JP6110159B2 - 複合部材及びその製造方法 - Google Patents

複合部材及びその製造方法 Download PDF

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Publication number
JP6110159B2
JP6110159B2 JP2013033473A JP2013033473A JP6110159B2 JP 6110159 B2 JP6110159 B2 JP 6110159B2 JP 2013033473 A JP2013033473 A JP 2013033473A JP 2013033473 A JP2013033473 A JP 2013033473A JP 6110159 B2 JP6110159 B2 JP 6110159B2
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Japan
Prior art keywords
dam
adhesive
composite
joint surface
adhesive layer
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JP2013033473A
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English (en)
Japanese (ja)
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JP2014165267A5 (enExample
JP2014165267A (ja
Inventor
要 三輪
要 三輪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Priority to JP2013033473A priority Critical patent/JP6110159B2/ja
Publication of JP2014165267A publication Critical patent/JP2014165267A/ja
Publication of JP2014165267A5 publication Critical patent/JP2014165267A5/ja
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  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013033473A 2013-02-22 2013-02-22 複合部材及びその製造方法 Active JP6110159B2 (ja)

Priority Applications (1)

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JP2013033473A JP6110159B2 (ja) 2013-02-22 2013-02-22 複合部材及びその製造方法

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JP2013033473A JP6110159B2 (ja) 2013-02-22 2013-02-22 複合部材及びその製造方法

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JP2014165267A JP2014165267A (ja) 2014-09-08
JP2014165267A5 JP2014165267A5 (enExample) 2016-03-03
JP6110159B2 true JP6110159B2 (ja) 2017-04-05

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10688750B2 (en) 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11380572B2 (en) 2019-05-24 2022-07-05 Applied Materials, Inc. Substrate support carrier with improved bond layer protection
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6463938B2 (ja) * 2014-10-08 2019-02-06 日本特殊陶業株式会社 静電チャック
KR102176064B1 (ko) * 2017-11-10 2020-11-09 주식회사 아이앤티 정전척 제조방법 및 정전척
JP7210192B2 (ja) * 2018-08-30 2023-01-23 日本特殊陶業株式会社 保持装置の製造方法
KR20220018053A (ko) * 2019-06-12 2022-02-14 램 리써치 코포레이션 플라즈마 프로세싱 챔버 컴포넌트들을 위한 실란트 (sealant) 코팅
KR102341865B1 (ko) * 2021-05-13 2021-12-21 고광노 수리가 용이한 정전척
KR102418014B1 (ko) * 2021-08-27 2022-07-07 주식회사 동탄이엔지 홀이 구비되는 필름형 본딩층을 포함하는 정전척 및 정전척의 제조 방법
KR102592339B1 (ko) * 2022-08-09 2023-10-23 주식회사 동탄이엔지 다공성 필터가 구비되는 정전척의 제조 방법
KR102914890B1 (ko) * 2024-08-14 2026-01-20 주식회사 예리코코리아 정전척의 본딩 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065047A (ja) * 1996-08-20 1998-03-06 Tokuyama Corp 半導体素子搭載用パッケージの製造方法
JP5143184B2 (ja) * 2010-05-07 2013-02-13 日本碍子株式会社 ウエハー載置装置の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10688750B2 (en) 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
US11192323B2 (en) 2017-10-03 2021-12-07 Applied Materials, Inc. Bonding structure of e chuck to aluminum base configuration
US11794441B2 (en) 2017-10-03 2023-10-24 Applied Materials, Inc. Bonding structure of e chuck to aluminum base configuration
US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
US12537173B2 (en) 2018-06-04 2026-01-27 Applied Materials, Inc. Substrate support pedestal
US11380572B2 (en) 2019-05-24 2022-07-05 Applied Materials, Inc. Substrate support carrier with improved bond layer protection
US11651987B2 (en) 2019-05-24 2023-05-16 Applied Materials, Inc. Substrate support carrier with improved bond layer protection

Also Published As

Publication number Publication date
JP2014165267A (ja) 2014-09-08

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