JP6098984B2 - アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ - Google Patents
アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ Download PDFInfo
- Publication number
- JP6098984B2 JP6098984B2 JP2015529924A JP2015529924A JP6098984B2 JP 6098984 B2 JP6098984 B2 JP 6098984B2 JP 2015529924 A JP2015529924 A JP 2015529924A JP 2015529924 A JP2015529924 A JP 2015529924A JP 6098984 B2 JP6098984 B2 JP 6098984B2
- Authority
- JP
- Japan
- Prior art keywords
- mol
- frit
- glass
- antimony
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
- C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Glass Compositions (AREA)
- Electroluminescent Light Sources (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261695033P | 2012-08-30 | 2012-08-30 | |
| US61/695,033 | 2012-08-30 | ||
| PCT/US2013/056780 WO2014035954A2 (en) | 2012-08-30 | 2013-08-27 | Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015532634A JP2015532634A (ja) | 2015-11-12 |
| JP2015532634A5 JP2015532634A5 (enExample) | 2016-09-23 |
| JP6098984B2 true JP6098984B2 (ja) | 2017-03-22 |
Family
ID=49118819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015529924A Expired - Fee Related JP6098984B2 (ja) | 2012-08-30 | 2013-08-27 | アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8823163B2 (enExample) |
| EP (1) | EP2890653B1 (enExample) |
| JP (1) | JP6098984B2 (enExample) |
| KR (1) | KR20150050575A (enExample) |
| CN (1) | CN104936917B (enExample) |
| TW (1) | TWI586624B (enExample) |
| WO (1) | WO2014035954A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019164059A1 (ko) * | 2018-02-23 | 2019-08-29 | 엘지전자 주식회사 | 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9573840B2 (en) * | 2013-08-27 | 2017-02-21 | Corning Incorporated | Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit |
| CN104150778B (zh) * | 2014-08-11 | 2016-07-06 | 海南中航特玻材料有限公司 | 一种无铅低熔点封接玻璃 |
| KR20170107062A (ko) * | 2015-01-28 | 2017-09-22 | 코닝 인코포레이티드 | 유리 프릿, 및 유리 프릿으로 실링된 유리 어셈블리 |
| US10566503B2 (en) * | 2015-05-18 | 2020-02-18 | Hitachi, Ltd. | Multilayer glass |
| JP2017218335A (ja) * | 2016-06-03 | 2017-12-14 | 旭硝子株式会社 | ガラス、導電ペーストおよび太陽電池 |
| KR101853446B1 (ko) * | 2016-08-24 | 2018-04-30 | 주식회사 베이스 | 유기 발광 표시 장치 및 그 실링 방법 |
| WO2019023444A1 (en) * | 2017-07-28 | 2019-01-31 | Corning Incorporated | SINK PASTE AND METHOD OF SEALING A GLASS ASSEMBLY COMPRISING THE SAME |
| KR102092295B1 (ko) * | 2018-02-23 | 2020-03-23 | 엘지전자 주식회사 | 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체 |
| KR102091839B1 (ko) * | 2018-02-23 | 2020-03-20 | 엘지전자 주식회사 | 강화 유리에 적합한 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체 |
| KR102663522B1 (ko) * | 2018-11-05 | 2024-05-16 | 삼성디스플레이 주식회사 | 표시장치 및 그 제조방법 |
| GB201915010D0 (en) * | 2019-10-17 | 2019-12-04 | Johnson Matthey Plc | Composition, paste and methods |
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| JPS58211743A (ja) | 1982-06-03 | 1983-12-09 | Sanyo Electric Co Ltd | エレクトロクロミツク表示装置の製造方法 |
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| US5246890A (en) | 1992-08-03 | 1993-09-21 | Corning Incorporated | Non-lead sealing glasses |
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| EP1171921A1 (de) | 1999-03-24 | 2002-01-16 | Osram Opto Semiconductors GmbH & Co. OHG | Organisches elektrolumineszierendes bauteil |
| AU4951099A (en) | 1999-07-09 | 2001-01-30 | Institute Of Materials Research And Engineering | Laminates for encapsulating devices |
| US6952078B1 (en) | 1999-12-17 | 2005-10-04 | Osram Opto Semiconductord Gmbh | Encapsulation for organic LED device |
| JP2001319775A (ja) | 2000-05-10 | 2001-11-16 | Auto Network Gijutsu Kenkyusho:Kk | 有機el表示装置の封止方法および封止構造 |
| US6867539B1 (en) | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
| DE60027021T2 (de) | 2000-09-06 | 2006-08-24 | Osram Opto Semiconductors Gmbh | Verkapselung für oled-bauelemente |
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| US20040169174A1 (en) | 2001-05-24 | 2004-09-02 | Huh Jin Woo | Container for encapsulating oled and manufacturing method thereof |
| JP3975739B2 (ja) | 2001-12-14 | 2007-09-12 | 旭硝子株式会社 | 有機elディスプレイ用対向基板の製造方法および有機elディスプレイの製造方法 |
| US6891330B2 (en) | 2002-03-29 | 2005-05-10 | General Electric Company | Mechanically flexible organic electroluminescent device with directional light emission |
| JP4299021B2 (ja) | 2003-02-19 | 2009-07-22 | ヤマト電子株式会社 | 封着加工材及び封着加工用ペースト |
| US6998776B2 (en) | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| DE60335219D1 (de) | 2003-06-27 | 2011-01-13 | Yamato Electronic Co Ltd | Bleifreies glasmaterial zum versiegeln, versiegelter artikel und versiegelungsverfahren damit |
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| JP5178204B2 (ja) | 2005-12-06 | 2013-04-10 | コーニング インコーポレイテッド | フリットで密封されたガラスパッケージおよびその製造方法 |
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| US7999372B2 (en) | 2006-01-25 | 2011-08-16 | Samsung Mobile Display Co., Ltd. | Organic light emitting display device and method of fabricating the same |
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| JP5552743B2 (ja) | 2008-03-28 | 2014-07-16 | 旭硝子株式会社 | フリット |
| CN102046549B (zh) * | 2008-08-06 | 2014-05-28 | 日本电气硝子株式会社 | 密封玻璃 |
| US20100095705A1 (en) * | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
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| JP2012106891A (ja) | 2010-11-18 | 2012-06-07 | Asahi Glass Co Ltd | 封着用無鉛ガラス、封着材料、封着材料ペースト |
| US8486308B2 (en) * | 2010-12-17 | 2013-07-16 | E I Du Pont De Nemours And Company | Conductive paste composition containing lithium, and articles made therefrom |
| WO2012090943A1 (ja) * | 2010-12-27 | 2012-07-05 | 旭硝子株式会社 | 封着材料層付きガラス部材とそれを用いた電子デバイス及びその製造方法 |
-
2013
- 2013-08-27 EP EP13759391.9A patent/EP2890653B1/en not_active Not-in-force
- 2013-08-27 WO PCT/US2013/056780 patent/WO2014035954A2/en not_active Ceased
- 2013-08-27 JP JP2015529924A patent/JP6098984B2/ja not_active Expired - Fee Related
- 2013-08-27 CN CN201380052330.9A patent/CN104936917B/zh not_active Expired - Fee Related
- 2013-08-27 KR KR1020157007602A patent/KR20150050575A/ko not_active Abandoned
- 2013-08-29 TW TW102131079A patent/TWI586624B/zh not_active IP Right Cessation
- 2013-08-30 US US14/014,525 patent/US8823163B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019164059A1 (ko) * | 2018-02-23 | 2019-08-29 | 엘지전자 주식회사 | 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체 |
| US11958772B2 (en) | 2018-02-23 | 2024-04-16 | Lg Electronics Inc. | Low-temperature fired, lead-free glass frit, paste, and vacuum glass assembly using same |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140061623A1 (en) | 2014-03-06 |
| US8823163B2 (en) | 2014-09-02 |
| WO2014035954A3 (en) | 2014-04-24 |
| CN104936917A (zh) | 2015-09-23 |
| CN104936917B (zh) | 2016-10-26 |
| KR20150050575A (ko) | 2015-05-08 |
| JP2015532634A (ja) | 2015-11-12 |
| WO2014035954A2 (en) | 2014-03-06 |
| TW201414692A (zh) | 2014-04-16 |
| EP2890653A2 (en) | 2015-07-08 |
| EP2890653B1 (en) | 2016-08-24 |
| TWI586624B (zh) | 2017-06-11 |
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