by the stopper 446, the other end of the elastic body 442 is displaced together with the frame body 159. For this reason, the mass part 444 is displaced with a phase different from that of the frame body 159. Therefore, the spring constant of the elastic body 442 and the mass of the mass portion 444 can be adjusted in advance to rapidly attenuate the displacement of the frame body 159.

  Thereby, the frame body 159 and the mass part 444 are in an anti-resonance relationship, and the mechanical impedance of the frame body 159 is increased. Therefore, it is suppressed that the vibration generated in the fixed stage 151 vibrates the upper interferometer 258, the decrease in the position detection accuracy of the moving stage 152 is suppressed, and it contributes to the improvement of the throughput and the yield of the entire substrate bonding apparatus 10. To do.

  Note that FIG. 13 shows the mass portion 444 sandwiched between a pair of elastic bodies 442. However, the vibration of the frame 159 can be attenuated in each horizontal direction by arranging the mass portion 444 so that the elastic body 442 urges it from four directions. Furthermore, by supporting the mass portion 444 with an elastic body from above and below in the drawing, the vibration of the frame 159 in the vertical direction in the drawing can also be attenuated.

  Further, the number of mass dampers 440 provided in the aligner 503 is not limited to one. Further, when a plurality of mass dampers 440 are provided on the aligner 503, the weight of the mass portion 444 and the elastic modulus of the elastic body 442 may be different from each other. Thereby, the range of the vibration which can be suppressed can be expanded.

  FIG. 14 is a schematic cross-sectional view of an aligner 504 having another structure. The aligner 504 has the same structure as the aligner 501 except for the parts described below. Common elements are given the same reference numbers and redundant description is omitted.

  The aligner 504 includes an active mass damper 450, and the active mass damper 450 forms a vibration suppressing unit. The active mass damper 450 includes an additional mass unit 451, an actuator 452, a lower interferometer 454, and a reflecting mirror 456. The additional mass unit 451 is disposed at the lower end of the upper interferometer 258 in the drawing via the actuator 452. Accordingly, when the actuator 452 is operated, the additional mass unit 451 is displaced relative to the upper interferometer 258.

  The lower interferometer 454 is fixed to the bottom surface of the frame body 159 and irradiates a laser beam toward the reflecting mirror 456 to detect the displacement of the reflecting mirror 456. The reflecting mirror 456 is integrally attached to the surface of the upper interferometer 258. Thereby, the lower interferometer 454 can detect the displacement of the upper interferometer 258 irrespective of the vibration of the fixed stage 151 and the frame body 159.

  In the substrate bonding apparatus 10 including the aligner 504 as described above, the control unit 112 operates the actuator 452 so as to cancel the displacement of the upper interferometer 258 detected by the lower interferometer 454. Thereby, even if the vibration of the fixed stage 151 propagates to the upper interferometer 258 through the frame body 159, the vibration of the upper interferometer 258 relative to the moving stage 152 can be rapidly attenuated. Therefore, a decrease in position detection accuracy of the moving stage 152 using the upper interferometer 258 is prevented.

  In the above example, the active mass damper 450 acting on the upper interferometer 258 is provided. However, the active mass damper 450 may be provided on either the fixed stage 151 or the frame body 159, and the vibration may be suspended on any path along which the vibration propagates from the fixed stage 151 to the upper interferometer 258. Further, active mass dampers 450 may be individually provided on a plurality or all of the fixed stage 151, the frame body 159, and the upper interferometer 258.

  Furthermore, in the above example, for the purpose of compensating for the vibration of the upper interferometer 258 by the active mass damper 450, the lower interferometer 454 for detecting the displacement of the upper interferometer is provided to attenuate the detected vibration. However, instead of the lower interferometer 454 or in addition to the lower interferometer 454, an interferometer that detects the displacement of the fixed stage 151, the frame body 159, and the like may be provided. Further, the active mass damper 450 may be formed using an acceleration sensor other than the interferometer, or an acceleration sensor may be attached to the upper interferometer 258.

  FIG. 15 is a schematic cross-sectional view showing the structure of another aligner 505. The aligner 505 has the same structure as the aligner 501 except for the parts described below. Therefore, common elements are denoted by the same reference numerals, and redundant description is omitted.

  The aligner 505 includes an additional mass portion 460 and a coupling portion 462, and the additional mass portion 460 and the coupling portion 462 form a vibration suppressing portion. The coupling unit 462 integrally couples the additional mass unit 460 to the upper interferometer 258. When the additional mass unit 460 is coupled to the upper interferometer 258, the additional mass unit 460 increases the inertial mass of the upper interferometer 258 to change the vibration characteristic of the upper interferometer 258.

  Further, by coupling the additional mass unit 460 to the upper interferometer 258 through the coupling unit 462, the relative position of the upper interferometer 258 and the additional mass unit 460 with respect to the frame 159 of the combined center of gravity is changed, The vibration mode of the interferometer 258 can be changed. Thereby, the natural frequency of the vibration system including the upper interferometer 258 can be changed to suppress resonance with respect to vibration transmitted from the outside.

  In this way, by coupling the additional mass unit 460 to the upper interferometer 258, the mechanical impedance of the upper interferometer 258 can be increased, and the vibration of the upper interferometer 258 can be suppressed. Therefore, the throughput and yield of the substrate bonding apparatus 10 can be improved.

  Note that the number of additional mass units 460 to be added is not limited to one. Further, an additional mass unit 460 is disposed in any of the system from the fixed stage 151 that generates vibration to the upper interferometer 258 in which the influence of the vibration becomes obvious, and vibration is generated between the fixed stage 151 and the upper interferometer 258. Can be attenuated.

  In the above example, the additional mass unit 460 is provided in the upper interferometer 258 to increase the mechanical impedance of the upper interferometer. However, an additional mass may be attached to another member, for example, the frame 159 to increase the mechanical impedance of a member that propagates vibration from the fixed stage 151 to the upper interferometer 258. Thereby, the vibration finally transmitted to the upper interferometer 258 is suppressed, and the throughput and yield of the substrate bonding apparatus 10 can be improved.

  FIG. 16 is a schematic cross-sectional view showing the structure of another aligner 506. The aligner 506 has the same structure as the aligner 501 except for the parts described below. Therefore, common elements are denoted by the same reference numerals, and redundant description is omitted.

  The aligner 506 includes a vibration isolation unit 470 disposed between the frame 159 and the upper interferometer 258, and the vibration attenuator 420 forms a vibration suppression unit. In other words, in the aligner 506, the upper interferometer 258 is supported from the frame body 159 via the vibration isolation unit 470.

The vibration isolator 470 has a natural frequency at which the vibration transmissibility is less than 1 with respect to the vibration transmitted from the fixed stage 151 to the frame body 159. Note that the vibration transmissibility _Tr is the force F ₀ transmitted from the frame 159 to the upper interferometer 258 when the vibration isolation unit 470 is not provided, and the upper interferometer 258 when the vibration isolation unit 470 is provided. It means the ratio (F _t / F ₀ ) to the force F _t transmitted to.

For example, considering a vertical one-degree-of-freedom vibration model indicated by an arrow Z in the figure, the vibration transmissibility T _r is calculated by the frequency f of the frame 159 and the natural frequency f _n of the vibration isolation unit 470. Depends on the ratio (f / f _n ). Therefore, the vibration transmissibility _Tr can be made less than 1 by appropriately setting the natural frequency of the vibration isolation unit 470.

  As a result, the vibration generated in the fixed stage 151 and transmitted to the frame 159 is attenuated and transmitted to the upper interferometer 258. Therefore, the measurement accuracy of the upper interferometer 258 is prevented from lowering due to vibration, and the throughput and yield of the substrate bonding apparatus 10 can be improved.

  In the above example, the vibration isolation unit 470 is provided between the frame 159 and the upper interferometer 258. However, the arrangement of the vibration isolation unit 470 is not limited to this. For example, by providing the vibration isolation unit 470 between the fixed stage 151 and the frame body 159, it is possible to suppress the vibration generated in the fixed stage 151 from being transmitted to the upper interferometer 258. In addition, the frame 159 may be cut once between the fixed stage 151 and the upper interferometer 258, and the vibration may be suppressed in the frame 159 by reconnecting the cut portion with the vibration isolator 470 interposed therebetween. it can.

  In the series of forms described above, one type of each of the different types of vibration control units has been described. However, at least two selected from the vibration attenuators 410 and 420, the mass dampers 430 and 440, the active mass damper 450, the additional mass unit 460 and the vibration isolation unit 470 may be combined and mounted on the aligner 150. Furthermore, a plurality of the same types of the vibration attenuators 410 and 420, the mass dampers 430 and 440, the active mass damper 450, the additional mass unit 460, and the vibration isolation unit 470 may be provided.

  Furthermore, a vibration damping unit is also provided for each element other than the upper interferometer 258 and the frame body 159, and the mechanical impedance is increased individually in each part of the aligners 150, 501, 502, 503, 504, 505, and 506. May be. Thereby, each part of the aligners 150, 501, 502, 503, 504, 505, and 506 can suppress the occurrence of vibration, and the propagation of vibration can also be suppressed.

  As described above, by providing vibration suppression units such as the vibration attenuators 410 and 420, the mass dampers 430 and 440, the active mass damper 450, the additional mass unit 460 and the vibration isolation unit 470, vibration generated in the fixed stage 151 is suppressed. Can be attenuated and further prevented from propagating. However, when the control system that controls the movement of the moving stage 152 vibrates or oscillates, even if the vibration of the upper interferometer 258 is suppressed or prevented, the alignment of the substrate 210 cannot be completed. Therefore, when vibration or oscillation of the control system is detected or predicted, it is preferable to stop the alignment of the substrate 210.

  In such a case, the control unit 112 lowers the moving stage 152 by the elevating unit 253, and once separates the substrate 210 held by the moving stage 152 and the substrate 210 held by the fixed stage 151. Then, after the oscillation of the control system is settled, the moving stage 152 may be raised again, and alignment and superposition may be retried. When oscillation occurs, the substrate 210 involved in the bonding may be temporarily stored, and the bonding may be retried in combination with, for example, another substrate holder 220 or another substrate 210.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output of the previous process may be realized in any order unless used in a subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 10 Board | substrate bonding apparatus, 100 Atmosphere environment part, 110 Environmental chamber, 112 Control part, 120 Board cassette, 130, 160, 180, 330, 350 Transfer robot, 132, 162, 182, 332, 352 Finger, 134, 164, 184, 334, 354 Arm, 140 Pre-aligner, 150, 501, 502, 503, 504, 505, 506 Aligner, 151 Fixed stage, 152 Moving stage, 159 Frame body, 170 Separating section, 190 Holder rack, 201 Laminated body, 210 Substrate, 212 scribe line, 214 notch, 216 element region, 218 alignment mark, 220 substrate holder, 221, 222 edge, 223 magnet piece, 224 magnetic body piece, 225, 226 electrostatic chuck, 227, 228 holding surface, 30 Laminated substrate, 251 Coarse moving part, 252 Fine moving part, 253 Lifting part, 254, 255 Microscope, 256 Reflecting mirror, 258 Upper interferometer, 259 Load cell, 300 Vacuum environment part, 310 Load lock, 312 Access door, 314, 342 , 362 Gate valve, 320 Robot chamber, 340 Heating and pressurizing unit, 349, 369 Thermal insulation container, 360 Cooling chamber, 410, 420 Vibration damper, 430, 440 Mass damper, 432, 442 Elastic body, 434, 444 Mass unit, 446 Stopper, 450 Active mass damper, 451, 460 Additional mass part, 452 Actuator, 454 Lower interferometer, 456 Reflector, 462 Coupling part, 470 Vibration isolator

Claims (12)

A substrate processing apparatus for overlapping a first substrate and a second substrate,
A first stage for holding the first substrate;
A frame that supports the first stage;
A second stage for holding the second substrate and moving toward the first stage to superimpose the first substrate and the second substrate;
A measurement unit for measuring the position of the second stage;
A vibration suppression unit that is provided between the first stage and the frame and suppresses vibration of the measurement unit due to contact between the first substrate and the second substrate;
A substrate processing apparatus comprising: A substrate processing apparatus for overlapping a first substrate and a second substrate,
A first stage for holding the first substrate;
A second stage for holding the second substrate and moving toward the first stage to superimpose the first substrate and the second substrate;
A measurement unit for measuring the position of the second stage;
A vibration suppression unit coupled to the measurement unit and configured to suppress vibration of the measurement unit due to contact between the first substrate and the second substrate;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 2 , wherein the vibration suppression unit suppresses the vibration transmitted to the measurement unit. The substrate processing apparatus according to claim 2 , wherein the vibration suppressing unit includes at least one of a mass damper and an active mass damper that attenuates the vibration. 5. The substrate processing apparatus according to claim 2 , wherein the vibration suppression unit includes an additional mass that changes a natural frequency of a vibration system including the measurement unit. A frame for supporting the first stage;
The substrate processing apparatus according to claim 2, wherein the measurement unit is supported by the frame body. A substrate processing apparatus for overlapping a first substrate and a second substrate,
A first stage for holding the first substrate;
A frame that supports the first stage;
A second stage for holding the second substrate and moving toward the first stage to superimpose the first substrate and the second substrate;
A measurement unit for measuring the position of the second stage;
A vibration suppression unit that is provided on an upper surface of the frame body and suppresses vibration of the measurement unit due to contact between the first substrate and the second substrate;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 7, wherein the vibration suppressing unit includes a mass damper that attenuates the vibration. Before Symbol measurement unit, the substrate processing apparatus according to any one of claims 1, 7, 8 which are supported by the frame. The substrate processing apparatus according to claim 1, wherein the vibration suppressing unit suppresses vibration generated in the first stage by the contact from being transmitted to the measuring unit. The vibration suppression unit is disposed in a path through which vibration is transmitted between the first stage and the measurement unit, and includes a vibration suppression unit that attenuates vibration transmitted from the first stage. Substrate processing equipment. The substrate processing apparatus according to claim 1 , wherein the measurement unit is an interferometer that irradiates a length measurement beam to a reflecting mirror provided on the second stage.

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