JP2015510847A5 - - Google Patents

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Publication number
JP2015510847A5
JP2015510847A5 JP2015501730A JP2015501730A JP2015510847A5 JP 2015510847 A5 JP2015510847 A5 JP 2015510847A5 JP 2015501730 A JP2015501730 A JP 2015501730A JP 2015501730 A JP2015501730 A JP 2015501730A JP 2015510847 A5 JP2015510847 A5 JP 2015510847A5
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JP
Japan
Prior art keywords
insoluble polymer
polymer foam
particles
coated
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015501730A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015510847A (ja
JP6078631B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/030353 external-priority patent/WO2013142134A1/en
Publication of JP2015510847A publication Critical patent/JP2015510847A/ja
Publication of JP2015510847A5 publication Critical patent/JP2015510847A5/ja
Application granted granted Critical
Publication of JP6078631B2 publication Critical patent/JP6078631B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015501730A 2012-03-20 2013-03-12 セルフコンディショニング研磨パッドおよびその作製方法 Expired - Fee Related JP6078631B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261613398P 2012-03-20 2012-03-20
US61/613,398 2012-03-20
PCT/US2013/030353 WO2013142134A1 (en) 2012-03-20 2013-03-12 A self-conditioning polishing pad and a method of making the same

Publications (3)

Publication Number Publication Date
JP2015510847A JP2015510847A (ja) 2015-04-13
JP2015510847A5 true JP2015510847A5 (enExample) 2016-03-31
JP6078631B2 JP6078631B2 (ja) 2017-02-08

Family

ID=49212255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015501730A Expired - Fee Related JP6078631B2 (ja) 2012-03-20 2013-03-12 セルフコンディショニング研磨パッドおよびその作製方法

Country Status (6)

Country Link
US (1) US9050697B2 (enExample)
JP (1) JP6078631B2 (enExample)
KR (1) KR101532896B1 (enExample)
CN (1) CN104302446B (enExample)
TW (1) TWI574782B (enExample)
WO (1) WO2013142134A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
US10813444B2 (en) 2018-05-16 2020-10-27 Jh Rhodes Company, Inc. Porous polymeric polishing bristles and methods for their manufacture
KR101783406B1 (ko) * 2016-12-07 2017-10-10 엠.씨.케이 (주) 연마 패드 및 이의 제조방법
US11551936B2 (en) * 2018-07-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Self-healing polishing pad
CN112080209B (zh) * 2020-09-11 2022-04-12 宁波江丰电子材料股份有限公司 一种冷却水盘和冷却管的粘结方法
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP4155790B2 (ja) * 2002-10-18 2008-09-24 株式会社東芝 化学機械研磨方法及び素子微細化分離用研磨パッド
JP4039214B2 (ja) * 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20050176251A1 (en) 2004-02-05 2005-08-11 Duong Chau H. Polishing pad with releasable slick particles
CN100424830C (zh) 2004-04-23 2008-10-08 Jsr株式会社 用于抛光半导体晶片的抛光垫、层叠体和方法
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
US7169031B1 (en) * 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
JP4379462B2 (ja) * 2006-10-31 2009-12-09 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
KR100955032B1 (ko) 2008-05-20 2010-04-28 (주)피에스텍 연마용 폴리우레탄 흡착 패드 조성물, 연마용 폴리우레탄흡착 패드 및 그 제조방법
WO2010078566A1 (en) * 2009-01-05 2010-07-08 Innopad, Inc. Multi-layered chemical-mechanical planarization pad
KR101352235B1 (ko) * 2009-05-27 2014-01-15 로저스코포레이션 연마 패드, 이를 위한 폴리우레탄층, 및 규소 웨이퍼의 연마 방법
US20130012108A1 (en) 2009-12-22 2013-01-10 Naichao Li Polishing pad and method of making the same
WO2012138705A2 (en) 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same

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