JP6072667B2 - 半導体モジュールとその製造方法 - Google Patents

半導体モジュールとその製造方法 Download PDF

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Publication number
JP6072667B2
JP6072667B2 JP2013233902A JP2013233902A JP6072667B2 JP 6072667 B2 JP6072667 B2 JP 6072667B2 JP 2013233902 A JP2013233902 A JP 2013233902A JP 2013233902 A JP2013233902 A JP 2013233902A JP 6072667 B2 JP6072667 B2 JP 6072667B2
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semiconductor element
metal plate
conductor
groove
semiconductor
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Japanese (ja)
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JP2015095545A5 (enExample
JP2015095545A (ja
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泰成 日野
泰成 日野
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2013233902A priority Critical patent/JP6072667B2/ja
Priority to US14/445,411 priority patent/US9698078B2/en
Priority to DE102014221636.2A priority patent/DE102014221636B4/de
Priority to CN201410645842.2A priority patent/CN104637910B/zh
Publication of JP2015095545A publication Critical patent/JP2015095545A/ja
Publication of JP2015095545A5 publication Critical patent/JP2015095545A5/ja
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
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    • H—ELECTRICITY
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
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    • H10W72/071—Connecting or disconnecting
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
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    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
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    • H10W72/641—Dispositions of strap connectors
    • H10W72/646—Dispositions of strap connectors the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector
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    • H10W72/651—Materials of strap connectors
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    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/853—On the same surface
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    • H10W72/874—On different surfaces
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    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/00—Package configurations
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/00—Package configurations
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    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
JP2013233902A 2013-11-12 2013-11-12 半導体モジュールとその製造方法 Active JP6072667B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013233902A JP6072667B2 (ja) 2013-11-12 2013-11-12 半導体モジュールとその製造方法
US14/445,411 US9698078B2 (en) 2013-11-12 2014-07-29 Semiconductor module and method for manufacturing the same
DE102014221636.2A DE102014221636B4 (de) 2013-11-12 2014-10-24 Halbleitermodul und Verfahren zum Herstellen desselben
CN201410645842.2A CN104637910B (zh) 2013-11-12 2014-11-12 半导体模块和其制造方法

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Application Number Priority Date Filing Date Title
JP2013233902A JP6072667B2 (ja) 2013-11-12 2013-11-12 半導体モジュールとその製造方法

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JP2015095545A JP2015095545A (ja) 2015-05-18
JP2015095545A5 JP2015095545A5 (enExample) 2016-02-18
JP6072667B2 true JP6072667B2 (ja) 2017-02-01

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US (1) US9698078B2 (enExample)
JP (1) JP6072667B2 (enExample)
CN (1) CN104637910B (enExample)
DE (1) DE102014221636B4 (enExample)

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US11784105B2 (en) * 2018-03-07 2023-10-10 Mitsubishi Electric Corporation Semiconductor device and power converter
CN112585745B (zh) * 2018-08-29 2024-04-12 罗姆股份有限公司 封装构造、半导体装置以及封装构造的形成方法
US12249560B2 (en) * 2019-03-26 2025-03-11 Rohm Co., Ltd. Electronic device and method for manufacturing electronic device
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JP2022176744A (ja) * 2021-05-17 2022-11-30 三菱電機株式会社 半導体装置および半導体装置の製造方法
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JP2025077454A (ja) * 2023-11-06 2025-05-19 ミネベアパワーデバイス株式会社 半導体装置

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DE102014221636B4 (de) 2022-08-18
CN104637910B (zh) 2018-01-16
JP2015095545A (ja) 2015-05-18
CN104637910A (zh) 2015-05-20
DE102014221636A1 (de) 2015-05-13
US20150130076A1 (en) 2015-05-14
US9698078B2 (en) 2017-07-04

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