JP6086394B2 - 薄膜トランジスタ基板、表示パネル、レーザーアニール方法 - Google Patents
薄膜トランジスタ基板、表示パネル、レーザーアニール方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 68
- 238000005224 laser annealing Methods 0.000 title claims description 57
- 239000010409 thin film Substances 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 19
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 11
- 229920005591 polysilicon Polymers 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 22
- 239000010408 film Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Description
基板上の縦列と横列に沿ってそれぞれ複数の薄膜トランジスタを配列した薄膜トランジスタ基板であって、各薄膜トランジスタは、チャネル領域を形成するアモルファスシリコン層をレーザーアニールしてポリシリコン層としたレーザーアニール部を備え、該レーザーアニール部は、レーザーアニールを行うレーザ光と前記基板とが相対的に移動するスキャン方向に沿った設定ピッチで配置され、前記スキャン方向に直交する方向に形成されたチャネル幅内に該チャネル幅よりも狭い前記レーザーアニール部を有し、前記レーザーアニール部は、前記スキャン方向の長さが前記スキャン方向に沿った前記チャネル幅の長さより長いことを特徴とする薄膜トランジスタ基板。
2:データ線,3:ゲート線,4:透明電極形成部,
10:薄膜トランジスタ(TFT),10A:レーザーアニール部,
11:ゲート電極,12:ゲート絶縁膜,13:アモルファスシリコン層,
14,15:ソース・ドレイン電極,16:保護層,17:透明導電パターン,
20:レーザ光照射装置,21:レーザ光源,22:ビームホモジナイザ,
23:照射光学系,24:マスク,
25:マイクロレンズアレイ,25L:レンズ,
26:基板搬送装置,
L:レーザ光,W:チャネル幅,S:スキャン方向,
Claims (7)
- 基板上の縦列と横列に沿ってそれぞれ複数の薄膜トランジスタを配列した薄膜トランジスタ基板であって、
各薄膜トランジスタは、チャネル領域を形成するアモルファスシリコン層をレーザーアニールしてポリシリコン層としたレーザーアニール部を備え、
該レーザーアニール部は、レーザーアニールを行うレーザ光と前記基板とが相対的に移動するスキャン方向に沿った設定ピッチで配置され、
前記スキャン方向に直交する方向に形成されたチャネル幅内に該チャネル幅よりも狭い前記レーザーアニール部を有し、
前記レーザーアニール部は、前記スキャン方向の長さが前記スキャン方向に沿った前記チャネル幅の長さより長いことを特徴とする薄膜トランジスタ基板。 - 前記設定ピッチは、前記レーザ光と前記基板とが相対的に移動するスキャンの速度とレーザ光のパルス周波数で設定されることを特徴とする請求項1記載の薄膜トランジスタ基板。
- 前記レーザーアニール部は、前記スキャン方向に沿った幅が前記スキャン方向に直交する方向の幅より長いことを特徴とする請求項1又は2記載の薄膜トランジスタ基板。
- 各薄膜トランジスタは、前記基板上の縦列と横列に沿ってそれぞれ複数配列された透明電極パターン毎に配置され、
前記透明電極パターンは、前記スキャン方向に沿った幅が前記スキャン方向に直交する方向の幅より短いことを特徴とする請求項1〜3のいずれか1項に記載の薄膜トランジスタ基板。 - 請求項1〜4のいずれか1項に記載の薄膜トランジスタ基板を備えた表示パネル。
- 基板とレーザー光とを一軸方向に沿ってスキャンしながら、前記一軸方向に直交する方向に沿って、複数のレンズを配列したマイクロレンズアレイを移動させ、前記レーザ光を、前記レンズを通して、薄膜トランジスタのチャネル領域となる特定箇所に集光させ、前記特定箇所に前記基板上のアモルファスシリコン層をポリシリコン層とするレーザーアニール部を形成する方法であって、
前記レーザーアニール部は、前記一軸方向に沿って設定ピッチで配列され、
前記スキャンの方向に直交する方向に形成予定のチャネル幅内に所定形状の前記レーザーアニール部が形成され、
前記レーザーアニール部は、前記スキャンの方向の長さが前記スキャンの方向に沿った前記チャネル幅の長さより長いことを特徴とするレーザーアニール方法。 - 前記設定ピッチは、前記スキャンの速度と前記レーザ光のパルス周波数で設定されることを特徴とする請求項6記載のレーザーアニール方法。
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JP2015048394A JP6086394B2 (ja) | 2015-03-11 | 2015-03-11 | 薄膜トランジスタ基板、表示パネル、レーザーアニール方法 |
KR1020177023620A KR20170123617A (ko) | 2015-03-11 | 2016-02-15 | 박막 트랜지스터 기판, 표시 패널, 레이저 어닐링 방법 |
PCT/JP2016/054286 WO2016143462A1 (ja) | 2015-03-11 | 2016-02-15 | 薄膜トランジスタ基板、表示パネル、レーザーアニール方法 |
US15/556,728 US10026623B2 (en) | 2015-03-11 | 2016-02-15 | Thin film transistor substrate, display panel, and laser annealing method |
CN201680014402.4A CN107430990B (zh) | 2015-03-11 | 2016-02-15 | 薄膜晶体管基板、显示面板以及激光退火方法 |
TW105107242A TWI678809B (zh) | 2015-03-11 | 2016-03-09 | 薄膜電晶體基板、顯示面板、雷射退火方法 |
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CN (1) | CN107430990B (ja) |
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US20190140102A1 (en) | 2016-04-25 | 2019-05-09 | Sakai Display Products Corporation | Thin film transistor, display device, and thin film transistor manufacturing method |
CN111162129A (zh) * | 2020-01-21 | 2020-05-15 | 京东方科技集团股份有限公司 | 晶体管及其制备方法、显示基板和显示装置 |
CN113325625B (zh) * | 2021-06-24 | 2022-07-29 | 业成科技(成都)有限公司 | 显示面板的制备方法 |
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JP3845569B2 (ja) * | 2001-11-08 | 2006-11-15 | セイコーエプソン株式会社 | 薄膜半導体装置及びその製造方法並びに当該装置を備える電子デバイス |
KR100462862B1 (ko) * | 2002-01-18 | 2004-12-17 | 삼성에스디아이 주식회사 | 티에프티용 다결정 실리콘 박막 및 이를 이용한디스플레이 디바이스 |
JP4526772B2 (ja) * | 2002-03-26 | 2010-08-18 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
JP2009026877A (ja) * | 2007-07-18 | 2009-02-05 | Sharp Corp | 半導体装置及びその製造方法 |
JP2009289874A (ja) * | 2008-05-28 | 2009-12-10 | Sony Corp | 薄膜トランジスタおよび表示装置 |
JP5471046B2 (ja) | 2009-06-03 | 2014-04-16 | 株式会社ブイ・テクノロジー | レーザアニール方法及びレーザアニール装置 |
WO2013051221A1 (ja) * | 2011-10-03 | 2013-04-11 | パナソニック株式会社 | 薄膜素子、薄膜素子アレイ及び薄膜素子の製造方法 |
WO2013061383A1 (ja) * | 2011-10-28 | 2013-05-02 | パナソニック株式会社 | 薄膜半導体装置及びその製造方法 |
CN102842619B (zh) * | 2012-09-03 | 2016-08-03 | 南京中电熊猫液晶显示科技有限公司 | 一种半导体装置及其制造方法 |
JP5918118B2 (ja) * | 2012-12-18 | 2016-05-18 | 株式会社日本製鋼所 | 結晶半導体膜の製造方法 |
KR102151751B1 (ko) * | 2013-07-19 | 2020-10-27 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 이를 포함하는 유기 발광 표시 장치 |
US10038098B2 (en) * | 2014-11-07 | 2018-07-31 | Sakai Display Products Corporation | Method for manufacturing thin film transistor, thin film transistor and display panel |
CN106663697B (zh) * | 2015-03-27 | 2019-11-12 | 堺显示器制品株式会社 | 薄膜晶体管及显示面板 |
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- 2016-02-15 WO PCT/JP2016/054286 patent/WO2016143462A1/ja active Application Filing
- 2016-02-15 KR KR1020177023620A patent/KR20170123617A/ko unknown
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CN107430990B (zh) | 2020-08-14 |
TWI678809B (zh) | 2019-12-01 |
JP2016171116A (ja) | 2016-09-23 |
US10026623B2 (en) | 2018-07-17 |
WO2016143462A1 (ja) | 2016-09-15 |
KR20170123617A (ko) | 2017-11-08 |
US20180061661A1 (en) | 2018-03-01 |
TW201637204A (zh) | 2016-10-16 |
CN107430990A (zh) | 2017-12-01 |
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