JP6119978B2 - 電子デバイス、集積回路、電子機器及び移動体 - Google Patents

電子デバイス、集積回路、電子機器及び移動体 Download PDF

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Publication number
JP6119978B2
JP6119978B2 JP2013087393A JP2013087393A JP6119978B2 JP 6119978 B2 JP6119978 B2 JP 6119978B2 JP 2013087393 A JP2013087393 A JP 2013087393A JP 2013087393 A JP2013087393 A JP 2013087393A JP 6119978 B2 JP6119978 B2 JP 6119978B2
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Japan
Prior art keywords
terminal
integrated circuit
electrically connected
wiring pattern
electronic device
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JP2013087393A
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English (en)
Japanese (ja)
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JP2014211350A (ja
JP2014211350A5 (enExample
Inventor
典仁 松川
典仁 松川
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Seiko Epson Corp
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Seiko Epson Corp
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Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2013087393A priority Critical patent/JP6119978B2/ja
Priority to US14/255,360 priority patent/US9221673B2/en
Priority to CN201410156081.4A priority patent/CN104111067B/zh
Publication of JP2014211350A publication Critical patent/JP2014211350A/ja
Publication of JP2014211350A5 publication Critical patent/JP2014211350A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00253—Processes for integrating an electronic processing unit with a micromechanical structure not provided for in B81C1/0023 - B81C1/00246
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5769—Manufacturing; Mounting; Housings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Gyroscopes (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Navigation (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
JP2013087393A 2013-04-18 2013-04-18 電子デバイス、集積回路、電子機器及び移動体 Active JP6119978B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013087393A JP6119978B2 (ja) 2013-04-18 2013-04-18 電子デバイス、集積回路、電子機器及び移動体
US14/255,360 US9221673B2 (en) 2013-04-18 2014-04-17 Electronic device, integrated circuit, electronic apparatus, and moving object
CN201410156081.4A CN104111067B (zh) 2013-04-18 2014-04-17 电子装置、集成电路、电子设备及移动体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013087393A JP6119978B2 (ja) 2013-04-18 2013-04-18 電子デバイス、集積回路、電子機器及び移動体

Publications (3)

Publication Number Publication Date
JP2014211350A JP2014211350A (ja) 2014-11-13
JP2014211350A5 JP2014211350A5 (enExample) 2016-05-12
JP6119978B2 true JP6119978B2 (ja) 2017-04-26

Family

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JP2013087393A Active JP6119978B2 (ja) 2013-04-18 2013-04-18 電子デバイス、集積回路、電子機器及び移動体

Country Status (3)

Country Link
US (1) US9221673B2 (enExample)
JP (1) JP6119978B2 (enExample)
CN (1) CN104111067B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869070A (zh) * 2015-06-12 2015-08-26 苏州圣谱拉新材料科技有限公司 一种自动控温路由器
JP6808997B2 (ja) * 2016-06-24 2021-01-06 セイコーエプソン株式会社 信号処理回路、物理量検出装置、姿勢演算装置、電子機器及び移動体
JP2019032222A (ja) * 2017-08-08 2019-02-28 セイコーエプソン株式会社 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器、および移動体
JP7119478B2 (ja) * 2018-03-23 2022-08-17 セイコーエプソン株式会社 回路装置、物理量測定装置、電子機器及び移動体
JP7137380B2 (ja) * 2018-07-09 2022-09-14 株式会社東海理化電機製作所 信号処理装置
CN109560668B (zh) * 2019-01-23 2024-09-24 宁波菲仕技术股份有限公司 一种液冷电机壳体和液冷电机
JP7251385B2 (ja) * 2019-07-30 2023-04-04 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3579878B2 (ja) * 1995-12-07 2004-10-20 Ｎｅｃトーキン株式会社 圧電振動ジャイロ用駆動検出回路
JP2001068553A (ja) 1999-08-31 2001-03-16 Fujitsu Ltd 電子回路
JP2004301786A (ja) 2003-03-31 2004-10-28 Seiko Epson Corp センサ素子パッケージおよび角速度センサ
JP2005012052A (ja) 2003-06-20 2005-01-13 Toshiba Microelectronics Corp 半導体装置
JPWO2005103726A1 (ja) 2004-04-21 2007-08-30 松下電器産業株式会社 角速度センサ及び運送機器
JP2008014724A (ja) * 2006-07-04 2008-01-24 Citizen Holdings Co Ltd 電子回路装置、電子回路を内蔵するパッケージ、および角速度センサ
JP2009087988A (ja) 2007-09-27 2009-04-23 Oki Semiconductor Co Ltd 解析防止回路を具える半導体装置及び解析防止方法
EP2112471A1 (fr) * 2008-04-22 2009-10-28 Microcomponents AG Dispositif de montage pour composant électronique
US20120074818A1 (en) * 2010-07-27 2012-03-29 Sand9, Inc. Systems having integrated mechanical resonating structures and related methods
JP2011174914A (ja) * 2010-01-28 2011-09-08 Seiko Epson Corp 物理量検出素子、物理量検出装置、および電子機器
US8368154B2 (en) * 2010-02-17 2013-02-05 The Regents Of The University Of California Three dimensional folded MEMS technology for multi-axis sensor systems
JP5838689B2 (ja) * 2011-09-26 2016-01-06 セイコーエプソン株式会社 センサー素子、センサー素子の製造方法、センサーデバイスおよび電子機器

Also Published As

Publication number Publication date
JP2014211350A (ja) 2014-11-13
US20140312437A1 (en) 2014-10-23
CN104111067B (zh) 2018-04-20
US9221673B2 (en) 2015-12-29
CN104111067A (zh) 2014-10-22

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