JP6098984B2 - アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ - Google Patents

アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ Download PDF

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Publication number
JP6098984B2
JP6098984B2 JP2015529924A JP2015529924A JP6098984B2 JP 6098984 B2 JP6098984 B2 JP 6098984B2 JP 2015529924 A JP2015529924 A JP 2015529924A JP 2015529924 A JP2015529924 A JP 2015529924A JP 6098984 B2 JP6098984 B2 JP 6098984B2
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JP
Japan
Prior art keywords
mol
frit
glass
antimony
free
Prior art date
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Expired - Fee Related
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JP2015529924A
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English (en)
Japanese (ja)
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JP2015532634A5 (enExample
JP2015532634A (ja
Inventor
アン ドレイク,メリンダ
アン ドレイク,メリンダ
マイケル モリーナ,ロバート
マイケル モリーナ,ロバート
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Corning Inc
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Corning Inc
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Publication of JP2015532634A5 publication Critical patent/JP2015532634A5/ja
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/16Silica-free oxide glass compositions containing phosphorus
    • C03C3/21Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Glass Compositions (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
JP2015529924A 2012-08-30 2013-08-27 アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ Expired - Fee Related JP6098984B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261695033P 2012-08-30 2012-08-30
US61/695,033 2012-08-30
PCT/US2013/056780 WO2014035954A2 (en) 2012-08-30 2013-08-27 Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit

Publications (3)

Publication Number Publication Date
JP2015532634A JP2015532634A (ja) 2015-11-12
JP2015532634A5 JP2015532634A5 (enExample) 2016-09-23
JP6098984B2 true JP6098984B2 (ja) 2017-03-22

Family

ID=49118819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015529924A Expired - Fee Related JP6098984B2 (ja) 2012-08-30 2013-08-27 アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ

Country Status (7)

Country Link
US (1) US8823163B2 (enExample)
EP (1) EP2890653B1 (enExample)
JP (1) JP6098984B2 (enExample)
KR (1) KR20150050575A (enExample)
CN (1) CN104936917B (enExample)
TW (1) TWI586624B (enExample)
WO (1) WO2014035954A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019164059A1 (ko) * 2018-02-23 2019-08-29 엘지전자 주식회사 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체

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US9573840B2 (en) * 2013-08-27 2017-02-21 Corning Incorporated Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit
CN104150778B (zh) * 2014-08-11 2016-07-06 海南中航特玻材料有限公司 一种无铅低熔点封接玻璃
KR20170107062A (ko) * 2015-01-28 2017-09-22 코닝 인코포레이티드 유리 프릿, 및 유리 프릿으로 실링된 유리 어셈블리
US10566503B2 (en) * 2015-05-18 2020-02-18 Hitachi, Ltd. Multilayer glass
JP2017218335A (ja) * 2016-06-03 2017-12-14 旭硝子株式会社 ガラス、導電ペーストおよび太陽電池
KR101853446B1 (ko) * 2016-08-24 2018-04-30 주식회사 베이스 유기 발광 표시 장치 및 그 실링 방법
WO2019023444A1 (en) * 2017-07-28 2019-01-31 Corning Incorporated SINK PASTE AND METHOD OF SEALING A GLASS ASSEMBLY COMPRISING THE SAME
KR102092295B1 (ko) * 2018-02-23 2020-03-23 엘지전자 주식회사 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
KR102091839B1 (ko) * 2018-02-23 2020-03-20 엘지전자 주식회사 강화 유리에 적합한 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
KR102663522B1 (ko) * 2018-11-05 2024-05-16 삼성디스플레이 주식회사 표시장치 및 그 제조방법
GB201915010D0 (en) * 2019-10-17 2019-12-04 Johnson Matthey Plc Composition, paste and methods

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US11958772B2 (en) 2018-02-23 2024-04-16 Lg Electronics Inc. Low-temperature fired, lead-free glass frit, paste, and vacuum glass assembly using same

Also Published As

Publication number Publication date
US20140061623A1 (en) 2014-03-06
US8823163B2 (en) 2014-09-02
WO2014035954A3 (en) 2014-04-24
CN104936917A (zh) 2015-09-23
CN104936917B (zh) 2016-10-26
KR20150050575A (ko) 2015-05-08
JP2015532634A (ja) 2015-11-12
WO2014035954A2 (en) 2014-03-06
TW201414692A (zh) 2014-04-16
EP2890653A2 (en) 2015-07-08
EP2890653B1 (en) 2016-08-24
TWI586624B (zh) 2017-06-11

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