JP6104613B2 - 発光ランプ - Google Patents

発光ランプ Download PDF

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Publication number
JP6104613B2
JP6104613B2 JP2013007515A JP2013007515A JP6104613B2 JP 6104613 B2 JP6104613 B2 JP 6104613B2 JP 2013007515 A JP2013007515 A JP 2013007515A JP 2013007515 A JP2013007515 A JP 2013007515A JP 6104613 B2 JP6104613 B2 JP 6104613B2
Authority
JP
Japan
Prior art keywords
light
light source
light emitting
surface portion
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013007515A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013219325A (ja
JP2013219325A5 (https=
Inventor
オ・ナムソク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2013219325A publication Critical patent/JP2013219325A/ja
Publication of JP2013219325A5 publication Critical patent/JP2013219325A5/ja
Application granted granted Critical
Publication of JP6104613B2 publication Critical patent/JP6104613B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/281—Materials thereof; Structures thereof; Properties thereof; Coatings thereof
    • F21S43/28135—Structures encapsulating the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0075—Arrangements of multiple light guides
    • G02B6/0078—Side-by-side arrangements, e.g. for large area displays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/25—Preparing the ends of light guides for coupling, e.g. cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2013007515A 2012-04-09 2013-01-18 発光ランプ Active JP6104613B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120036648A KR101871374B1 (ko) 2012-04-09 2012-04-09 발광 램프
KR10-2012-0036648 2012-04-09

Publications (3)

Publication Number Publication Date
JP2013219325A JP2013219325A (ja) 2013-10-24
JP2013219325A5 JP2013219325A5 (https=) 2016-02-25
JP6104613B2 true JP6104613B2 (ja) 2017-03-29

Family

ID=47561052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013007515A Active JP6104613B2 (ja) 2012-04-09 2013-01-18 発光ランプ

Country Status (5)

Country Link
US (2) US9252348B2 (https=)
EP (1) EP2650935B1 (https=)
JP (1) JP6104613B2 (https=)
KR (1) KR101871374B1 (https=)
CN (1) CN103367600B (https=)

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KR101871374B1 (ko) * 2012-04-09 2018-06-27 엘지이노텍 주식회사 발광 램프
KR101944409B1 (ko) * 2012-06-08 2019-04-17 엘지이노텍 주식회사 발광 소자 패키지
JP6275399B2 (ja) * 2012-06-18 2018-02-07 エルジー イノテック カンパニー リミテッド 照明装置
EP3757447B1 (en) * 2012-12-17 2023-07-26 LG Innotek Co., Ltd. Blind spot detection module
US9306138B2 (en) * 2013-04-08 2016-04-05 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting diode packaging structure
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
JP2015092529A (ja) * 2013-10-01 2015-05-14 ソニー株式会社 発光装置、発光ユニット、表示装置、電子機器、および発光素子
KR102125827B1 (ko) * 2013-10-28 2020-06-23 엘지이노텍 주식회사 조명장치 및 이를 포함하는 차량용 램프
DE102013225552A1 (de) * 2013-12-11 2015-06-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9367094B2 (en) 2013-12-17 2016-06-14 Apple Inc. Display module and system applications
JP6106120B2 (ja) * 2014-03-27 2017-03-29 株式会社東芝 半導体発光装置
JP6374723B2 (ja) * 2014-07-25 2018-08-15 スタンレー電気株式会社 半導体発光装置
KR101674124B1 (ko) 2014-09-15 2016-11-09 주식회사 쓰리하이엘렉트로닉스 스마트 면 조명등 제어 시스템
TW201612452A (en) * 2014-09-25 2016-04-01 Hon Hai Prec Ind Co Ltd Lens and light emitting diode module using the same
KR101684004B1 (ko) * 2014-11-25 2016-12-08 현대자동차주식회사 차량용 램프의 광원모듈
KR102397362B1 (ko) * 2015-05-28 2022-05-20 엘지이노텍 주식회사 조명장치 및 이를 포함하는 차량용램프
KR102373025B1 (ko) * 2015-06-12 2022-03-10 엘지전자 주식회사 광원모듈 및 이를 포함하는 면광원 장치
JP7126949B2 (ja) * 2016-05-04 2022-08-29 エルジー イノテック カンパニー リミテッド 照明モジュール及びこれを備える照明装置
KR102084914B1 (ko) 2017-08-28 2020-03-06 현대모비스 주식회사 차량용 램프 모듈
CN109725482B (zh) * 2017-10-31 2021-05-04 中强光电股份有限公司 X型调整模块及使用x型调整模块的合光装置与投影机
US11124110B2 (en) 2018-01-18 2021-09-21 Zkw Group Gmbh Car lamp using semiconductor light emitting device
KR102084703B1 (ko) * 2018-01-18 2020-03-04 제트카베 그룹 게엠베하 반도체 발광 소자를 이용한 차량용 램프
US11054698B2 (en) * 2018-05-31 2021-07-06 Wuhan China Star Optoelectronics Technology Co., Ltd. Backlight module and display device
JP2020047852A (ja) * 2018-09-20 2020-03-26 豊田合成株式会社 発光装置
KR102590830B1 (ko) * 2018-10-11 2023-10-19 주식회사 루멘스 면광원 조명 장치 및 그 제조 방법
JP7257610B2 (ja) * 2019-07-25 2023-04-14 日亜化学工業株式会社 発光モジュール
KR20210117726A (ko) * 2020-03-20 2021-09-29 엘지이노텍 주식회사 조명모듈 및 조명장치
KR102945315B1 (ko) * 2020-08-11 2026-03-30 엘지이노텍 주식회사 조명 장치 및 이를 포함하는 램프
KR20220026684A (ko) * 2020-08-26 2022-03-07 엘지이노텍 주식회사 조명 장치 및 이를 포함하는 램프
CN113552555B (zh) * 2021-07-28 2024-08-13 维沃移动通信有限公司 光发射模组及电子设备

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KR101871374B1 (ko) * 2012-04-09 2018-06-27 엘지이노텍 주식회사 발광 램프
KR101944409B1 (ko) * 2012-06-08 2019-04-17 엘지이노텍 주식회사 발광 소자 패키지

Also Published As

Publication number Publication date
CN103367600A (zh) 2013-10-23
US20160099236A1 (en) 2016-04-07
EP2650935B1 (en) 2019-05-08
JP2013219325A (ja) 2013-10-24
EP2650935A2 (en) 2013-10-16
CN103367600B (zh) 2017-11-14
EP2650935A3 (en) 2015-12-30
US9871022B2 (en) 2018-01-16
US20130264538A1 (en) 2013-10-10
KR101871374B1 (ko) 2018-06-27
US9252348B2 (en) 2016-02-02
KR20130114368A (ko) 2013-10-18

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