JP6139173B2 - 粘着性組成物、粘着剤および粘着シート - Google Patents
粘着性組成物、粘着剤および粘着シート Download PDFInfo
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- JP6139173B2 JP6139173B2 JP2013034331A JP2013034331A JP6139173B2 JP 6139173 B2 JP6139173 B2 JP 6139173B2 JP 2013034331 A JP2013034331 A JP 2013034331A JP 2013034331 A JP2013034331 A JP 2013034331A JP 6139173 B2 JP6139173 B2 JP 6139173B2
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- Prior art keywords
- pressure
- sensitive adhesive
- meth
- adhesive
- acrylic acid
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims description 79
- 230000001070 adhesive effect Effects 0.000 title claims description 79
- 239000000203 mixture Substances 0.000 title claims description 56
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 139
- 239000003431 cross linking reagent Substances 0.000 claims description 69
- 229920000642 polymer Polymers 0.000 claims description 67
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 60
- 239000010410 layer Substances 0.000 claims description 57
- 150000001875 compounds Chemical class 0.000 claims description 53
- -1 cyclic oligosaccharide Chemical class 0.000 claims description 50
- 239000000178 monomer Substances 0.000 claims description 40
- 125000004122 cyclic group Chemical group 0.000 claims description 34
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 26
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- 239000000463 material Substances 0.000 claims description 12
- 229920001542 oligosaccharide Polymers 0.000 claims description 10
- 229910003437 indium oxide Inorganic materials 0.000 claims description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 5
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
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- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 2
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
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| JP2013034331A JP6139173B2 (ja) | 2013-02-25 | 2013-02-25 | 粘着性組成物、粘着剤および粘着シート |
| KR1020140010045A KR102246029B1 (ko) | 2013-02-25 | 2014-01-28 | 점착성 조성물, 점착제 및 점착시트 |
| TW103104015A TWI634175B (zh) | 2013-02-25 | 2014-02-07 | Adhesive composition, adhesive and adhesive sheet |
| CN201410063576.2A CN104004475B (zh) | 2013-02-25 | 2014-02-25 | 压敏粘合性组合物、压敏粘合剂以及压敏粘合片 |
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| JP2013034331A JP6139173B2 (ja) | 2013-02-25 | 2013-02-25 | 粘着性組成物、粘着剤および粘着シート |
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| JP6606334B2 (ja) * | 2015-02-24 | 2019-11-13 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、粘着シート、粘着剤層付光学部材、および画像表示装置 |
| SG11201707285TA (en) * | 2015-03-12 | 2017-10-30 | Namics Corp | Semiconductor device and image sensor module |
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| JP4515357B2 (ja) * | 2005-01-27 | 2010-07-28 | リンテック株式会社 | 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法 |
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| JP2010138258A (ja) * | 2008-12-10 | 2010-06-24 | Lintec Corp | 粘着剤組成物及び粘着シート |
| JP5420956B2 (ja) * | 2009-03-31 | 2014-02-19 | 株式会社日本触媒 | 電離放射線硬化性再剥離粘着剤組成物 |
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| JP5484104B2 (ja) * | 2010-01-29 | 2014-05-07 | 日本カーバイド工業株式会社 | 粘着剤組成物及び粘着シート |
| JP5484108B2 (ja) | 2010-02-05 | 2014-05-07 | 日本カーバイド工業株式会社 | 粘着剤組成物及び粘着シート |
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