JP6088346B2 - 静電チャック及び半導体製造装置 - Google Patents

静電チャック及び半導体製造装置 Download PDF

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Publication number
JP6088346B2
JP6088346B2 JP2013099269A JP2013099269A JP6088346B2 JP 6088346 B2 JP6088346 B2 JP 6088346B2 JP 2013099269 A JP2013099269 A JP 2013099269A JP 2013099269 A JP2013099269 A JP 2013099269A JP 6088346 B2 JP6088346 B2 JP 6088346B2
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Japan
Prior art keywords
electrostatic chuck
content
electrostatic
oxide
wafer
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JP2013099269A
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English (en)
Japanese (ja)
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JP2014220408A (ja
JP2014220408A5 (enExample
Inventor
昌邦 宮澤
昌邦 宮澤
宮本　和佳
和佳 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2013099269A priority Critical patent/JP6088346B2/ja
Priority to US14/247,603 priority patent/US9418884B2/en
Priority to TW103113016A priority patent/TWI623056B/zh
Priority to KR1020140048657A priority patent/KR102035584B1/ko
Publication of JP2014220408A publication Critical patent/JP2014220408A/ja
Publication of JP2014220408A5 publication Critical patent/JP2014220408A5/ja
Application granted granted Critical
Publication of JP6088346B2 publication Critical patent/JP6088346B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2013099269A 2013-05-09 2013-05-09 静電チャック及び半導体製造装置 Active JP6088346B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013099269A JP6088346B2 (ja) 2013-05-09 2013-05-09 静電チャック及び半導体製造装置
US14/247,603 US9418884B2 (en) 2013-05-09 2014-04-08 Electrostatic chuck and semiconductor manufacturing device
TW103113016A TWI623056B (zh) 2013-05-09 2014-04-09 靜電夾頭及半導體製造裝置
KR1020140048657A KR102035584B1 (ko) 2013-05-09 2014-04-23 정전 척 및 반도체 제조 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013099269A JP6088346B2 (ja) 2013-05-09 2013-05-09 静電チャック及び半導体製造装置

Publications (3)

Publication Number Publication Date
JP2014220408A JP2014220408A (ja) 2014-11-20
JP2014220408A5 JP2014220408A5 (enExample) 2016-01-28
JP6088346B2 true JP6088346B2 (ja) 2017-03-01

Family

ID=51864613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013099269A Active JP6088346B2 (ja) 2013-05-09 2013-05-09 静電チャック及び半導体製造装置

Country Status (4)

Country Link
US (1) US9418884B2 (enExample)
JP (1) JP6088346B2 (enExample)
KR (1) KR102035584B1 (enExample)
TW (1) TWI623056B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230096465A (ko) 2021-12-23 2023-06-30 주식회사 미코세라믹스 세라믹 서셉터의 제조 방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
JP2017103389A (ja) * 2015-12-03 2017-06-08 新光電気工業株式会社 静電チャック及び半導体製造装置
JP6531693B2 (ja) * 2016-03-30 2019-06-19 住友大阪セメント株式会社 静電チャック装置、静電チャック装置の製造方法
JP6858035B2 (ja) * 2017-02-27 2021-04-14 新光電気工業株式会社 基板固定具及び基板固定装置
JP6830030B2 (ja) * 2017-04-27 2021-02-17 新光電気工業株式会社 静電チャック及び基板固定装置
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
JP7378210B2 (ja) * 2019-01-17 2023-11-13 新光電気工業株式会社 セラミック部材の製造方法
JP7194306B1 (ja) * 2022-07-27 2022-12-21 黒崎播磨株式会社 アルミナ焼結体及び静電チャック

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231796A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 静電チャック
JP4248833B2 (ja) * 2002-09-12 2009-04-02 株式会社ソディック セラミックス及びその製造方法
US6982125B2 (en) * 2002-12-23 2006-01-03 Saint-Gobain Ceramics & Plastics, Inc. ALN material and electrostatic chuck incorporating same
JP4364593B2 (ja) * 2003-09-29 2009-11-18 新光電気工業株式会社 アルミナ質セラミック板及びその製造方法
KR100918190B1 (ko) * 2005-04-22 2009-09-22 주식회사 코미코 치밀질 질화알루미늄 소결체, 그 제조 방법 및 상기소결체를 이용한 반도체 제조용 부재
JP5042886B2 (ja) 2008-03-06 2012-10-03 太平洋セメント株式会社 静電チャック
JP5644161B2 (ja) * 2010-04-12 2014-12-24 住友電気工業株式会社 半導体保持用の静電チャックおよびその製造方法
JP5593299B2 (ja) * 2011-11-25 2014-09-17 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230096465A (ko) 2021-12-23 2023-06-30 주식회사 미코세라믹스 세라믹 서셉터의 제조 방법

Also Published As

Publication number Publication date
TW201501234A (zh) 2015-01-01
KR20140133436A (ko) 2014-11-19
JP2014220408A (ja) 2014-11-20
US20140334059A1 (en) 2014-11-13
KR102035584B1 (ko) 2019-10-24
US9418884B2 (en) 2016-08-16
TWI623056B (zh) 2018-05-01

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