JP6078631B2 - セルフコンディショニング研磨パッドおよびその作製方法 - Google Patents

セルフコンディショニング研磨パッドおよびその作製方法 Download PDF

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Publication number
JP6078631B2
JP6078631B2 JP2015501730A JP2015501730A JP6078631B2 JP 6078631 B2 JP6078631 B2 JP 6078631B2 JP 2015501730 A JP2015501730 A JP 2015501730A JP 2015501730 A JP2015501730 A JP 2015501730A JP 6078631 B2 JP6078631 B2 JP 6078631B2
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JP
Japan
Prior art keywords
particles
insoluble polymer
polymer foam
polishing pad
coated
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Expired - Fee Related
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JP2015501730A
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English (en)
Japanese (ja)
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JP2015510847A5 (enExample
JP2015510847A (ja
Inventor
スコット ビー． ダスキーウィック，
スコット ビー． ダスキーウィック，
Original Assignee
ジェイエイチ ローデス カンパニー， インコーポレイテッド
ジェイエイチ ローデス カンパニー， インコーポレイテッド
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Publication of JP2015510847A publication Critical patent/JP2015510847A/ja
Publication of JP2015510847A5 publication Critical patent/JP2015510847A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/35—Composite foams, i.e. continuous macromolecular foams containing discontinuous cellular particles or fragments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/10—Water or water-releasing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/14—Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
    • C08J2203/142—Halogenated saturated hydrocarbons, e.g. H3C-CF3

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2015501730A 2012-03-20 2013-03-12 セルフコンディショニング研磨パッドおよびその作製方法 Expired - Fee Related JP6078631B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261613398P 2012-03-20 2012-03-20
US61/613,398 2012-03-20
PCT/US2013/030353 WO2013142134A1 (en) 2012-03-20 2013-03-12 A self-conditioning polishing pad and a method of making the same

Publications (3)

Publication Number Publication Date
JP2015510847A JP2015510847A (ja) 2015-04-13
JP2015510847A5 JP2015510847A5 (enExample) 2016-03-31
JP6078631B2 true JP6078631B2 (ja) 2017-02-08

Family

ID=49212255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015501730A Expired - Fee Related JP6078631B2 (ja) 2012-03-20 2013-03-12 セルフコンディショニング研磨パッドおよびその作製方法

Country Status (6)

Country Link
US (1) US9050697B2 (enExample)
JP (1) JP6078631B2 (enExample)
KR (1) KR101532896B1 (enExample)
CN (1) CN104302446B (enExample)
TW (1) TWI574782B (enExample)
WO (1) WO2013142134A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
US10813444B2 (en) 2018-05-16 2020-10-27 Jh Rhodes Company, Inc. Porous polymeric polishing bristles and methods for their manufacture
KR101783406B1 (ko) * 2016-12-07 2017-10-10 엠.씨.케이 (주) 연마 패드 및 이의 제조방법
US11551936B2 (en) * 2018-07-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Self-healing polishing pad
CN112080209B (zh) * 2020-09-11 2022-04-12 宁波江丰电子材料股份有限公司 一种冷却水盘和冷却管的粘结方法
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP4155790B2 (ja) * 2002-10-18 2008-09-24 株式会社東芝 化学機械研磨方法及び素子微細化分離用研磨パッド
JP4039214B2 (ja) * 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20050176251A1 (en) 2004-02-05 2005-08-11 Duong Chau H. Polishing pad with releasable slick particles
CN100424830C (zh) 2004-04-23 2008-10-08 Jsr株式会社 用于抛光半导体晶片的抛光垫、层叠体和方法
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
US7169031B1 (en) * 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
JP4379462B2 (ja) * 2006-10-31 2009-12-09 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
KR100955032B1 (ko) 2008-05-20 2010-04-28 (주)피에스텍 연마용 폴리우레탄 흡착 패드 조성물, 연마용 폴리우레탄흡착 패드 및 그 제조방법
WO2010078566A1 (en) * 2009-01-05 2010-07-08 Innopad, Inc. Multi-layered chemical-mechanical planarization pad
KR101352235B1 (ko) * 2009-05-27 2014-01-15 로저스코포레이션 연마 패드, 이를 위한 폴리우레탄층, 및 규소 웨이퍼의 연마 방법
US20130012108A1 (en) 2009-12-22 2013-01-10 Naichao Li Polishing pad and method of making the same
WO2012138705A2 (en) 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same

Also Published As

Publication number Publication date
TW201347907A (zh) 2013-12-01
KR20140130240A (ko) 2014-11-07
TWI574782B (zh) 2017-03-21
JP2015510847A (ja) 2015-04-13
US20130252519A1 (en) 2013-09-26
CN104302446A (zh) 2015-01-21
WO2013142134A1 (en) 2013-09-26
KR101532896B1 (ko) 2015-06-30
CN104302446B (zh) 2017-10-31
US9050697B2 (en) 2015-06-09

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