JP6072680B2 - 封止ガラス管内のtlレトロフィットledモジュール - Google Patents
封止ガラス管内のtlレトロフィットledモジュール Download PDFInfo
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- JP6072680B2 JP6072680B2 JP2013517637A JP2013517637A JP6072680B2 JP 6072680 B2 JP6072680 B2 JP 6072680B2 JP 2013517637 A JP2013517637 A JP 2013517637A JP 2013517637 A JP2013517637 A JP 2013517637A JP 6072680 B2 JP6072680 B2 JP 6072680B2
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- emitting diode
- light emitting
- diode device
- light
- cavity
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- 239000011521 glass Substances 0.000 title claims description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 50
- 239000003566 sealing material Substances 0.000 claims description 23
- 239000007789 gas Substances 0.000 claims description 20
- 238000004320 controlled atmosphere Methods 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000008393 encapsulating agent Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 description 1
- 229930003268 Vitamin C Natural products 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000019154 vitamin C Nutrition 0.000 description 1
- 239000011718 vitamin C Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/03—Gas-tight or water-tight arrangements with provision for venting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Electroluminescent Light Sources (AREA)
Description
Claims (12)
- 外箱と、
少なくとも1つの発光ダイオードを有し、前記外箱内に配置された発光ダイオード素子と、
前記外箱の一部を構成する光出口部材と、
制御された雰囲気を含んだ封止キャビティと、
前記キャビティを封止する封止材と、を有する、発光ダイオードデバイスにおいて、
リモート有機蛍光体素子が、前記キャビティ内に配置され、
前記発光ダイオードデバイスは、前記発光ダイオード素子を収容する他のコンパートメントを有し、
ゲッタが、前記キャビティ内に配置され、
前記発光ダイオードデバイスは、ベース部を有し、
前記光出口部材は、前記封止材を用いて前記ベース部に取り付けられた外側シェルを有し、
前記発光ダイオード素子は、前記ベース部上に配置され、
前記有機蛍光体素子は、前記発光ダイオード素子を覆い、且つ、前記発光ダイオード素子と前記外側シェルとの間に配置されたフードを構成し、
前記ゲッタは、前記蛍光体フードと前記外側シェルとの間に配置される、ことを特徴とする、発光ダイオードデバイス。 - 前記ゲッタは、前記制御された雰囲気から酸素を除去する、請求項1記載の発光ダイオードデバイス。
- 前記ゲッタは、前記封止材に隣接して配置される、請求項1又は2に記載の発光ダイオードデバイス。
- 前記ゲッタは、出力光路と干渉しない位置に配置される、請求項1乃至3のいずれか1項に記載の発光ダイオードデバイス。
- 前記ゲッタは、水素ガスディスペンサを含む、請求項1乃至4のいずれか1項に記載の発光ダイオードデバイス。
- 前記封止材は、非密封性であり、酸素に対して透過性を持つ、請求項1乃至5のいずれか1項に記載の発光ダイオードデバイス。
- 前記有機蛍光体素子は、別個の素子である、請求項1乃至6のいずれか1項に記載の発光ダイオードデバイス。
- 前記光出口部材は、他のコンパートメントを覆う蓋を形成し、
前記他のコンパートメントは、周囲壁と底面とを有し、
前記周囲壁は、前記底面と前記光出口部材との間に延在し、
前記発光ダイオード素子は、前記底面上に配置される、請求項1乃至7のいずれか1項に記載の発光ダイオードデバイス。 - 前記外箱は、レトロフィットランプとして設けられている、請求項1乃至8のいずれか1項に記載の発光ダイオードデバイス。
- 外箱と、
少なくとも1つの発光ダイオードを有し、前記外箱内に配置された発光ダイオード素子と、
前記外箱の一部を構成する光出口部材と、
制御された雰囲気を含んだ封止キャビティと、
前記キャビティを封止する封止材と、を有する、発光ダイオードデバイスにおいて、
前記光出口部材は、外壁と、前記封止材により前記外壁に接続されて前記キャビティを形成する内壁を有し、
リモート有機蛍光体素子が、前記外壁と前記内壁との間の前記キャビティ内に配置され、
前記発光ダイオードデバイスは、前記発光ダイオード素子を収容する他のコンパートメントを有し、
ゲッタが、前記キャビティ内に配置され、
前記光出口部材は、円筒状のガラス管を有し、
前記外箱は、前記封止材を用いて前記円筒状のガラス管に取り付けられたエンドキャップを更に有する、発光ダイオードデバイス。 - 前記制御された雰囲気は、前記発光ダイオードデバイスの動作中に前記封止キャビティ内で生成される可能性のある物質と反応する反応性ガスを有する、請求項1乃至10のいずれか1項に記載の発光ダイオードデバイス。
- 前記反応性ガスを付与するディスペンサを更に有する、請求項11記載の発光ダイオードデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10168119 | 2010-07-01 | ||
EP10168119.5 | 2010-07-01 | ||
PCT/IB2011/052874 WO2012001645A1 (en) | 2010-07-01 | 2011-06-30 | Tl retrofit led module inside sealed glass tube |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013536569A JP2013536569A (ja) | 2013-09-19 |
JP2013536569A5 JP2013536569A5 (ja) | 2014-07-31 |
JP6072680B2 true JP6072680B2 (ja) | 2017-02-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013517637A Expired - Fee Related JP6072680B2 (ja) | 2010-07-01 | 2011-06-30 | 封止ガラス管内のtlレトロフィットledモジュール |
Country Status (8)
Country | Link |
---|---|
US (1) | US8829551B2 (ja) |
EP (1) | EP2588798B8 (ja) |
JP (1) | JP6072680B2 (ja) |
CN (1) | CN102971575B (ja) |
BR (1) | BR112012033584A2 (ja) |
IN (1) | IN2013CN00311A (ja) |
RU (1) | RU2576382C2 (ja) |
WO (1) | WO2012001645A1 (ja) |
Cited By (1)
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CN104191196B (zh) * | 2014-08-20 | 2017-02-15 | 天津京龙工程机械有限公司 | 一种齿条安装调校装置 |
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US11355676B2 (en) | 2004-05-07 | 2022-06-07 | Bruce H. Baretz | Light emitting diode |
US8791631B2 (en) | 2007-07-19 | 2014-07-29 | Quarkstar Llc | Light emitting device |
EP2402648A1 (en) * | 2010-07-01 | 2012-01-04 | Koninklijke Philips Electronics N.V. | TL retrofit LED module outside sealed glass tube |
WO2012042428A2 (en) * | 2010-09-28 | 2012-04-05 | Koninklijke Philips Electronics N.V. | Light-emitting arrangement |
CN103703307B (zh) | 2011-10-31 | 2015-08-05 | 皇家飞利浦有限公司 | 具有波长转换的紧凑光输出装置 |
JP2015515734A (ja) * | 2012-04-26 | 2015-05-28 | インテマティックス・コーポレーションIntematix Corporation | 遠隔波長変換において色の一貫性を実行する方法及び装置 |
JP6636324B2 (ja) | 2012-07-05 | 2020-01-29 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | ルミネッセンス材料を含む層のスタック、ランプ、照明器具及びそのような層のスタックを製造する方法 |
CN104756264B (zh) | 2012-09-13 | 2019-06-18 | 夸克星有限责任公司 | 具有远程散射元件和全内反射提取器元件的发光设备 |
WO2014043410A1 (en) | 2012-09-13 | 2014-03-20 | Quarkstar Llc | Light-emitting devices with reflective elements |
CN104033748B (zh) | 2013-03-07 | 2018-05-25 | 欧司朗有限公司 | 照明装置 |
FR3006546B1 (fr) * | 2013-05-28 | 2019-03-29 | Sgame | Module de diode electroluminescente lumiere blanche |
JP2016012467A (ja) * | 2014-06-28 | 2016-01-21 | 岩崎電気株式会社 | 気密封止形のledランプ |
DE102015001723A1 (de) | 2015-02-05 | 2016-08-11 | Sergey Dyukin | Die Methode der Verbesserung der Charakteristiken von Leuchtgeräten mit einer Stirnseitenbeleuchtung des Lichtleiters, die den Luminophor beinhalten, der mit Halbleiterstrukturen beleuchtet wird. |
DE102015203215A1 (de) * | 2015-02-23 | 2016-08-25 | Osram Gmbh | Lampe mit lichtdurchlässigem Kolbenrohr |
KR102283169B1 (ko) | 2015-05-11 | 2021-07-30 | 사에스 게터스 에스.페.아. | Led 시스템 |
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WO2017172975A1 (en) * | 2016-03-31 | 2017-10-05 | GE Lighting Solutions, LLC | Led lamp capsule with mantle |
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- 2011-06-30 US US13/806,305 patent/US8829551B2/en not_active Expired - Fee Related
- 2011-06-30 EP EP11738323.2A patent/EP2588798B8/en not_active Not-in-force
- 2011-06-30 WO PCT/IB2011/052874 patent/WO2012001645A1/en active Application Filing
- 2011-06-30 RU RU2013104196/07A patent/RU2576382C2/ru active
- 2011-06-30 CN CN201180033107.0A patent/CN102971575B/zh not_active Expired - Fee Related
- 2011-06-30 BR BR112012033584A patent/BR112012033584A2/pt active Search and Examination
- 2011-06-30 IN IN311CHN2013 patent/IN2013CN00311A/en unknown
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CN104191196B (zh) * | 2014-08-20 | 2017-02-15 | 天津京龙工程机械有限公司 | 一种齿条安装调校装置 |
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IN2013CN00311A (ja) | 2015-07-03 |
EP2588798A1 (en) | 2013-05-08 |
JP2013536569A (ja) | 2013-09-19 |
US20130092969A1 (en) | 2013-04-18 |
RU2013104196A (ru) | 2014-08-10 |
EP2588798B1 (en) | 2016-08-10 |
RU2576382C2 (ru) | 2016-03-10 |
CN102971575B (zh) | 2016-06-22 |
US8829551B2 (en) | 2014-09-09 |
BR112012033584A2 (pt) | 2016-09-13 |
EP2588798B8 (en) | 2016-09-21 |
CN102971575A (zh) | 2013-03-13 |
WO2012001645A1 (en) | 2012-01-05 |
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