JP2005169570A - 研磨パッドおよびその製造方法 - Google Patents
研磨パッドおよびその製造方法 Download PDFInfo
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- JP2005169570A JP2005169570A JP2003413591A JP2003413591A JP2005169570A JP 2005169570 A JP2005169570 A JP 2005169570A JP 2003413591 A JP2003413591 A JP 2003413591A JP 2003413591 A JP2003413591 A JP 2003413591A JP 2005169570 A JP2005169570 A JP 2005169570A
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- polishing pad
- polishing
- manufacturing
- pad
- polyurethane
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 研磨パッド用の発泡ポリウレタンブロックを形成した後スライスして研磨シートにし、それを裁断加工する研磨パッドの製造方法において、前記裁断加工の前に、研磨シートを所定の温度および湿度環境下に5時間以上静置することを特徴とする寸法変化の小さい研磨パッドの製造方法。
【選択図】図1
Description
・GPC装置:LC−10A(島津製作所製)
・試料作製:試料約4mgをテトラヒドロフラン2mlに溶解
・カラム:MIX−E 2本(PL社製)
・カラム温度:40℃
・移動相:テトラヒドロフラン
・流速:0.7ml/分
・注入量:60μl
・検出器:RI(37℃)
・分子量分布:標準PPG(ポリプロピレンポリオール)換算
ブロックはポストキュアとして70〜180℃の環境内で数時間維持され、空気中の水分と反応させて完全硬化させたり、余剰のイソシアネート基を潰したりする。
直径380mmで高さ50mmのフッ素樹脂を内側にコーティングした容器に、イソシアネートプレポリマーL325(ユニロイヤル社製)25kgとシリコーン系整泡剤SH192(東レダウコーニング社製)を1kgを秤量し、二軸ミキサーにて900rpmで撹拌し、気泡分散液を作った。次いで、硬化剤MOCA:キュアミンMT(イハラケミカル社製)6.5kgを導入し、約1分半撹拌後速やかに850mm×850mmで高さ50mmのオープンモールドへ発泡混合液を入れ、オーブンにて110℃で6時間ポストキュアーを行い、厚さ38mmの発泡ポリウレタンブロックを作製した。次に、発泡ポリウレタンブロックを約50℃に加熱しながらスライサー(アミテック社製、VGW−125)にて、厚さ1.27mmにスライスし研磨シートを得た。発泡ポリウレタンの研磨シートの比重は0.86であった。比重の測定はシートを4×4cmの大きさに切り出し、23±2℃および50±5%(相対温度)で16時間養生した後、比重計(ザルトリウス社製)で計測した。
養生および温度湿度条件を22〜24℃で相対湿度45〜55%にする以外は実施例1と同様に処理を行った。発泡ポリウレタンの研磨シートの比重は0.85であった。同じ測定を行い、結果を表1に示す。
養生時間を15時間から7時間に縮めること以外は実施例1と同様に処理を行った。発泡ポリウレタンの研磨シートの比重は0.87であった。同じ測定を行い、結果を表1に示す。
温度湿度条件の相対湿度を75〜85%に高めた以外は、実施例1と同様に処理を行った。発泡ポリウレタンの研磨シートの比重は0.85であった。同じ測定を行い、結果を表1に示す。
温度湿度設定条件の湿度条件を15〜25%に下げた以外は実施例1と同様に処理を行った。発泡ポリウレタンの研磨シートの比重は0.87であった。同じ測定を行い、結果を表1に示す。
温度湿度条件を28〜32℃に高めた以外は実施例1と同様に処理を行った。発泡ポリウレタンの研磨シートの比重は0.88であった。測定結果を表1に示す。
2・・・プラテン、
3・・・研磨剤、
4・・・半導体ウエハ、
5・・・支持台、
6・・・回転軸、
7・・・回転軸。
Claims (9)
- 研磨層が発泡ポリウレタンであって、かつ吸湿率0.40〜1.20%である研磨パッド。
- 研磨パッドの形状が円形であり、その直径が50〜100cmである請求項1記載の研磨パッド。
- 発泡ポリウレタンが比重0.70〜0.90を有する請求項2記載の研磨パッド。
- 研磨パッド用の発泡ポリウレタンブロックを形成した後スライスして研磨シートにし、それを裁断加工する研磨パッドの製造方法において、前記裁断加工の前に、研磨シートを所定の温度および湿度環境下に5時間以上静置することを特徴とする寸法変化の小さい研磨パッドの製造方法。
- 所定の温度および湿度環境が温度20〜25℃および相対湿度40〜60%である請求項4記載の研磨パッドの製造方法。
- 所定の温度および湿度環境が温度22〜24℃および相対湿度45〜55%である請求項5記載の研磨パッドの製造方法。
- 前記裁断加工以降の後工程も、所定温度および湿度環境で行う請求項4〜6いずれかに記載の研磨パッドの製造方法。
- 前記裁断加工以降の後工程が、裁断された研磨パッドをクッション層またはプラテン側の両面テープに貼り合わせる工程である請求項7記載の研磨パッドの製造方法。
- 前記裁断加工以降の後工程が、裁断された研磨パッドをクッション層に貼り合わせた後、更にクッション層の他方の面上にプラテン側の両面テープに貼り合わせる工程である請求項8記載の研磨パッドの製造方法。
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