JP6157061B2 - ガス供給装置及び基板処理装置 - Google Patents
ガス供給装置及び基板処理装置 Download PDFInfo
- Publication number
- JP6157061B2 JP6157061B2 JP2012109798A JP2012109798A JP6157061B2 JP 6157061 B2 JP6157061 B2 JP 6157061B2 JP 2012109798 A JP2012109798 A JP 2012109798A JP 2012109798 A JP2012109798 A JP 2012109798A JP 6157061 B2 JP6157061 B2 JP 6157061B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- gas supply
- processing
- diffusion chamber
- gas diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
Description
W ウエハ
10 基板処理装置
11 チャンバ
13,71,80 シャワーヘッド
28〜31,65,66,81,82 ガス分配板
34 中央ガス拡散室
35 周縁ガス拡散室
36 最外ガス拡散室
39 処理ガス導入系
40 付加ガス導入系
52〜55,67〜70 ガス供給路
Claims (5)
- 処理ガス供給源から処理空間へ処理ガスを供給し、且つ付加ガス供給源から前記処理空間へ付加ガスを供給するガス供給装置であって、
前記処理空間に対向し且つ多数の貫通穴を有する対向板と、複数のガス分配板と、蓋板とを備え、
前記対向板、前記複数のガス分配板、及び蓋板がこの順で積層され、
最も前記対向板寄りの前記ガス分配板における前記対向板側の面には複数のガス拡散室が形成され、
前記ガス分配板の各々には、前記処理ガス供給源から前記複数のガス拡散室の各々へ個別に前記処理ガスを供給するガス供給路、又は、前記付加ガス供給源から前記複数のガス拡散室の各々へ個別に前記付加ガスを供給する他のガス供給路が形成され、
前記処理ガス供給源及び前記複数のガス拡散室の各々は、1つの前記処理ガス供給路のみで接続され、前記付加ガス供給源及び前記複数のガス拡散室の各々は、1つの前記他のガス供給路のみで接続され、
前記ガス分配板の各々において、前記ガス供給路は複数の分岐路に分岐し、前記処理ガス供給源から各前記分岐路の先端までの距離は同一であり、又は、前記他のガス供給路は複数の他の分岐路に分岐し、前記付加ガス供給源から各前記他の分岐路の先端までの距離は同一であることを特徴とするガス供給装置。 - 各前記分岐路のコンダクタンスは同一であり、各前記他の分岐路のコンダクタンスは同一であることを特徴とする請求項1記載のガス供給装置。
- 前記ガス供給装置は前記処理空間を介して円板状の基板に対向し、
前記複数のガス拡散室は複数の溝状空間を含み、
前記複数の溝状空間は前記基板の外縁よりも外側に対向するように形成されることを特徴とする請求項1又は2記載のガス供給装置。 - 前記複数のガス分配板の各々は円板状部材からなり、前記複数のガス拡散室は、前記円板状部材の中心に形成された円板状空間と、該円板状空間と同心に形成された前記複数の溝状空間とからなることを特徴とする請求項1乃至3のいずれか1項に記載のガス供給装置。
- 処理空間へ基板を収容する処理室と、前記基板と対向するように配置されて処理ガス供給源から前記処理空間へ処理ガスを供給し、且つ付加ガス供給源から前記処理空間へ付加ガスを供給するガス供給装置とを備える基板処理装置であって、
前記ガス供給装置は、前記処理空間に対向し且つ多数の貫通穴を有する対向板と、複数のガス分配板と、蓋板とを有し、
前記対向板、前記複数のガス分配板、及び蓋板がこの順で積層され、
最も前記対向板寄りの前記ガス分配板における前記対向板側の面には複数のガス拡散室が形成され、
前記ガス分配板の各々には、前記処理ガス供給源から前記複数のガス拡散室の各々へ個別に前記処理ガスを供給するガス供給路、又は、前記付加ガス供給源から前記複数のガス拡散室の各々へ個別に前記付加ガスを供給する他のガス供給路が形成され、
前記処理ガス供給源及び前記複数のガス拡散室の各々は、1つの前記処理ガス供給路のみで接続され、前記付加ガス供給源及び前記複数のガス拡散室の各々は、1つの前記他のガス供給路のみで接続され、
前記ガス分配板の各々において、前記ガス供給路は複数の分岐路に分岐し、前記処理ガス供給源から各前記分岐路の先端までの距離は同一であり、又は、前記他のガス供給路は複数の他の分岐路に分岐し、前記付加ガス供給源から各前記他の分岐路の先端までの距離は同一であることを特徴とする基板処理装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012109798A JP6157061B2 (ja) | 2012-05-11 | 2012-05-11 | ガス供給装置及び基板処理装置 |
KR1020147028375A KR102070702B1 (ko) | 2012-05-11 | 2013-05-09 | 가스 공급 장치 및 기판 처리 장치 |
PCT/JP2013/063616 WO2013168825A1 (ja) | 2012-05-11 | 2013-05-09 | ガス供給装置及び基板処理装置 |
US14/391,482 US9887108B2 (en) | 2012-05-11 | 2013-05-09 | Gas supply device and substrate processing apparatus |
CN201380019330.9A CN104205309B (zh) | 2012-05-11 | 2013-05-09 | 气体供给装置和基板处理装置 |
TW102116612A TWI611039B (zh) | 2012-05-11 | 2013-05-10 | 氣體供給裝置及基板處理裝置 |
US15/852,194 US10199241B2 (en) | 2012-05-11 | 2017-12-22 | Gas supply device and substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012109798A JP6157061B2 (ja) | 2012-05-11 | 2012-05-11 | ガス供給装置及び基板処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013239482A JP2013239482A (ja) | 2013-11-28 |
JP2013239482A5 JP2013239482A5 (ja) | 2015-06-25 |
JP6157061B2 true JP6157061B2 (ja) | 2017-07-05 |
Family
ID=49550852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012109798A Active JP6157061B2 (ja) | 2012-05-11 | 2012-05-11 | ガス供給装置及び基板処理装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US9887108B2 (ja) |
JP (1) | JP6157061B2 (ja) |
KR (1) | KR102070702B1 (ja) |
CN (1) | CN104205309B (ja) |
TW (1) | TWI611039B (ja) |
WO (1) | WO2013168825A1 (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8562785B2 (en) * | 2011-05-31 | 2013-10-22 | Lam Research Corporation | Gas distribution showerhead for inductively coupled plasma etch reactor |
US9245717B2 (en) | 2011-05-31 | 2016-01-26 | Lam Research Corporation | Gas distribution system for ceramic showerhead of plasma etch reactor |
JP6157061B2 (ja) | 2012-05-11 | 2017-07-05 | 東京エレクトロン株式会社 | ガス供給装置及び基板処理装置 |
JP6007143B2 (ja) * | 2013-03-26 | 2016-10-12 | 東京エレクトロン株式会社 | シャワーヘッド、プラズマ処理装置、及びプラズマ処理方法 |
JP6169040B2 (ja) * | 2014-05-12 | 2017-07-26 | 東京エレクトロン株式会社 | プラズマ処理装置の上部電極構造、プラズマ処理装置、及びプラズマ処理装置の運用方法 |
JP2016225018A (ja) * | 2015-05-27 | 2016-12-28 | 東京エレクトロン株式会社 | ガス処理装置およびそれに用いる多分割シャワーヘッド |
TWI723024B (zh) * | 2015-06-26 | 2021-04-01 | 美商應用材料股份有限公司 | 用於改良的氣體分配的遞迴注入設備 |
US20170002465A1 (en) * | 2015-06-30 | 2017-01-05 | Lam Research Corporation | Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity |
US10415137B2 (en) * | 2016-01-01 | 2019-09-17 | Applied Materials, Inc. | Non-metallic thermal CVD/ALD Gas Injector and Purge Systems |
JP6696322B2 (ja) * | 2016-06-24 | 2020-05-20 | 東京エレクトロン株式会社 | ガス処理装置、ガス処理方法及び記憶媒体 |
CN106498367B (zh) * | 2016-10-21 | 2018-09-14 | 哈尔滨工业大学 | 一种用于化学气相沉积金刚石薄膜的紧凑型真空反应装置 |
JP6851188B2 (ja) * | 2016-11-28 | 2021-03-31 | 東京エレクトロン株式会社 | プラズマ処理装置及びシャワーヘッド |
CN106783500A (zh) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | 镀膜设备 |
KR102493945B1 (ko) | 2017-06-06 | 2023-01-30 | 어플라이드 머티어리얼스, 인코포레이티드 | Teos 유동의 독립적 제어를 통한 증착 반경방향 및 에지 프로파일 튜닝가능성 |
US20190119815A1 (en) * | 2017-10-24 | 2019-04-25 | Applied Materials, Inc. | Systems and processes for plasma filtering |
US10541361B2 (en) | 2017-11-30 | 2020-01-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Magnetic random access memory and manufacturing method thereof |
US10903054B2 (en) | 2017-12-19 | 2021-01-26 | Applied Materials, Inc. | Multi-zone gas distribution systems and methods |
KR102576220B1 (ko) * | 2018-06-22 | 2023-09-07 | 삼성디스플레이 주식회사 | 박막 처리 장치 및 박막 처리 방법 |
KR102641752B1 (ko) * | 2018-11-21 | 2024-03-04 | 삼성전자주식회사 | 가스 주입 모듈, 기판 처리 장치, 및 그를 이용한 반도체 소자의 제조방법 |
US11367594B2 (en) | 2019-11-27 | 2022-06-21 | Applied Materials, Inc. | Multizone flow gasbox for processing chamber |
US20220008946A1 (en) * | 2020-07-10 | 2022-01-13 | Applied Materials, Inc. | Faceplate tensioning method and apparatus to prevent droop |
GB2610156A (en) * | 2021-04-29 | 2023-03-01 | Edwards Ltd | Semiconductor processing system |
CN116130325A (zh) * | 2021-11-12 | 2023-05-16 | 中微半导体设备(上海)股份有限公司 | 安装底座、喷淋头组件、控温方法及等离子体处理装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4537217A (en) * | 1982-12-09 | 1985-08-27 | Research Triangle Institute | Fluid distributor |
JP3380091B2 (ja) * | 1995-06-09 | 2003-02-24 | 株式会社荏原製作所 | 反応ガス噴射ヘッド及び薄膜気相成長装置 |
JPH0945624A (ja) * | 1995-07-27 | 1997-02-14 | Tokyo Electron Ltd | 枚葉式の熱処理装置 |
JP3501930B2 (ja) * | 1997-12-01 | 2004-03-02 | 株式会社ルネサステクノロジ | プラズマ処理方法 |
US6333019B1 (en) * | 1999-04-29 | 2001-12-25 | Marc-Olivier Coppens | Method for operating a chemical and/or physical process by means of a hierarchical fluid injection system |
US20010032814A1 (en) * | 2000-01-27 | 2001-10-25 | Kearney Michael M. | Shallow bed fluid treatment apparatus |
KR100516844B1 (ko) * | 2001-01-22 | 2005-09-26 | 동경 엘렉트론 주식회사 | 처리 장치 및 처리 방법 |
JP4545330B2 (ja) * | 2001-02-22 | 2010-09-15 | イビデン株式会社 | プラズマエッチング装置のガス噴出し板 |
GB0111485D0 (en) * | 2001-05-11 | 2001-07-04 | Amersham Pharm Biotech Ab | Scalable liquid distribution system for large scale chromatography columns |
US6742924B2 (en) * | 2001-05-17 | 2004-06-01 | Amalgamated Research, Inc. | Fractal device for mixing and reactor applications |
FI113527B (fi) * | 2002-12-31 | 2004-05-14 | Raute Oyj | Suutinyksikkö |
US20070299292A1 (en) * | 2006-06-23 | 2007-12-27 | Catalytic Distillation Technologies | Paraffin alkylation |
US20080081114A1 (en) * | 2006-10-03 | 2008-04-03 | Novellus Systems, Inc. | Apparatus and method for delivering uniform fluid flow in a chemical deposition system |
US20080099147A1 (en) * | 2006-10-26 | 2008-05-01 | Nyi Oo Myo | Temperature controlled multi-gas distribution assembly |
JP2008117477A (ja) | 2006-11-06 | 2008-05-22 | Pioneer Electronic Corp | 記録媒体保持装置、および、ディスク装置 |
US7674394B2 (en) | 2007-02-26 | 2010-03-09 | Applied Materials, Inc. | Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution |
ES2331489T3 (es) * | 2007-03-05 | 2010-01-05 | Applied Materials, Inc. | Instalacion de revestimiento y sistema de conduccion de gas. |
JP5192214B2 (ja) | 2007-11-02 | 2013-05-08 | 東京エレクトロン株式会社 | ガス供給装置、基板処理装置および基板処理方法 |
US20090133631A1 (en) * | 2007-11-23 | 2009-05-28 | Applied Materials Inc. | Coating device and method of producing an electrode assembly |
US8512509B2 (en) * | 2007-12-19 | 2013-08-20 | Applied Materials, Inc. | Plasma reactor gas distribution plate with radially distributed path splitting manifold |
US20090159213A1 (en) * | 2007-12-19 | 2009-06-25 | Applied Materials, Inc. | Plasma reactor gas distribution plate having a path splitting manifold immersed within a showerhead |
US20090275206A1 (en) * | 2008-05-05 | 2009-11-05 | Applied Materials, Inc. | Plasma process employing multiple zone gas distribution for improved uniformity of critical dimension bias |
US20110048325A1 (en) * | 2009-03-03 | 2011-03-03 | Sun Hong Choi | Gas Distribution Apparatus and Substrate Processing Apparatus Having the Same |
KR101108879B1 (ko) * | 2009-08-31 | 2012-01-30 | 주식회사 원익아이피에스 | 가스분사장치 및 이를 이용한 기판처리장치 |
US20110308458A1 (en) * | 2010-06-21 | 2011-12-22 | Semes Co., Ltd. | Thin Film Deposition Apparatus |
JP5792563B2 (ja) * | 2011-08-31 | 2015-10-14 | 東京エレクトロン株式会社 | プラズマエッチング方法及びプラズマエッチング装置 |
JP6157061B2 (ja) * | 2012-05-11 | 2017-07-05 | 東京エレクトロン株式会社 | ガス供給装置及び基板処理装置 |
-
2012
- 2012-05-11 JP JP2012109798A patent/JP6157061B2/ja active Active
-
2013
- 2013-05-09 WO PCT/JP2013/063616 patent/WO2013168825A1/ja active Application Filing
- 2013-05-09 CN CN201380019330.9A patent/CN104205309B/zh active Active
- 2013-05-09 KR KR1020147028375A patent/KR102070702B1/ko active IP Right Grant
- 2013-05-09 US US14/391,482 patent/US9887108B2/en active Active
- 2013-05-10 TW TW102116612A patent/TWI611039B/zh active
-
2017
- 2017-12-22 US US15/852,194 patent/US10199241B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2013168825A1 (ja) | 2013-11-14 |
JP2013239482A (ja) | 2013-11-28 |
TW201408812A (zh) | 2014-03-01 |
CN104205309A (zh) | 2014-12-10 |
US9887108B2 (en) | 2018-02-06 |
US20150107772A1 (en) | 2015-04-23 |
TWI611039B (zh) | 2018-01-11 |
US20180190519A1 (en) | 2018-07-05 |
KR20150018773A (ko) | 2015-02-24 |
US10199241B2 (en) | 2019-02-05 |
CN104205309B (zh) | 2016-10-19 |
KR102070702B1 (ko) | 2020-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6157061B2 (ja) | ガス供給装置及び基板処理装置 | |
US11139150B2 (en) | Nozzle for multi-zone gas injection assembly | |
TWI713452B (zh) | 具有更均勻的邊緣清洗的基板支撐件 | |
TWI671792B (zh) | 基板處理設備 | |
JP2020014004A (ja) | ウェハ処理機器の化学制御機構 | |
JP5913312B2 (ja) | 中性/イオンフラックスの制御のための半導体ウエハ処理装置、半導体ウエハ処理システム、及び、ガス分配ユニット | |
CN104838476B (zh) | 用于提供等离子体至处理腔室的装置 | |
TW201411717A (zh) | 用於乾燥電漿蝕刻設備的正比且均勻之控制氣流傳遞 | |
JP4142545B2 (ja) | ガス供給装置 | |
TWI648425B (zh) | 具有內部擴散器和角度注入件的可調諧氣體輸送組件 | |
JP2016063221A5 (ja) | ||
JP2013541177A5 (ja) | 中性/イオンフラックスの制御のための半導体ウエハ処理装置、半導体ウエハ処理システム、及び、ガス分配ユニット | |
JP2013084602A5 (ja) | ||
TWI661462B (zh) | Plasma processing device and gas supply member | |
KR20060059305A (ko) | 반도체 공정 장비 | |
US11944988B2 (en) | Multi-zone showerhead | |
CN110391124A (zh) | 喷淋头和衬底处理设备 | |
JP2023529498A (ja) | 半導体処理ツール用の角度付ガス分配通路を伴うシャワーヘッドフェースプレート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150508 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150508 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160705 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160829 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170123 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170130 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170523 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170606 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6157061 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |