WO2017172975A1

WO2017172975A1 - Led lamp capsule with mantle

Info

Publication number: WO2017172975A1
Application number: PCT/US2017/024833
Authority: WO
Inventors: Jon Bennett Jansma; Bruce Richard Roberts; Glenn Howard Kuenzler
Original assignee: GE Lighting Solutions, LLC
Priority date: 2016-03-31
Filing date: 2017-03-29
Publication date: 2017-10-05

Abstract

An LED lamp assembly includes a base, an envelope coupled to the base, an LED light source disposed within the envelope, and a mantle disposed within the envelope surrounding the LED light source.

Description

LED LAMP CAPSULE WITH MANTLE

CROSS-REFERENCE

[0001] The instant application claims benefit of priority from prior-filed, copending, commonly owned provisional application 62/315990, filed 31 March 2016, which is hereby incorporated by reference.

FIELD

[0002] The disclosed exemplary embodiments relate generally to lighting systems, and more particularly to light emitting diode (LED) lighting systems.

BACKGROUND

[0003] LED lighting technology continues to advance resulting in improved efficiencies and lower costs. LED light sources are found in lighting applications ranging from small pin-point sources to stadium lights. Low cost, good color rendition and high efficiency are factors driving the LED lamp market for general lighting. The ability to provide a similar amount of lumens in a package similar to those presently in use would be advantageous. Providing a lamp with a similar color temperature, shape, dimming ability, light distribution, while using less power and emitting less heat would also be advantageous.

[0004] Thermal management, color control, and sufficient lumen output are three significant challenges facing most retrofit LED lamp designs. These constraints are clearly evident when evaluating cost-effective retrofit LED efforts.

[0005] Traditionally, a short wavelength LED producing blue or UV light may be coated with a yellow phosphor in order to produce white light. However, this technique may result in heating the LED by radiating light back onto the LED. It has been demonstrated that providing phosphors at a distance from an LED light source may significantly improve the thermal behavior and efficiency of the LEDs. However, this "remote" phosphor concept suffers from excessive phosphor cost (a greater quantity of phosphor may be needed), relatively poor product appearance (a color is often visible when the lamp is not in operation), and internal reflectance demands upon surfaces near or between the LEDs and the remote phosphors. For example, in one conventional solution, blue LEDs without phosphor are used with a phosphor coating on an inner or outer bulb surface. While this helps to maintain the LED in a cool state, and provides sufficient lumens, the phosphor cost to coat the bulb may be excessive for existing phosphor types, and the lamp appearance may suffer because a salmon or yellow color can be seen when bulb is off. Molded silicone structures are sometimes utilized to locate the remote phosphors, but these are often still quite close to the LEDs and minimize the advantages of the remote concept.

[0006] Accordingly, it would be desirable to provide an LED lamp design that addresses at least some of the problems identified above.

SUMMARY

[0007] As described herein, the exemplary embodiments may overcome one or more of the above or other disadvantages known in the art.

[0008] The aspects of the disclosed embodiments are directed to an LED lamp assembly.

In one embodiment, the LED lamp assembly includes a base, an envelope coupled to the base, an LED light source disposed within the envelope, and a mantle disposed within the envelope surrounding the LED light source.

[0009] The LED light source and the mantle may be assembled together to be installed within the envelope as a unit.

[0010] A surface of the envelope may include a coating.

[0011] A surface of the mantle may be disposed a distance away from an inner surface of the envelope.

[0012] A coating may be disposed on one or more surfaces of the mantle.

[0013] The coating may include one or more phosphors.

[0014] The coating may include one or more pigments.

[0015] The coating may include one or more notch filter materials.

[0016] The coating may include a combination of one or more phosphors, pigments, and notch filter materials. [0017] The mantle may include an optical diffuser.

[0018] The mantle may have a continuous or porous form.

[0019] The mantle may be constructed of one or more of a glass, polymer, plastic, or translucent ceramic material that is configured to support a coating.

[0020] The mantle may comprise a glass tube.

[0021] The envelope may provide a hermetic seal to the LED lamp assembly.

[0022] The mantle and the LED light source may be disposed within the hermetically sealed LED lamp assembly.

[0023] The LED lamp may have a cooling gas within the envelope.

[0024] The LED light source may include one or more LED devices.

[0025] The LED light source may include at least one first LED circuit board and at least one second LED circuit board, and the at least one first LED circuit board and the at least one second LED circuit board may be arranged in a multi-board wing configuration.

[0026] The LED lamp assembly may include at least one further LED circuit board arranged with the at least one first LED circuit board and the at least one second LED circuit board to form the multi-board wing configuration.

[0027] The at least one first LED circuit board may include a first board material having a first board thickness and the at least one second LED circuit board may include a second board material having a second board thickness.

[0028] These and other aspects and advantages of the exemplary embodiments will become apparent from the following detailed description considered in conjunction with the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. Additional aspects and advantages of the invention will be set forth in the description that follows, and in part will be obvious from the description, or may be learned by practice of the invention. Moreover, the aspects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings illustrate presently preferred embodiments of the present disclosure, and together with the general description given above and the detailed description given below, serve to explain the principles of the present disclosure. As shown throughout the drawings, like reference numerals designate like or corresponding parts.

[0030] Figure 1 shows an exemplary LED lamp incorporating aspects of the disclosed embodiments that includes a mantle positioned around an LED light source;

[0031] Figure 2 shows an embodiment of an exemplary LED lamp utilizing an LED mounting platform;

[0032] Figure 3 illustrates an end view of the LED mounting platform positioned within the mantle;

[0033] Figure 4 shows an embodiment of the exemplary LED lamp utilizing an LED mounting assembly;

[0034] Figures 5A-5C show an example of the LED mounting assembly incorporating aspects of the disclosed embodiments in various stages of manufacture;

[0035] Figure 6 shows an exemplary block diagram of a power supply for an LED lamp incorporating aspects of the disclosed embodiments.

[0036] These and other aspects and advantages of the exemplary embodiments will become apparent from the following detailed description considered in conjunction with the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. Moreover, the drawings are not necessarily drawn to scale and unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein. In addition, any suitable size, shape or type of elements or materials could be used. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] As described herein, the exemplary embodiments may overcome one or more of the above or other disadvantages known in the art.

[0038] Referring to Figure 1, the aspects of the disclosed embodiments are directed to improving the performance of an LED lamp 10.

[0039] The aspects of the disclosed embodiments provide an LED lamp utilizing an LED light source and a structure that may locate a substance comprising a phosphor, a pigment, a notch filter material (or any combination of phosphors, pigments, and notch filter materials), at a selected distance from the LED light source, and at a location intermediate between the LED light source and an outer jacket (or envelope) enclosing the LED light source and said structure.

[0040] Figure 1 illustrates an exemplary LED lamp 10 that provides such a structure, referred to herein as a mantle, within the LED lamp 10. As shown in Figure 1, in this example, the LED lamp 10 includes an LED light source 100 and a mantle 105 within an outer jacket 110. According to the disclosed embodiments, the combination of the LED light source 100 and the mantle 105, which combination may be referred to as a "capsule", may be manufactured and installed as a unit within the LED lamp 10. Electrical leads 115 may be provided through the outer jacket 110 in a fashion that maintains an environment enclosed by the outer jacket 110.

[0041] The LED light source 100, in at least one embodiment, may include one or more diode packages, for example, a white-light emitting diode package such as the Nichia™ 757 package; however, the aspects of the disclosed embodiments are not so limited and other LED packages may be utilized or implemented.

[0042] For the purposes of the description herein the outer jacket 110 will be referred to as an envelope or bulb. The outer jacket 110 may be a hermetically sealed envelope with no openings, and may be constructed of glass, quartz, plastic, translucent ceramic, or any suitable material. In some embodiments, the envelope 110 may be configured to provide additional light diffusion for the LED light source 100.

[0043] In some embodiments, the envelope 110 may comprise a gaseous fill 120 that may include an inert, low atomic mass gas (for example, He and/or H₂ gas), to improve heat flow within the envelope 110. The gaseous fill 120 may also provide a moisture free environment within the envelope 110 and may prevent atmospheric reactions with water, oxygen, CO2, or other materials from occurring over time. The gaseous fill 120 may have a pressure of from about 10 torr (mm Hg) to less than about 1 atm. Effective heat transport may occur at pressures as low as approximately 50 Torr; however any suitable gas pressure may be utilized.

[0044] The mantle 105 may be positioned so as not to interfere with any conductive, convective, or other cooling mechanisms. In at least one embodiment, the mantle 105 may be constructed of one or more of a glass, polymer, plastic, translucent ceramic materials, fluorescent materials or any other suitable material suitable for supporting one or more coatings. The mantle 105 may be in a continuous form or a porous form. In some embodiments, the mantle 105 may be a glass tube. While the exemplary mantle 105 in Figures 1-4 may be generally cylindrical in overall shape, the mantle 105 may have any suitable shape. For example, the mantle 105 may comprise an oval tube, sphere, or other suitable shape. The choice of shape may be significant in that it may enhance one or more of the optical and thermal characteristics of the LED lamp 10, for example, by providing thermal performance comparable to having the remote phosphor on a surface of the envelope 110, but at a lower cost and better appearance. In some examples the mantle 105 may be coated or otherwise treated on inner surfaces, outer surfaces, or both inner and outer surfaces, and may include optical features such as light scattering or diffusion surfaces, particles, or coatings. In one or more embodiments, the mantle 105 may surround the LED light source 100 and may further symmetrically surround the LED light source 100. In at least one example, the mantle 105 may have a wall thickness of approximately 15 mils (thousandths of an inch) or 0.381 millimeters.

[0045] The exemplary mantle 105 generally provides an suitable intermediate location

(e.g., intermediate between the LED light source and the envelope), for supporting a substance comprising a phosphor, a pigment, a notch filter material, or combination thereof. In the example of Figure 1, the mantle is located between the LED light source 100 and a surface of the envelope 110 of the LED lamp 10. This intermediate location is configured to minimize the heating of the LED light source 100 by locating the substance or substances a distance from the LED light source, thus minimizing the radiation of light back onto the LED light source 100 and improving the ability to cool the LED light source 100. The use of the mantle 105 as the intermediate location for the substances generally minimizes the visual appearance of the substances when the LED lamp 10 is off, and reduces the quantity of the substances needed relative to locating the various substances on the envelope 110. Consistent with the characteristics described above, the mantle 105 may be configured to operate as an optical diffuser and as a substrate for various coatings for enhancing the light output from the LED light source 100. While the disclosed embodiments are described in the context of phosphors, pigments, and notch filter materials located on or coating the mantle 105, it should be understood that the substance or substances applied to the mantle may include any suitable light affecting substance.

[0046] A much broader range of phosphor, pigment, or notch filter material types becomes practical when the substance is located on, in, or otherwise attached to, or part of the mantle 105 due to the lower temperatures (relative to conventional locations near the LEDs) and the gaseous fill 120 which prevents reactions with atmospheric components (e.g., water, oxygen, CO2, etc.) from occurring over time. Light-affecting substances that generally cannot be used, or are difficult to use, due to thermal limitations, tendency to saturate, or are intolerant of substances in the surrounding air (for example, as mentioned above, water, oxygen, CO2, etc.) can survive much better when located in or on the mantle 105. Locating a light-affecting substance or combination of such substances on the mantle 105 as shown in Figure 1 enables the use of lower cost organic phosphors in the LED lamp 10, as well as specialty LED phosphors such as PFS red phosphor. Some high performance nitride-type red phosphors, such as europium-doped nitride type red phosphors, also become more practical in the relatively cooler conditions provided by the use of the mantle 105. Neodymium based notch filter materials may also be used.

[0047] The light-affecting substances may be applied to the mantle in the form of coatings, with exemplary coatings including one or more of potassium fluorosilicate (PFS)-based phosphors (where PFS phosphor may have the formula K2SiF₆:Mn), NdF₃, Nd₂0₃, and NdFO coatings (where NdFO refers to compositions comprising Nd, fluorine and oxygen such as a neodymium oxyfluoride). The coatings may be applied in any combination to any suitable surface of the mantle 105.

[0048] In some embodiments, the coatings may also be applied in any combination to a surface of the envelope 110, and in one or more embodiments, the coatings may be applied to both the mantle 105 and the envelope 110. In some embodiments, the envelope 105 may comprise a diffusive coating such as an electrostatic diffusive coating. In some embodiments, the LED light source 100 may include one or more white-light emitting LED packages which comprise a blue LED chip applied with or otherwise having one or more phosphors that convert blue to another color, which may also include a narrow-red phosphor such as PFS. The one or more white-light emitting LED packages with blue LED chips applied with phosphor may be used in conjunction with one or more coatings on the mantle 105 to achieve a particular color temperature. For example, an LED package with a phosphor that produces a 10000 K color temperature may be used in combination with one or more coatings on the mantle 105 to achieve a resulting color temperature of 3000 K color temperature.

[0049] In some embodiments, the mantle 105 can comprise one or more of glass and polyester screen mantles for use with blue LEDs. A modified phosphor blend can be used on the mantle 105 for modifying high Correlated Color Temperature (CCT), low Color Rendering Index (CRI) LEDs, using the mantle coatings as the vehicle for this purpose. This latter idea is a combination of remote and local phosphor techniques, or semi-remote phosphor LEDs. More flexibility in color adjustment and novel new color features for products could be achieved using this approach, utilizing existing commercial high CCT LEDs. This approach is especially favorable for temperature and moisture sensitive phosphors, such as PFS or Europium doped nitride red phosphors, which will perform better when located on the cooler mantle 105 in the inert cooling gas atmosphere.

[0050] Figure 2 illustrates another embodiment of the LED lamp 10 where the LED light source 100 is implemented as an LED mounting platform 210 within the mantle 105. In the example of Figure 2, one or more LEDs 205 are disposed on the LED mounting platform 210. A power supply 215 may be electrically coupled to the LED mounting platform 210 and may be configured to provide electrical power to the LED mounting platform 210 and the LEDs 205. In some embodiments, the LED platform 210 may be attached to the stem arrangement 115 within the envelope 110. As used herein, the term "power supply" may comprise and generally includes LED driver circuitry and/or controller circuitry. In the examples described herein, the LED mounting platform 210 and power supply 215 are wholly contained within the hermetically sealed envelope 110.

[0051] In some embodiments, the LEDs 205 may be surface mount components with a color temperature of approximately 5000 K and a light distribution pattern of approximately 120 degrees. In alternate embodiments, the LEDs 205 may comprise any suitable LEDs. For example, in one non-limiting example, the LEDs 205 may comprise a white-light emitting diode package such as the Nichia™ 757 package, as described above.

[0052] The LED mounting platform 210 may be constructed of one or more glass- reinforced epoxy laminates, composed of, for example, woven fiberglass with an epoxy resin binder, or any suitable material for mounting the LEDs 205 and power supply 215. In one embodiment, the LED mounting platform 210 may comprise a double-sided copper clad circuit board. The circuit board may be a single flat board with the LEDs 205 surface mounted to the circuit board. Figure 3 illustrates an end view of the LED platform 210 positioned within the mantle 105.

[0053] Figure 4 shows another embodiment of the LED lamp 10 utilizing an LED mounting assembly 405 as the LED light source 100, with one or more LEDs 205 disposed on the LED mounting assembly 405. This embodiment of the LED lamp 10 includes power supply 215 electrically coupled to the LED mounting assembly 405 and configured to provide electrical power to the LED mounting assembly 405 and the LEDs 205. In some embodiments, the LED mounting assembly 405 may be attached to the stem arrangement 115 within the envelope 110. According some of the disclosed embodiments, the LED mounting assembly 405 and power supply 215 are wholly contained within the hermetically sealed glass envelope 105.

[0054] Similar to other embodiments, the LEDs 205 may be surface mount components with a color temperature of approximately 5000K and a light distribution pattern of approximately 120 degrees however, the LEDs 205 can comprise any suitable LEDs or LED packages as described above. .

[0055] The LED mounting assembly 405 may comprise a plurality of glass-reinforced epoxy laminates, composed of, for example, woven fiberglass with an epoxy resin binder, or any suitable material for mounting the LEDs 205 and power supply 215. In one embodiment, the glass-reinforced epoxy laminates comprise double-sided copper clad circuit boards, upon which the LED devices 205 may be surface mounted. In one or more embodiments, the mounting assembly 405 may comprise two circuit boards 410, 415, that are notched and joined normal to each other, and form a cross shape, also referred to as a wing, or x-wing configuration. For purposes of the disclosure herein, this interlocking or wing configuration or arrangement of circuit boards will be referred to as a "multi -board wing configuration."

[0056] Although only two circuit boards 410, 415 are shown in the example of Figure 4, the aspects of the disclosed embodiments are not so limited. Any suitable combination of boards or wings can be implemented, such as 3, 4, 5 or 6, for example. The LEDs 205 may be staggered on each of the individual boards and may reflect from the other boards, creating good diffusion for a higher LED count.

[0057] In the example of Figure 4, the LEDs 205 may be distributed evenly over the four quadrants that are formed in this two board arrangement. This two board arrangement provides a greater amount of heat radiating surfaces for the LEDs 205, and can be referred to as a Cartesian platform 450.

[0058] In one embodiment, the circuit boards 410, 415 can have different materials and construction and may be referred to as a first circuit board 410, and a second circuit board 415. The different circuit boards 410, 415 can then be combined as shown in Figures 5B and 5C. For example, the first circuit board 410 could comprise a first type of material, with a first thickness and first copper plate weight. The second circuit board 415 could comprise a second type of material having a second thickness and second copper plate weight. In an arrangement with multiple boards, such as greater than two, different ones of the circuit boards can comprise different materials, thicknesses and copper plate weights. This can allow at least one of the circuit boards to be populated with the driver components and to be constructed and formed differently than another one of the circuit boards that might include the LEDs 205 and other supporting components and devices.

[0059] In the embodiment illustrated in Figures 5A-5C, circuit boards 410, 415 may be implemented using a printed circuit board (PCB) material, for example, FR-4. This type of printed circuit board material may generally have a nominal thickness of approximately .063 inches, with an approximately two (2) ounce copper layer. Other board thicknesses are also contemplated, such as approximately 0.031 inches, for example.

[0060] The copper weight used on the circuit boards 410, 415 described herein can be as thin as the standard one (1) ounce copper weight to as thick as approximately four (4) ounces. The PCB copper weight may be measured by how much it would weigh on a one (1) square foot piece of PCB. The aspects of the disclosed embodiments can include other PCB board materials such as Composite Epoxy Material (CEM-3 for example) and aluminum backed metal clad PCBs (MCPCBs).

[0061] Referring to Figures 1, 2, and 4, in some embodiments, the stem arrangement 115 may include two conductors 130, 135 mounted in a rigid material 140, typically glass. The two conductors may be connected to a mains power supply through a base 145 of the LED lamp 10. The mains supply may typically range from 120V to 240V A.C. but may include other voltages.

[0062] Figures 5A-5C show an example of the Cartesian platform 450 made from two joined double clad boards in various stages of manufacture. In this example, the LED mounting assembly 405 includes the first circuit board 410 and the second circuit board 415 assembled together in an X-wing configuration.

[0063] Figure 5 A shows the first circuit board 410. The first circuit board 410 may include pads 420 for mounting various components including the LEDs 205 and the power supply 215, and conductors 425 for providing electrical connections between components including the LEDs 205 and the power supply 215. The first circuit board 410 may also include a slot 430 for receiving the second circuit board 415. The second circuit board 415 can include a similar slot. The pads 420 and conductors 425 may have a surface area and shape to distribute heat across the surface of the first circuit board 410. It should be understood that the second circuit board 415 may have the same or similar features and characteristics.

[0064] Figure 5B shows the first and second circuit boards 410, 415 assembled together in an X-wing configuration with at least some components 435 of the power supply 215. The first and second circuit boards 410, 415 may be assembled normal or perpendicular to each other, or in some embodiments may be assembled at some other angle. Figure 5C shows the first and second circuit boards 410, 415 assembled together with the LEDs 205. The exemplary LED mounting assembly 405 in Figures 5B and 5C may include 12 LEDs with three LEDs mounted on each side of the first circuit board 410 and the second circuit board 415. In alternate embodiments, the LED mounting assembly 405 can include any suitable or desired number of LEDs 115.

[0065] By routing a slot 430 in the first and second circuit boards 410, 415 the circuit boards 410, 415 may be inserted into each other and may be fastened together, for example, by soldering, to form the LED mounting assembly 405. This may nearly double the surface area to vastly improve the thermal characteristics of the LED mounting assembly 405 and also distributes the LEDs 205 in a larger source distribution angle. In one or more embodiments, the power supply 215 and the LEDs 205 may be included on the same first or second circuit board. As a result, a single set of conductors supplying the mains power may be used and the LED mounting assembly 405, or a combination of the LED mounting assembly 405 and the mantle 105 may be handled and processed in manufacturing in a manner similar to the halogen bulb assembly process described above. In addition, the surface area and shapes of the conductors 425 on the first and second circuit boards may be selected to achieve particular thermal characteristics. By using selected surface areas and shapes, heat may be more efficiently dissipated from the LEDs 205 and more power may be applied to the LEDs.

[0066] At any stage of manufacture the LED mounting platform 210 and the LED mounting assembly 405 may be partially or wholly coated with a highly reflective coating to cover the various surfaces and components except the LEDs 205. The coating may be at least partially specular or it may be at least partially diffuse reflective (e.g., matte). The coating may increase the light output by reducing light bounce losses, but may also increase the thermal conductivity of the surfaces of the LED mounting platform 210 and the mounting boards 410, 415 of the LED mounting assembly 405.

[0067] Figure 6 shows a block diagram of an example of power supply 215. The power supply 215 may include components for conditioning power provided by the stem conductors 130, 135 for use by the LEDs 205. As shown in Figure 6, in at least one embodiment, power supply 215 may include a rectifier 510 for rectifying the mains power from the stem conductors 130, 135, and a control circuit 515 for providing power to the LEDs 115.

[0068] In accordance with some embodiments, the present disclosure provides a lamp (or lighting apparatus) comprising the described LED light source 100 contained within an envelope 110 enclosing a heat transfer gas (such as helium), wherein the envelope 110 is hermetically sealed to contain the LED light source 100 and the heat transfer gas. In accordance with some embodiments a power supply 215 is enclosed within the sealed envelope 110, and there typically may be no power supply or other circuitry outside the sealed envelope 110.

[0069] The disclosed embodiments are directed to an LED platform that provides sufficient lumen output, thermal management, color control, and light distribution characteristics. The disclosed embodiments are also at least directed to a method for improving the performance of an LED assembly when it is encapsulated within a low cost and high volume envelope. This existing envelope technology is highly desirable because the envelope is easily identified by consumers and is easily supported by current manufacturing components, machinery and techniques. For example, a halogen bulb finishing process that installs a halogen capsule inside a glass envelope may be easily adapted to install the LED light source 100 or a combination of the LED light source 100 and mantle 105 of the disclosed embodiments. The resulting LED lamp 10 may have a look and feel almost indistinguishable from an existing incandescent lamp.

[0070] Low cost, good color rendition, and high efficiency are factors driving the highly competitive LED market for general lighting. The ability to use the wide range of low cost fluorescent pigments (many are organic types) would help to lower the overall costs of light sources. Organic fluorescent pigments have been previously avoided due to their inability to tolerate the intense light levels near the blue LED sources. By remotely locating them on the mantle 105, especially the red versions, a good red emission can be obtained from a blue or BSY LED source at a practical cost. Many new lamp designs can incorporate the aspects of the disclosed embodiments to provide new lower cost LED lighting products. By locating the added phosphors on an intermediate structure such as the mantle 105 described herein, the remote phosphor concept becomes much more practical and can justify retaining use of more expensive phosphor types as well.

[0071] While the aspects of the disclosed embodiments have been shown and described herein using an A19 envelope, the aspects of the disclosed embodiments are not so limited. In alternate embodiments, other envelope configurations such as PAR, tubular lamp shapes, projection, HID retrofit replacement, outdoor, stage/studio, etc. can be utilized. Even tube retrofit lamps, designed to replace traditional fluorescent lamps, could benefit from this approach with some slight modifications.

[0072] The concept of intermediate placement, on a structure such as the mantle 105 described herein, in an inert atmosphere such as helium gas, provides several key advantages. These advantages include, but are not limited to, better appearance, improved thermal dissipation, and lower material costs. [0073] Various modifications and adaptations may become apparent to those skilled in the relevant arts in view of the foregoing description, when read in conjunction with the accompanying drawings. However, all such and similar modifications of the teachings of the disclosed embodiments will still fall within the scope of the disclosed embodiments.

[0074] Various features of the different embodiments described herein are interchangeable, one with the other. The various described features, as well as any known equivalents can be mixed and matched to construct additional embodiments and techniques in accordance with the principles of this disclosure.

[0075] Furthermore, some of the features of the exemplary embodiments could be used to advantage without the corresponding use of other features. As such, the foregoing description should be considered as merely illustrative of the principles of the disclosed embodiments and not in limitation thereof.

Claims

CLAIMS What is claimed is:

1. An LED lamp assembly, comprising:

a base;

an envelope coupled to the base;

an LED light source disposed within the envelope; and

a mantle disposed within the envelope at a location intermediate the LED light source and the envelope.

2. The LED lamp assembly of claim 1, wherein the LED light source and the mantle are assembled as a unit to be installed within the envelope.

3. The LED lamp assembly of claim 1, wherein a surface of the envelope comprises a coating.

4. The LED lamp assembly of claim 1, wherein a surface of the mantle is disposed a distance away from an inner surface of the envelope.

5. The LED lamp assembly of claim 1, comprising a coating disposed on one or more surfaces of the mantle.

6. The LED lamp assembly of claim 7, wherein the coating comprises one or more phosphors.

7. The LED lamp assembly of claim 7, wherein the coating comprises one or more pigments.

8. The LED lamp assembly of claim 7, wherein the coating comprises one or more notch filter materials.

9. The LED lamp assembly of claim 7, wherein the coating comprises a combination of one or more phosphors, pigments, and notch filter materials.

10. The LED lamp assembly of claim 1, wherein the mantle comprises an optical diffuser.

11. The LED lamp assembly of claim 1, wherein the mantle is in a continuous or porous form.

12. The LED lamp assembly of claim 1, wherein the mantle comprises one or more of a glass, polymer, plastic, or translucent ceramic material that is configured to support a coating.

13. The LED lamp assembly of claim 1, wherein the mantle comprises a glass tube.

14. The LED lamp assembly of claim 1, wherein the envelope provides a hermetic seal to the LED lamp assembly.

15. The LED lamp assembly of claim 14, wherein the mantle and the LED light source are disposed within the hermetically sealed LED lamp assembly.

16. The LED lamp assembly of claim 14, comprising a gaseous fill within the envelope that includes helium and/or hydrogen gas.

17. The LED lamp assembly of claim 1, wherein the LED light source comprises one or more LED devices.

18. The LED lamp assembly of claim 1, wherein the LED light source comprises at least one first LED circuit board and at least one second LED circuit board, the at least one first LED circuit board and the at least one second LED circuit board arranged in a multi-board wing configuration.

19. The LED lamp assembly of claim 18, comprising at least one further LED circuit board arranged with the at least one first LED circuit board and the at least one second LED circuit board to form the multi-board wing configuration.

20. The LED lamp assembly of claim 18, wherein the at least one first LED circuit board comprises a first board material and board thickness and the at least one second LED circuit board comprises a second board material and board thickness.

21. An LED lamp assembly, comprising:

a base;

an envelope coupled to the base, wherein the envelope provides a hermetic seal to the LED lamp assembly;

a gaseous fill within the envelope that includes helium and/or hydrogen gas; an LED light source disposed within the envelope; and

a mantle disposed within the envelope at a location intermediate the LED light source and the envelope, the mantle comprising a coating of at least one of phosphor, pigment, and notch-filter material disposed on one or more surfaces of the mantle.