TWI574782B - 自我調節硏磨墊及其製造方法 - Google Patents
自我調節硏磨墊及其製造方法 Download PDFInfo
- Publication number
- TWI574782B TWI574782B TW102108998A TW102108998A TWI574782B TW I574782 B TWI574782 B TW I574782B TW 102108998 A TW102108998 A TW 102108998A TW 102108998 A TW102108998 A TW 102108998A TW I574782 B TWI574782 B TW I574782B
- Authority
- TW
- Taiwan
- Prior art keywords
- particles
- insoluble
- polishing pad
- foam
- coated
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000002245 particle Substances 0.000 claims description 126
- 239000006260 foam Substances 0.000 claims description 112
- 238000005498 polishing Methods 0.000 claims description 72
- 239000011159 matrix material Substances 0.000 claims description 37
- 229920000642 polymer Polymers 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- 238000000227 grinding Methods 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 15
- 239000004604 Blowing Agent Substances 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 8
- 239000002666 chemical blowing agent Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 4
- 239000004088 foaming agent Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000006174 pH buffer Substances 0.000 claims description 2
- 239000012985 polymerization agent Substances 0.000 claims description 2
- -1 amine esters Chemical class 0.000 description 22
- 235000012431 wafers Nutrition 0.000 description 17
- 239000005056 polyisocyanate Substances 0.000 description 13
- 229920001228 polyisocyanate Polymers 0.000 description 13
- 239000011148 porous material Substances 0.000 description 12
- 239000012948 isocyanate Substances 0.000 description 11
- 150000002513 isocyanates Chemical class 0.000 description 11
- 125000003118 aryl group Chemical group 0.000 description 9
- 239000003570 air Substances 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 8
- 239000004814 polyurethane Substances 0.000 description 8
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 5
- 241001112258 Moca Species 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 150000003077 polyols Chemical class 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000011496 polyurethane foam Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- PAUHLEIGHAUFAK-UHFFFAOYSA-N 1-isocyanato-1-[(1-isocyanatocyclohexyl)methyl]cyclohexane Chemical compound C1CCCCC1(N=C=O)CC1(N=C=O)CCCCC1 PAUHLEIGHAUFAK-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- UQMRIBFGVVWLTE-UHFFFAOYSA-N [1-isocyanato-2-(2-isocyanato-2-phenylethoxy)ethyl]benzene Chemical compound N(=C=O)C(C1=CC=CC=C1)COCC(C1=CC=CC=C1)N=C=O UQMRIBFGVVWLTE-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000006261 foam material Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229920000831 ionic polymer Polymers 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical group C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- OKIYQFLILPKULA-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane Chemical compound COC(F)(F)C(F)(F)C(F)(F)C(F)(F)F OKIYQFLILPKULA-UHFFFAOYSA-N 0.000 description 1
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 1
- WZLFPVPRZGTCKP-UHFFFAOYSA-N 1,1,1,3,3-pentafluorobutane Chemical compound CC(F)(F)CC(F)(F)F WZLFPVPRZGTCKP-UHFFFAOYSA-N 0.000 description 1
- CKTHSDRLKQSKHI-UHFFFAOYSA-N 1,2,2-triisocyanato-9,9-dimethyldecane Chemical compound CC(CCCCCCC(CN=C=O)(N=C=O)N=C=O)(C)C CKTHSDRLKQSKHI-UHFFFAOYSA-N 0.000 description 1
- FAZUWMOGQKEUHE-UHFFFAOYSA-N 1,2-bis(2-isocyanatoethyl)benzene Chemical compound O=C=NCCC1=CC=CC=C1CCN=C=O FAZUWMOGQKEUHE-UHFFFAOYSA-N 0.000 description 1
- YCFNKSOIDNKUIO-UHFFFAOYSA-N 1,2-bis(4-isocyanatobutyl)benzene Chemical compound O=C=NCCCCC1=CC=CC=C1CCCCN=C=O YCFNKSOIDNKUIO-UHFFFAOYSA-N 0.000 description 1
- WZROIUBWZBSCSE-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)naphthalene Chemical compound C1=CC=CC2=C(CN=C=O)C(CN=C=O)=CC=C21 WZROIUBWZBSCSE-UHFFFAOYSA-N 0.000 description 1
- MMJDYWRDMVPQPF-UHFFFAOYSA-N 1,2-diisocyanato-3,4-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=C(N=C=O)C(N=C=O)=C1C(C)C MMJDYWRDMVPQPF-UHFFFAOYSA-N 0.000 description 1
- LUYHWJKHJNFYGV-UHFFFAOYSA-N 1,2-diisocyanato-3-phenylbenzene Chemical compound O=C=NC1=CC=CC(C=2C=CC=CC=2)=C1N=C=O LUYHWJKHJNFYGV-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- KCENFBLAEKHLPA-UHFFFAOYSA-N 1-(3-hydroxypropyl)cyclohexan-1-ol Chemical compound OCCCC1(O)CCCCC1 KCENFBLAEKHLPA-UHFFFAOYSA-N 0.000 description 1
- GPDGKZZHMPQKSF-UHFFFAOYSA-N 1-cyclohexyl-2-propan-2-ylidenecyclohexan-1-ol Chemical compound CC(C)=C1C(CCCC1)(C1CCCCC1)O GPDGKZZHMPQKSF-UHFFFAOYSA-N 0.000 description 1
- ARZVTHZVFOVAEV-UHFFFAOYSA-N 1-isocyanato-1-[1-(1-isocyanatocyclohexyl)ethyl]cyclohexane Chemical compound C1CCCCC1(N=C=O)C(C)C1(N=C=O)CCCCC1 ARZVTHZVFOVAEV-UHFFFAOYSA-N 0.000 description 1
- QIVRKSLMUAURGI-UHFFFAOYSA-N 1-isocyanato-1-[2-(1-isocyanatocyclohexyl)propan-2-yl]cyclohexane Chemical compound C1CCCCC1(N=C=O)C(C)(C)C1(N=C=O)CCCCC1 QIVRKSLMUAURGI-UHFFFAOYSA-N 0.000 description 1
- QLOQTKGUQKAAAB-UHFFFAOYSA-N 1-isocyanato-2-(2-isocyanatoethoxy)ethane Chemical compound O=C=NCCOCCN=C=O QLOQTKGUQKAAAB-UHFFFAOYSA-N 0.000 description 1
- MQCPOLNSJCWPGT-UHFFFAOYSA-N 2,2'-Bisphenol F Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1O MQCPOLNSJCWPGT-UHFFFAOYSA-N 0.000 description 1
- NVEBCYZIHQCMHT-UHFFFAOYSA-N 2,2-diethylhexanedioic acid Chemical compound CCC(CC)(C(O)=O)CCCC(O)=O NVEBCYZIHQCMHT-UHFFFAOYSA-N 0.000 description 1
- OCBYGPJFYSLMCU-UHFFFAOYSA-N 2,3,4,5-tetrachloro-6-[2-(2,3,4,5-tetrachloro-6-hydroxyphenyl)propan-2-yl]phenol Chemical compound OC=1C(Cl)=C(Cl)C(Cl)=C(Cl)C=1C(C)(C)C1=C(O)C(Cl)=C(Cl)C(Cl)=C1Cl OCBYGPJFYSLMCU-UHFFFAOYSA-N 0.000 description 1
- RZYBIMCOINYYNW-UHFFFAOYSA-N 2,3-bis(isocyanatomethyl)furan Chemical compound O=C=NCC=1C=COC=1CN=C=O RZYBIMCOINYYNW-UHFFFAOYSA-N 0.000 description 1
- UMPSXRYVXUPCOS-UHFFFAOYSA-N 2,3-dichlorophenol Chemical compound OC1=CC=CC(Cl)=C1Cl UMPSXRYVXUPCOS-UHFFFAOYSA-N 0.000 description 1
- WDHFRWNUJIDVAZ-UHFFFAOYSA-N 2-(1-cyanobutyldiazenyl)pentanenitrile Chemical compound CCCC(C#N)N=NC(C#N)CCC WDHFRWNUJIDVAZ-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- VXHYVVAUHMGCEX-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)phenol Chemical compound OC1=CC=CC=C1OC1=CC=CC=C1O VXHYVVAUHMGCEX-UHFFFAOYSA-N 0.000 description 1
- QUWAJPZDCZDTJS-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfonylphenol Chemical compound OC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1O QUWAJPZDCZDTJS-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- FTGOTFUFFUFNGU-UHFFFAOYSA-N 2-isocyanato-1-[(2-isocyanato-3-methylphenyl)methyl]-3-methylbenzene Chemical compound CC1=CC=CC(CC=2C(=C(C)C=CC=2)N=C=O)=C1N=C=O FTGOTFUFFUFNGU-UHFFFAOYSA-N 0.000 description 1
- HTFUJNKBHJLFIQ-UHFFFAOYSA-N 3,4-dibromo-2-[2-(2,3-dibromo-6-hydroxyphenyl)propan-2-yl]phenol Chemical compound OC=1C=CC(Br)=C(Br)C=1C(C)(C)C1=C(O)C=CC(Br)=C1Br HTFUJNKBHJLFIQ-UHFFFAOYSA-N 0.000 description 1
- PGSWEKYNAOWQDF-UHFFFAOYSA-N 3-methylcatechol Chemical compound CC1=CC=CC(O)=C1O PGSWEKYNAOWQDF-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- GUBGYTABKSRVRQ-XLOQQCSPSA-N Alpha-Lactose Chemical compound O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@H]1O[C@@H]1[C@@H](CO)O[C@H](O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-XLOQQCSPSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- XRJZRCFFGYREGQ-UHFFFAOYSA-N C(C)CCCCCCCC.[O] Chemical compound C(C)CCCCCCCC.[O] XRJZRCFFGYREGQ-UHFFFAOYSA-N 0.000 description 1
- NKGVFBPGKXSVCD-UHFFFAOYSA-N C1CC1.N=C=O.N=C=O Chemical compound C1CC1.N=C=O.N=C=O NKGVFBPGKXSVCD-UHFFFAOYSA-N 0.000 description 1
- MAMABHFMIUQTIY-UHFFFAOYSA-N CC1=CC=CC=C1.N=C=O.N=C=O.N=C=O Chemical compound CC1=CC=CC=C1.N=C=O.N=C=O.N=C=O MAMABHFMIUQTIY-UHFFFAOYSA-N 0.000 description 1
- QMFJYNOVTQYLTA-UHFFFAOYSA-N CCCCCCCCCCC.N=C=O.N=C=O.N=C=O Chemical compound CCCCCCCCCCC.N=C=O.N=C=O.N=C=O QMFJYNOVTQYLTA-UHFFFAOYSA-N 0.000 description 1
- LIVCRXGLXLDLIY-UHFFFAOYSA-N COC(C1=CC=CC=C1C(O)=O)=O.N=C=O.N=C=O Chemical compound COC(C1=CC=CC=C1C(O)=O)=O.N=C=O.N=C=O LIVCRXGLXLDLIY-UHFFFAOYSA-N 0.000 description 1
- GASHPBNAWAEWCX-UHFFFAOYSA-N COC(C=C1)=CC=C1C(C=C1)=CC=C1OC.N=C=O.N=C=O Chemical compound COC(C=C1)=CC=C1C(C=C1)=CC=C1OC.N=C=O.N=C=O GASHPBNAWAEWCX-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229920000858 Cyclodextrin Polymers 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- GUBGYTABKSRVRQ-QKKXKWKRSA-N Lactose Natural products OC[C@H]1O[C@@H](O[C@H]2[C@H](O)[C@@H](O)C(O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@H]1O GUBGYTABKSRVRQ-QKKXKWKRSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- ZMRNTPSLQDZXBU-UHFFFAOYSA-N N=C=O.N=C=O.C12=CC=CC=C2NC2=C1C=CC=C2CC Chemical compound N=C=O.N=C=O.C12=CC=CC=C2NC2=C1C=CC=C2CC ZMRNTPSLQDZXBU-UHFFFAOYSA-N 0.000 description 1
- TWZLXXVREXAEJX-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=C2C(C)=CC=CC2=C1 Chemical compound N=C=O.N=C=O.C1=CC=C2C(C)=CC=CC2=C1 TWZLXXVREXAEJX-UHFFFAOYSA-N 0.000 description 1
- BYKRKNWETSJWGI-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=C2C3=CC=C(Cl)C(Cl)=C3NC2=C1 Chemical compound N=C=O.N=C=O.C1=CC=C2C3=CC=C(Cl)C(Cl)=C3NC2=C1 BYKRKNWETSJWGI-UHFFFAOYSA-N 0.000 description 1
- OGTYCYGFMVPCCV-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=C2C3=CC=CC=C3NC2=C1 Chemical compound N=C=O.N=C=O.C1=CC=C2C3=CC=CC=C3NC2=C1 OGTYCYGFMVPCCV-UHFFFAOYSA-N 0.000 description 1
- BWFXWVBNXDQDCY-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC=C1.C Chemical compound N=C=O.N=C=O.C1=CC=CC=C1.C BWFXWVBNXDQDCY-UHFFFAOYSA-N 0.000 description 1
- DEMHZMDSLWQANG-UHFFFAOYSA-N N=C=O.N=C=O.C1CCC1 Chemical compound N=C=O.N=C=O.C1CCC1 DEMHZMDSLWQANG-UHFFFAOYSA-N 0.000 description 1
- ZTCFKBWDKVMLMM-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 ZTCFKBWDKVMLMM-UHFFFAOYSA-N 0.000 description 1
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 1
- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- DBUQEARUZIATSV-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1(C)C Chemical compound N=C=O.N=C=O.CC1CCCCC1(C)C DBUQEARUZIATSV-UHFFFAOYSA-N 0.000 description 1
- DPHWNPWDAKADSA-UHFFFAOYSA-N N=C=O.N=C=O.CCC(C)(C)CC Chemical compound N=C=O.N=C=O.CCC(C)(C)CC DPHWNPWDAKADSA-UHFFFAOYSA-N 0.000 description 1
- KYIMHWNKQXQBDG-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCC Chemical compound N=C=O.N=C=O.CCCCCC KYIMHWNKQXQBDG-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- JEQBFCJBVVFPGT-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C=CC=C2)C2=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C=CC=C2)C2=C1 JEQBFCJBVVFPGT-UHFFFAOYSA-N 0.000 description 1
- LRNAHSCPGKWOIY-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=CC=C1 LRNAHSCPGKWOIY-UHFFFAOYSA-N 0.000 description 1
- PIKIGJZHZOFPHO-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.N=C=O.C1CCCCC1 PIKIGJZHZOFPHO-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- XDEROBJPINCWPT-UHFFFAOYSA-N [O].CCCCCCCCCC(C)C Chemical compound [O].CCCCCCCCCC(C)C XDEROBJPINCWPT-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 230000029936 alkylation Effects 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 description 1
- DZYFUUQMKQBVBY-UHFFFAOYSA-N bis(2-isocyanatoethyl) carbonate Chemical compound O=C=NCCOC(=O)OCCN=C=O DZYFUUQMKQBVBY-UHFFFAOYSA-N 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical class NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- MBZFMVVPAZRBEN-UHFFFAOYSA-N cyclohexane ethanol Chemical compound CCO.CCO.C1CCCCC1 MBZFMVVPAZRBEN-UHFFFAOYSA-N 0.000 description 1
- FNTHQRXVZDCWSP-UHFFFAOYSA-N cyclohexane-1,1,2-triol Chemical compound OC1CCCCC1(O)O FNTHQRXVZDCWSP-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- UYDJAHJCGZTTHB-UHFFFAOYSA-N cyclopentane-1,1-diol Chemical compound OC1(O)CCCC1 UYDJAHJCGZTTHB-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- HHACNQLZWJFHIC-UHFFFAOYSA-N isocyano cyanate Chemical compound [C-]#[N+]OC#N HHACNQLZWJFHIC-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000008101 lactose Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- CQRYARSYNCAZFO-UHFFFAOYSA-N o-hydroxybenzyl alcohol Natural products OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- BVJSUAQZOZWCKN-UHFFFAOYSA-N p-hydroxybenzyl alcohol Chemical compound OCC1=CC=C(O)C=C1 BVJSUAQZOZWCKN-UHFFFAOYSA-N 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 235000000346 sugar Nutrition 0.000 description 1
- 150000008163 sugars Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/35—Composite foams, i.e. continuous macromolecular foams containing discontinuous cellular particles or fragments
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/10—Water or water-releasing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/14—Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
- C08J2203/142—Halogenated saturated hydrocarbons, e.g. H3C-CF3
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261613398P | 2012-03-20 | 2012-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201347907A TW201347907A (zh) | 2013-12-01 |
| TWI574782B true TWI574782B (zh) | 2017-03-21 |
Family
ID=49212255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102108998A TWI574782B (zh) | 2012-03-20 | 2013-03-14 | 自我調節硏磨墊及其製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9050697B2 (enExample) |
| JP (1) | JP6078631B2 (enExample) |
| KR (1) | KR101532896B1 (enExample) |
| CN (1) | CN104302446B (enExample) |
| TW (1) | TWI574782B (enExample) |
| WO (1) | WO2013142134A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9050697B2 (en) | 2012-03-20 | 2015-06-09 | Jh Rhodes Company, Inc. | Self-conditioning polishing pad and a method of making the same |
| US10813444B2 (en) | 2018-05-16 | 2020-10-27 | Jh Rhodes Company, Inc. | Porous polymeric polishing bristles and methods for their manufacture |
| KR101783406B1 (ko) * | 2016-12-07 | 2017-10-10 | 엠.씨.케이 (주) | 연마 패드 및 이의 제조방법 |
| US11551936B2 (en) * | 2018-07-31 | 2023-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-healing polishing pad |
| CN112080209B (zh) * | 2020-09-11 | 2022-04-12 | 宁波江丰电子材料股份有限公司 | 一种冷却水盘和冷却管的粘结方法 |
| CN117999150A (zh) | 2021-09-02 | 2024-05-07 | Cmc材料有限责任公司 | 包含聚合物颗粒的纹理化cmp垫 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200404648A (en) * | 2002-05-23 | 2004-04-01 | Cabot Microelectronics Corp | Microporous polishing pads |
| TW200414967A (en) * | 2002-11-05 | 2004-08-16 | Jsr Corp | Polishing pad |
| TW200528529A (en) * | 2000-05-31 | 2005-09-01 | Jsr Corp | Composition for polishing pad and polishing pad using the same |
| US20100221983A1 (en) * | 2009-01-05 | 2010-09-02 | Innopad, Inc. | Multi-layered chemical-mechanical planarization pad |
| TW201130656A (en) * | 2009-12-22 | 2011-09-16 | 3M Innovative Properties Co | Polishing pad and method of making the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4155790B2 (ja) * | 2002-10-18 | 2008-09-24 | 株式会社東芝 | 化学機械研磨方法及び素子微細化分離用研磨パッド |
| US20040224622A1 (en) * | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
| US20050176251A1 (en) | 2004-02-05 | 2005-08-11 | Duong Chau H. | Polishing pad with releasable slick particles |
| CN100424830C (zh) | 2004-04-23 | 2008-10-08 | Jsr株式会社 | 用于抛光半导体晶片的抛光垫、层叠体和方法 |
| JP4897238B2 (ja) * | 2005-05-17 | 2012-03-14 | 東洋ゴム工業株式会社 | 研磨パッド |
| US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
| JP4379462B2 (ja) * | 2006-10-31 | 2009-12-09 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| US8491360B2 (en) * | 2007-10-26 | 2013-07-23 | Innopad, Inc. | Three-dimensional network in CMP pad |
| KR100955032B1 (ko) | 2008-05-20 | 2010-04-28 | (주)피에스텍 | 연마용 폴리우레탄 흡착 패드 조성물, 연마용 폴리우레탄흡착 패드 및 그 제조방법 |
| KR101352235B1 (ko) * | 2009-05-27 | 2014-01-15 | 로저스코포레이션 | 연마 패드, 이를 위한 폴리우레탄층, 및 규소 웨이퍼의 연마 방법 |
| WO2012138705A2 (en) | 2011-04-05 | 2012-10-11 | Universal Photonics, Inc. | A self-conditioning polishing pad and a method of making the same |
| US9050697B2 (en) | 2012-03-20 | 2015-06-09 | Jh Rhodes Company, Inc. | Self-conditioning polishing pad and a method of making the same |
-
2013
- 2013-03-12 US US13/797,121 patent/US9050697B2/en active Active
- 2013-03-12 KR KR1020147029262A patent/KR101532896B1/ko not_active Expired - Fee Related
- 2013-03-12 JP JP2015501730A patent/JP6078631B2/ja not_active Expired - Fee Related
- 2013-03-12 CN CN201380015440.8A patent/CN104302446B/zh not_active Expired - Fee Related
- 2013-03-12 WO PCT/US2013/030353 patent/WO2013142134A1/en not_active Ceased
- 2013-03-14 TW TW102108998A patent/TWI574782B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200528529A (en) * | 2000-05-31 | 2005-09-01 | Jsr Corp | Composition for polishing pad and polishing pad using the same |
| TW200404648A (en) * | 2002-05-23 | 2004-04-01 | Cabot Microelectronics Corp | Microporous polishing pads |
| TW200414967A (en) * | 2002-11-05 | 2004-08-16 | Jsr Corp | Polishing pad |
| US20100221983A1 (en) * | 2009-01-05 | 2010-09-02 | Innopad, Inc. | Multi-layered chemical-mechanical planarization pad |
| TW201130656A (en) * | 2009-12-22 | 2011-09-16 | 3M Innovative Properties Co | Polishing pad and method of making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201347907A (zh) | 2013-12-01 |
| KR20140130240A (ko) | 2014-11-07 |
| JP2015510847A (ja) | 2015-04-13 |
| US20130252519A1 (en) | 2013-09-26 |
| JP6078631B2 (ja) | 2017-02-08 |
| CN104302446A (zh) | 2015-01-21 |
| WO2013142134A1 (en) | 2013-09-26 |
| KR101532896B1 (ko) | 2015-06-30 |
| CN104302446B (zh) | 2017-10-31 |
| US9050697B2 (en) | 2015-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI574782B (zh) | 自我調節硏磨墊及其製造方法 | |
| KR100898303B1 (ko) | 연마용 패드 | |
| TWI404736B (zh) | Polishing pad and manufacturing method thereof | |
| US7378454B2 (en) | Polyurethane composition and polishing pad | |
| JP5024639B2 (ja) | 高分子シェルに封入された液状有機物コアを含む化学的機械的研磨パッド及びその製造方法 | |
| CN104661794B (zh) | 非平面的玻璃抛光垫及制造方法 | |
| CN106661434B (zh) | 用于抛光硬表面的抛光材料、包括所述材料的介质及其形成和使用方法 | |
| SG184140A1 (en) | Polishing pad | |
| CN101530988B (zh) | 一种研磨垫、研磨垫制造方法及一种半导体器件制造方法 | |
| US20080146129A1 (en) | Fast break-in polishing pad and a method of making the same | |
| JP2010274361A (ja) | 研磨パッド | |
| WO2012138705A2 (en) | A self-conditioning polishing pad and a method of making the same | |
| CN108789186B (zh) | 制造具有改进均匀性的化学机械抛光层的方法 | |
| TWI743043B (zh) | 高分子拋光材料、含高分子拋光材料的媒體和系統、及其形成和使用的方法 | |
| JP5221992B2 (ja) | 研磨パッド | |
| JP6435222B2 (ja) | 研磨パッド及びその製造方法並びに研磨加工方法 | |
| JP6444507B2 (ja) | 研磨パッドの製造方法 | |
| TWI745432B (zh) | 研磨墊 | |
| JP2009066675A (ja) | 研磨パッドおよび研磨パッドの製造方法 | |
| JP2024129141A (ja) | 研磨パッド、その製造方法、およびそれを用いた半導体素子の製造方法 | |
| JP6691658B2 (ja) | 研磨パッド | |
| CN118891132A (zh) | 研磨垫、研磨垫的制造方法和对光学材料或半导体材料的表面进行研磨的方法 | |
| JP2005169571A (ja) | 微細気泡を有する研磨パッド用発泡ポリウレタンの製造方法。 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |