JP6075993B2 - 板状ワーク中心検出方法 - Google Patents

板状ワーク中心検出方法 Download PDF

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Publication number
JP6075993B2
JP6075993B2 JP2012172135A JP2012172135A JP6075993B2 JP 6075993 B2 JP6075993 B2 JP 6075993B2 JP 2012172135 A JP2012172135 A JP 2012172135A JP 2012172135 A JP2012172135 A JP 2012172135A JP 6075993 B2 JP6075993 B2 JP 6075993B2
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JP
Japan
Prior art keywords
plate
workpiece
imaging
wafer
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012172135A
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English (en)
Japanese (ja)
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JP2014033049A (ja
Inventor
暢之 福士
暢之 福士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2012172135A priority Critical patent/JP6075993B2/ja
Priority to TW102124163A priority patent/TWI596316B/zh
Priority to KR1020130088048A priority patent/KR101952971B1/ko
Priority to CN201310331389.3A priority patent/CN103579064B/zh
Publication of JP2014033049A publication Critical patent/JP2014033049A/ja
Application granted granted Critical
Publication of JP6075993B2 publication Critical patent/JP6075993B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2012172135A 2012-08-02 2012-08-02 板状ワーク中心検出方法 Active JP6075993B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012172135A JP6075993B2 (ja) 2012-08-02 2012-08-02 板状ワーク中心検出方法
TW102124163A TWI596316B (zh) 2012-08-02 2013-07-05 Plate work center test method
KR1020130088048A KR101952971B1 (ko) 2012-08-02 2013-07-25 판형 워크 중심 검출 방법
CN201310331389.3A CN103579064B (zh) 2012-08-02 2013-08-01 板状工件中心检测方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012172135A JP6075993B2 (ja) 2012-08-02 2012-08-02 板状ワーク中心検出方法

Publications (2)

Publication Number Publication Date
JP2014033049A JP2014033049A (ja) 2014-02-20
JP6075993B2 true JP6075993B2 (ja) 2017-02-08

Family

ID=50050554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012172135A Active JP6075993B2 (ja) 2012-08-02 2012-08-02 板状ワーク中心検出方法

Country Status (4)

Country Link
JP (1) JP6075993B2 (zh)
KR (1) KR101952971B1 (zh)
CN (1) CN103579064B (zh)
TW (1) TWI596316B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6210902B2 (ja) * 2014-02-18 2017-10-11 株式会社ディスコ レーザー加工溝の検出方法
CN109000570A (zh) * 2018-07-28 2018-12-14 大连云腾机械制造有限公司 高精度工件高度检测仪
JP2022078570A (ja) 2020-11-13 2022-05-25 株式会社ディスコ 中心検出装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161637A (ja) * 1986-12-25 1988-07-05 Toshiba Corp 半導体ウエ−ハの位置認識装置
JPH07211766A (ja) 1994-01-14 1995-08-11 Disco Abrasive Syst Ltd 中心合わせ装置
JP4117762B2 (ja) * 2001-07-04 2008-07-16 松下電器産業株式会社 基板の位置決め方法と装置
JP4385699B2 (ja) * 2003-09-25 2009-12-16 オムロン株式会社 半導体ウェーハの方向調整方法および半導体ウェーハの方向調整装置
JP4774332B2 (ja) * 2006-06-06 2011-09-14 富士フイルム株式会社 偏芯量測定方法
KR100978487B1 (ko) * 2008-12-29 2010-08-30 에이티아이 주식회사 기판검사용 조명장치
TWM387242U (en) * 2010-04-09 2010-08-21 Nat Applied Res Laboratories Eccentric inspection device of optical lens
JP5588748B2 (ja) * 2010-06-02 2014-09-10 株式会社ディスコ 研削装置

Also Published As

Publication number Publication date
CN103579064A (zh) 2014-02-12
KR101952971B1 (ko) 2019-02-27
TW201411088A (zh) 2014-03-16
JP2014033049A (ja) 2014-02-20
KR20140018116A (ko) 2014-02-12
TWI596316B (zh) 2017-08-21
CN103579064B (zh) 2017-08-04

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