JP6100734B2 - アザ−ポリシラン前駆体、及びそれを含む膜の堆積方法 - Google Patents
アザ−ポリシラン前駆体、及びそれを含む膜の堆積方法 Download PDFInfo
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- JP6100734B2 JP6100734B2 JP2014130276A JP2014130276A JP6100734B2 JP 6100734 B2 JP6100734 B2 JP 6100734B2 JP 2014130276 A JP2014130276 A JP 2014130276A JP 2014130276 A JP2014130276 A JP 2014130276A JP 6100734 B2 JP6100734 B2 JP 6100734B2
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- silicon
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- 239000002243 precursor Substances 0.000 title claims description 204
- 238000000034 method Methods 0.000 title claims description 172
- 229920000548 poly(silane) polymer Polymers 0.000 title claims description 163
- 238000000151 deposition Methods 0.000 title claims description 71
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 125
- 229910052710 silicon Inorganic materials 0.000 claims description 125
- 239000010703 silicon Substances 0.000 claims description 124
- 239000000758 substrate Substances 0.000 claims description 94
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 93
- 125000004122 cyclic group Chemical group 0.000 claims description 92
- 238000000231 atomic layer deposition Methods 0.000 claims description 77
- 125000003342 alkenyl group Chemical group 0.000 claims description 73
- 125000003118 aryl group Chemical group 0.000 claims description 68
- 238000010926 purge Methods 0.000 claims description 68
- 229910052739 hydrogen Inorganic materials 0.000 claims description 67
- 125000003282 alkyl amino group Chemical group 0.000 claims description 66
- 239000001257 hydrogen Substances 0.000 claims description 66
- 238000005229 chemical vapour deposition Methods 0.000 claims description 62
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 51
- 229910052760 oxygen Inorganic materials 0.000 claims description 51
- 239000001301 oxygen Substances 0.000 claims description 51
- 229910052757 nitrogen Inorganic materials 0.000 claims description 50
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 49
- 125000004663 dialkyl amino group Chemical group 0.000 claims description 48
- 150000002431 hydrogen Chemical class 0.000 claims description 48
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 46
- 239000000203 mixture Substances 0.000 claims description 45
- 229910007991 Si-N Inorganic materials 0.000 claims description 43
- 229910006294 Si—N Inorganic materials 0.000 claims description 43
- 229910008045 Si-Si Inorganic materials 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 42
- 229910006411 Si—Si Inorganic materials 0.000 claims description 42
- 125000005343 heterocyclic alkyl group Chemical group 0.000 claims description 41
- 238000006243 chemical reaction Methods 0.000 claims description 40
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 39
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 38
- 238000009835 boiling Methods 0.000 claims description 36
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 35
- 239000007789 gas Substances 0.000 claims description 33
- 239000002904 solvent Substances 0.000 claims description 32
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical group N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 30
- 230000008021 deposition Effects 0.000 claims description 30
- -1 4-methylpyridin-3-yl Chemical group 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 27
- 125000000623 heterocyclic group Chemical group 0.000 claims description 23
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 22
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 21
- 229910052786 argon Inorganic materials 0.000 claims description 19
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 18
- FNWRCEFYBOGJJV-UHFFFAOYSA-N N,N-bis(disilanyl)-2-methylpropan-2-amine Chemical compound CC(C)(C)N([SiH2][SiH3])[SiH2][SiH3] FNWRCEFYBOGJJV-UHFFFAOYSA-N 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 17
- 125000005865 C2-C10alkynyl group Chemical group 0.000 claims description 16
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 16
- 229910021529 ammonia Inorganic materials 0.000 claims description 15
- 239000003638 chemical reducing agent Substances 0.000 claims description 15
- 229910052734 helium Inorganic materials 0.000 claims description 15
- 239000001307 helium Substances 0.000 claims description 15
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 15
- 229910000077 silane Inorganic materials 0.000 claims description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- 238000007740 vapor deposition Methods 0.000 claims description 12
- DBJQBJUBCJFNOT-UHFFFAOYSA-N 2-(disilanylamino)silylsilyl-1,3-dimethylcyclohexane Chemical compound CC1C(C(CCC1)C)[SiH2][SiH2]N[SiH2][SiH3] DBJQBJUBCJFNOT-UHFFFAOYSA-N 0.000 claims description 11
- BPXOFTHLRDTKHM-UHFFFAOYSA-N N,N-bis(disilanyl)-2,3-dimethylaniline Chemical compound CC1=C(C=CC=C1N([SiH2][SiH3])[SiH2][SiH3])C BPXOFTHLRDTKHM-UHFFFAOYSA-N 0.000 claims description 11
- TVMPPUOMOMSIDS-UHFFFAOYSA-N N,N-bis(disilanyl)aniline Chemical compound [SiH3][SiH2]N([SiH2][SiH3])c1ccccc1 TVMPPUOMOMSIDS-UHFFFAOYSA-N 0.000 claims description 11
- OGVDBOSYGRUKRF-UHFFFAOYSA-N N,N-bis(disilanyl)cyclohexanamine Chemical compound [SiH3][SiH2]N([SiH2][SiH3])C1CCCCC1 OGVDBOSYGRUKRF-UHFFFAOYSA-N 0.000 claims description 11
- JIIJFFQJGJYJCN-UHFFFAOYSA-N N,N-bis(disilanyl)propan-2-amine Chemical compound CC(C)N([SiH2][SiH3])[SiH2][SiH3] JIIJFFQJGJYJCN-UHFFFAOYSA-N 0.000 claims description 11
- UHCWWTXIVIANBV-UHFFFAOYSA-N C1(CCCC1)N1[SiH2][SiH2]N([SiH2][SiH2]1)C1CCCC1 Chemical compound C1(CCCC1)N1[SiH2][SiH2]N([SiH2][SiH2]1)C1CCCC1 UHCWWTXIVIANBV-UHFFFAOYSA-N 0.000 claims description 10
- BDBLHKCYEVGQEG-UHFFFAOYSA-N N,N-bis(disilanyl)-2-methylbutan-2-amine Chemical compound CCC(C)(C)N([SiH2][SiH3])[SiH2][SiH3] BDBLHKCYEVGQEG-UHFFFAOYSA-N 0.000 claims description 10
- VEGKVMDRRJIFQB-UHFFFAOYSA-N N,N-bis(disilanyl)cyclopentanamine Chemical compound [SiH3][SiH2]N([SiH2][SiH3])C1CCCC1 VEGKVMDRRJIFQB-UHFFFAOYSA-N 0.000 claims description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 10
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 10
- 239000011261 inert gas Substances 0.000 claims description 10
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 9
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 150000002170 ethers Chemical class 0.000 claims description 6
- 229930195733 hydrocarbon Natural products 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 5
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 5
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 5
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 5
- 150000003512 tertiary amines Chemical class 0.000 claims description 5
- 125000001302 tertiary amino group Chemical group 0.000 claims description 5
- DBUXPGAFNATARM-UHFFFAOYSA-N 1,4-bis(2,6-dimethylcyclohexyl)-1,4,2,3,5,6-diazatetrasilinane Chemical compound CC1CCCC(C)C1N1[SiH2][SiH2]N([SiH2][SiH2]1)C1C(C)CCCC1C DBUXPGAFNATARM-UHFFFAOYSA-N 0.000 claims description 4
- OJYQIDAQKPFTFE-UHFFFAOYSA-N N,N-bis(disilanyl)oxan-4-amine Chemical compound [SiH3][SiH2]N([SiH2][SiH3])C1CCOCC1 OJYQIDAQKPFTFE-UHFFFAOYSA-N 0.000 claims description 4
- 125000004484 1-methylpiperidin-4-yl group Chemical group CN1CCC(CC1)* 0.000 claims description 3
- LXNBHPJQBOGRJB-UHFFFAOYSA-N N1=CC(=CC=C1)N([SiH2][SiH3])[SiH2][SiH3].CC1=C(C(=CC=C1N([SiH2][SiH3])[SiH2][SiH3])C)C Chemical compound N1=CC(=CC=C1)N([SiH2][SiH3])[SiH2][SiH3].CC1=C(C(=CC=C1N([SiH2][SiH3])[SiH2][SiH3])C)C LXNBHPJQBOGRJB-UHFFFAOYSA-N 0.000 claims description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 3
- 239000010408 film Substances 0.000 description 181
- 125000000304 alkynyl group Chemical group 0.000 description 34
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 18
- 125000000217 alkyl group Chemical group 0.000 description 16
- 239000006227 byproduct Substances 0.000 description 14
- KJMDEYNABZMYLN-UHFFFAOYSA-N 1,4-ditert-butyl-1,4,2,3,5,6-diazatetrasilinane Chemical compound CC(C)(C)N1[SiH2][SiH2]N([SiH2][SiH2]1)C(C)(C)C KJMDEYNABZMYLN-UHFFFAOYSA-N 0.000 description 13
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 10
- YPGHHXPLBYESSO-UHFFFAOYSA-N 1,4-bis(2-methylbutan-2-yl)-1,4,2,3,5,6-diazatetrasilinane Chemical compound CCC(C)(C)N1[SiH2][SiH2]N([SiH2][SiH2]1)C(C)(C)CC YPGHHXPLBYESSO-UHFFFAOYSA-N 0.000 description 9
- ANGBHUKKJTZUNP-UHFFFAOYSA-N 1,4-dicyclohexyl-1,4,2,3,5,6-diazatetrasilinane Chemical compound C1CCC(CC1)N1[SiH2][SiH2]N([SiH2][SiH2]1)C1CCCCC1 ANGBHUKKJTZUNP-UHFFFAOYSA-N 0.000 description 9
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 9
- TUWXMWWNQNOSKW-UHFFFAOYSA-N N,N-bis(disilanyl)-2,3,4-trimethylaniline Chemical compound CC1=C(C(=CC=C1N([SiH2][SiH3])[SiH2][SiH3])C)C TUWXMWWNQNOSKW-UHFFFAOYSA-N 0.000 description 8
- 239000003153 chemical reaction reagent Substances 0.000 description 8
- 239000003446 ligand Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 125000000172 C5-C10 aryl group Chemical group 0.000 description 7
- QHBRDCYZMTVRMX-UHFFFAOYSA-N CC1=NC=CC=C1N([SiH2][SiH3])[SiH2][SiH3] Chemical compound CC1=NC=CC=C1N([SiH2][SiH3])[SiH2][SiH3] QHBRDCYZMTVRMX-UHFFFAOYSA-N 0.000 description 7
- OIZUKNNNUUUVOB-UHFFFAOYSA-N N,N-bis(disilanyl)-1-methylpiperidin-4-amine N,N-bis(disilanyl)oxan-4-amine Chemical compound CN1CCC(CC1)N([SiH2][SiH3])[SiH2][SiH3].O1CCC(CC1)N([SiH2][SiH3])[SiH2][SiH3] OIZUKNNNUUUVOB-UHFFFAOYSA-N 0.000 description 7
- WYNLWAMAAYCASV-UHFFFAOYSA-N [SiH3][SiH2]N([SiH2][SiH3])c1cccnc1 Chemical compound [SiH3][SiH2]N([SiH2][SiH3])c1cccnc1 WYNLWAMAAYCASV-UHFFFAOYSA-N 0.000 description 7
- 125000001072 heteroaryl group Chemical group 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 6
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 4
- 150000003961 organosilicon compounds Chemical class 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 4
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- GNZBDLMUHMACNZ-UHFFFAOYSA-N N-(disilanyl)-N-propan-2-ylpropan-2-amine Chemical compound CC(C)N([SiH2][SiH3])C(C)C GNZBDLMUHMACNZ-UHFFFAOYSA-N 0.000 description 3
- 229910008314 Si—H2 Inorganic materials 0.000 description 3
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 150000004703 alkoxides Chemical class 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- FXMNVBZEWMANSQ-UHFFFAOYSA-N chloro(silyl)silane Chemical compound [SiH3][SiH2]Cl FXMNVBZEWMANSQ-UHFFFAOYSA-N 0.000 description 3
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- HOXINJBQVZWYGZ-UHFFFAOYSA-N fenbutatin oxide Chemical compound C=1C=CC=CC=1C(C)(C)C[Sn](O[Sn](CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C1=CC=CC=C1 HOXINJBQVZWYGZ-UHFFFAOYSA-N 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000004949 mass spectrometry Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 238000005292 vacuum distillation Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- LISDBLOKKWTHNH-UHFFFAOYSA-N 1,3,5-Trisilacyclohexan Natural products C1[SiH2]C[SiH2]C[SiH2]1 LISDBLOKKWTHNH-UHFFFAOYSA-N 0.000 description 2
- HRBWYEYOHHXYQO-UHFFFAOYSA-N 1,4-di(propan-2-yl)-1,4,2,3,5,6-diazatetrasilinane Chemical compound CC(C)N1[SiH2][SiH2]N([SiH2][SiH2]1)C(C)C HRBWYEYOHHXYQO-UHFFFAOYSA-N 0.000 description 2
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- DMSPFACBWOXIBX-UHFFFAOYSA-N 1-phenyl-N-silylmethanamine Chemical compound [SiH3]NCC1=CC=CC=C1 DMSPFACBWOXIBX-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- SFLARCZJKUXPCE-UHFFFAOYSA-N N-butan-2-yl-N-silylbutan-2-amine Chemical compound CCC(C)N([SiH3])C(C)CC SFLARCZJKUXPCE-UHFFFAOYSA-N 0.000 description 2
- BIVNKSDKIFWKFA-UHFFFAOYSA-N N-propan-2-yl-N-silylpropan-2-amine Chemical compound CC(C)N([SiH3])C(C)C BIVNKSDKIFWKFA-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000000560 X-ray reflectometry Methods 0.000 description 2
- VOSJXMPCFODQAR-UHFFFAOYSA-N ac1l3fa4 Chemical compound [SiH3]N([SiH3])[SiH3] VOSJXMPCFODQAR-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 229910052729 chemical element Inorganic materials 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- VBCSQFQVDXIOJL-UHFFFAOYSA-N diethylazanide;hafnium(4+) Chemical compound [Hf+4].CC[N-]CC.CC[N-]CC.CC[N-]CC.CC[N-]CC VBCSQFQVDXIOJL-UHFFFAOYSA-N 0.000 description 2
- VJDVOZLYDLHLSM-UHFFFAOYSA-N diethylazanide;titanium(4+) Chemical compound [Ti+4].CC[N-]CC.CC[N-]CC.CC[N-]CC.CC[N-]CC VJDVOZLYDLHLSM-UHFFFAOYSA-N 0.000 description 2
- ZYLGGWPMIDHSEZ-UHFFFAOYSA-N dimethylazanide;hafnium(4+) Chemical compound [Hf+4].C[N-]C.C[N-]C.C[N-]C.C[N-]C ZYLGGWPMIDHSEZ-UHFFFAOYSA-N 0.000 description 2
- DWCMDRNGBIZOQL-UHFFFAOYSA-N dimethylazanide;zirconium(4+) Chemical compound [Zr+4].C[N-]C.C[N-]C.C[N-]C.C[N-]C DWCMDRNGBIZOQL-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
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Images
Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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US14/293,554 US9796739B2 (en) | 2013-06-26 | 2014-06-02 | AZA-polysilane precursors and methods for depositing films comprising same |
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CN (1) | CN104250258B (zh) |
TW (2) | TWI636987B (zh) |
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JP5925673B2 (ja) * | 2012-12-27 | 2016-05-25 | 東京エレクトロン株式会社 | シリコン膜の成膜方法および成膜装置 |
US10453675B2 (en) * | 2013-09-20 | 2019-10-22 | Versum Materials Us, Llc | Organoaminosilane precursors and methods for depositing films comprising same |
KR102326396B1 (ko) * | 2013-09-27 | 2021-11-12 | 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 | 아민 치환된 트리실릴아민 및 트리디실릴아민 화합물 |
US9905415B2 (en) * | 2013-10-03 | 2018-02-27 | Versum Materials Us, Llc | Methods for depositing silicon nitride films |
CN107002236B (zh) | 2014-09-23 | 2019-04-05 | 乔治洛德方法研究和开发液化空气有限公司 | 用于沉积含Si膜的碳硅烷取代的胺前体以及其方法 |
US10354860B2 (en) * | 2015-01-29 | 2019-07-16 | Versum Materials Us, Llc | Method and precursors for manufacturing 3D devices |
JP6501560B2 (ja) * | 2015-03-06 | 2019-04-17 | 東京エレクトロン株式会社 | シリコン窒化物膜の成膜方法および成膜装置 |
TWI716333B (zh) * | 2015-03-30 | 2021-01-11 | 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 | 碳矽烷與氨、胺類及脒類之觸媒去氫耦合 |
JP6086942B2 (ja) * | 2015-06-10 | 2017-03-01 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
EP4092154A1 (en) * | 2015-06-16 | 2022-11-23 | Versum Materials US, LLC | Processes for depositing silicon-containing films using same |
TWI757260B (zh) | 2015-12-18 | 2022-03-11 | 中國大陸商南大光電半導體材料有限公司 | 參(二矽烷基)胺 |
KR102458309B1 (ko) | 2015-12-28 | 2022-10-24 | 삼성전자주식회사 | SiOCN 물질막의 형성 방법 및 반도체 소자의 제조 방법 |
US10283348B2 (en) * | 2016-01-20 | 2019-05-07 | Versum Materials Us, Llc | High temperature atomic layer deposition of silicon-containing films |
TWI753794B (zh) | 2016-03-23 | 2022-01-21 | 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 | 形成含矽膜之組成物及其製法與用途 |
JP2020502360A (ja) * | 2016-10-25 | 2020-01-23 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | ケイ素含有薄膜の生成方法 |
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