JP2014033049A - 板状ワーク中心検出方法 - Google Patents
板状ワーク中心検出方法 Download PDFInfo
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- JP2014033049A JP2014033049A JP2012172135A JP2012172135A JP2014033049A JP 2014033049 A JP2014033049 A JP 2014033049A JP 2012172135 A JP2012172135 A JP 2012172135A JP 2012172135 A JP2012172135 A JP 2012172135A JP 2014033049 A JP2014033049 A JP 2014033049A
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- 238000001514 detection method Methods 0.000 title claims abstract description 37
- 238000003384 imaging method Methods 0.000 claims description 96
- 238000005286 illumination Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000004069 differentiation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
【解決手段】透光性の板状ワーク(Wt)を保持する保持面(14b)を有する保持テーブル(14)と、保持テーブルに保持された板状ワークを上方から撮像する撮像手段(17)と、板状ワークより広い面積の発光面(12a)を有し、撮像手段による撮像の際に板状ワークを下方から照光する撮像照明(12)と、で構成されるワーク撮像装置(1)において、撮像照明の発光面と保持テーブルの保持面との間に所定の間隔(D)を確保して板状ワークに垂直に照光させると共に、板状ワークの外周がリング状に黒色に撮像され、板状ワークの外側が白色に撮像されるように撮像カメラ(17b)の高さ(H)を設定した。
【選択図】図2
Description
11 基台
11a 上面
12 撮像照明
12a 発光面
13 テーブル支柱
14 保持テーブル
14a 吸着部
14b 保持面
15 吸引源
15a 配管
16 支持アーム
17 撮像手段
17a レンズ
17b 撮像カメラ
17c 判断部
17d 検出部
17e 配線
D 間隔
H 高さ
L 照明光(撮像光)
Wt,Ws ウェーハ(板状ワーク)
Claims (1)
- 透光性の板状ワークを保持面で保持する保持テーブルと、該保持テーブルに保持された板状ワークを撮像する撮像手段と、該撮像手段が撮像する際に該保持テーブルの下から板状ワークを照光する撮像照明と、で構成されるワーク撮像装置を用いて、板状ワークの中心を検出する板状ワーク中心検出方法であって、
該撮像照明は、該保持テーブルが保持する板状ワークより広い面積の発光面で構成され、該発光面から垂直に撮像光を発光し、
該撮像手段は、該保持テーブルに保持された板状ワークの上方に配設され板状ワークを撮像する撮像カメラと、該撮像カメラが撮像した撮像画像から該板状ワーク外周を判断する判断部と、該判断部が判断した板状ワーク外周から該板状ワーク中心を検出する検出部と、で構成され、
該発光面と該保持テーブルの該保持面との間には所定の間隔が確保されていて、
該撮像手段で、該保持テーブルが保持する板状ワークを撮像した時、該板状ワークの外周がリング状に黒色で、該板状ワークの外側が白色の撮像画像になるように該撮像カメラの高さが設定される板状ワーク中心検出方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012172135A JP6075993B2 (ja) | 2012-08-02 | 2012-08-02 | 板状ワーク中心検出方法 |
TW102124163A TWI596316B (zh) | 2012-08-02 | 2013-07-05 | Plate work center test method |
KR1020130088048A KR101952971B1 (ko) | 2012-08-02 | 2013-07-25 | 판형 워크 중심 검출 방법 |
CN201310331389.3A CN103579064B (zh) | 2012-08-02 | 2013-08-01 | 板状工件中心检测方法 |
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---|---|---|---|
JP2012172135A JP6075993B2 (ja) | 2012-08-02 | 2012-08-02 | 板状ワーク中心検出方法 |
Publications (2)
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JP2014033049A true JP2014033049A (ja) | 2014-02-20 |
JP6075993B2 JP6075993B2 (ja) | 2017-02-08 |
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JP2012172135A Active JP6075993B2 (ja) | 2012-08-02 | 2012-08-02 | 板状ワーク中心検出方法 |
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JP (1) | JP6075993B2 (ja) |
KR (1) | KR101952971B1 (ja) |
CN (1) | CN103579064B (ja) |
TW (1) | TWI596316B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220065671A (ko) | 2020-11-13 | 2022-05-20 | 가부시기가이샤 디스코 | 중심 검출 장치 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6210902B2 (ja) * | 2014-02-18 | 2017-10-11 | 株式会社ディスコ | レーザー加工溝の検出方法 |
CN109000570A (zh) * | 2018-07-28 | 2018-12-14 | 大连云腾机械制造有限公司 | 高精度工件高度检测仪 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63161637A (ja) * | 1986-12-25 | 1988-07-05 | Toshiba Corp | 半導体ウエ−ハの位置認識装置 |
JP2003017545A (ja) * | 2001-07-04 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 基板の位置決め方法と装置 |
JP2005101307A (ja) * | 2003-09-25 | 2005-04-14 | Omron Corp | ノッチのずれ補正のための補正角度検出方法、真空槽における半導体ウェーハの方向調整方法、ノッチのずれ補正のための補正角度検出装置、および半導体ウェーハの方向調整装置 |
JP2011253936A (ja) * | 2010-06-02 | 2011-12-15 | Disco Abrasive Syst Ltd | 研削装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211766A (ja) | 1994-01-14 | 1995-08-11 | Disco Abrasive Syst Ltd | 中心合わせ装置 |
JP4774332B2 (ja) * | 2006-06-06 | 2011-09-14 | 富士フイルム株式会社 | 偏芯量測定方法 |
KR100978487B1 (ko) * | 2008-12-29 | 2010-08-30 | 에이티아이 주식회사 | 기판검사용 조명장치 |
TWM387242U (en) * | 2010-04-09 | 2010-08-21 | Nat Applied Res Laboratories | Eccentric inspection device of optical lens |
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2012
- 2012-08-02 JP JP2012172135A patent/JP6075993B2/ja active Active
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2013
- 2013-07-05 TW TW102124163A patent/TWI596316B/zh active
- 2013-07-25 KR KR1020130088048A patent/KR101952971B1/ko active IP Right Grant
- 2013-08-01 CN CN201310331389.3A patent/CN103579064B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63161637A (ja) * | 1986-12-25 | 1988-07-05 | Toshiba Corp | 半導体ウエ−ハの位置認識装置 |
JP2003017545A (ja) * | 2001-07-04 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 基板の位置決め方法と装置 |
JP2005101307A (ja) * | 2003-09-25 | 2005-04-14 | Omron Corp | ノッチのずれ補正のための補正角度検出方法、真空槽における半導体ウェーハの方向調整方法、ノッチのずれ補正のための補正角度検出装置、および半導体ウェーハの方向調整装置 |
JP2011253936A (ja) * | 2010-06-02 | 2011-12-15 | Disco Abrasive Syst Ltd | 研削装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220065671A (ko) | 2020-11-13 | 2022-05-20 | 가부시기가이샤 디스코 | 중심 검출 장치 |
Also Published As
Publication number | Publication date |
---|---|
TWI596316B (zh) | 2017-08-21 |
CN103579064A (zh) | 2014-02-12 |
CN103579064B (zh) | 2017-08-04 |
KR20140018116A (ko) | 2014-02-12 |
TW201411088A (zh) | 2014-03-16 |
JP6075993B2 (ja) | 2017-02-08 |
KR101952971B1 (ko) | 2019-02-27 |
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