JP6072667B2 - 半導体モジュールとその製造方法 - Google Patents

半導体モジュールとその製造方法 Download PDF

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Publication number
JP6072667B2
JP6072667B2 JP2013233902A JP2013233902A JP6072667B2 JP 6072667 B2 JP6072667 B2 JP 6072667B2 JP 2013233902 A JP2013233902 A JP 2013233902A JP 2013233902 A JP2013233902 A JP 2013233902A JP 6072667 B2 JP6072667 B2 JP 6072667B2
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Prior art keywords
semiconductor element
metal plate
conductor
groove
semiconductor
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Japanese (ja)
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JP2015095545A5 (enExample
JP2015095545A (ja
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泰成 日野
泰成 日野
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2013233902A priority Critical patent/JP6072667B2/ja
Priority to US14/445,411 priority patent/US9698078B2/en
Priority to DE102014221636.2A priority patent/DE102014221636B4/de
Priority to CN201410645842.2A priority patent/CN104637910B/zh
Publication of JP2015095545A publication Critical patent/JP2015095545A/ja
Publication of JP2015095545A5 publication Critical patent/JP2015095545A5/ja
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
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US14/445,411 US9698078B2 (en) 2013-11-12 2014-07-29 Semiconductor module and method for manufacturing the same
DE102014221636.2A DE102014221636B4 (de) 2013-11-12 2014-10-24 Halbleitermodul und Verfahren zum Herstellen desselben
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JP6647190B2 (ja) * 2016-11-28 2020-02-14 三菱電機株式会社 半導体装置およびその製造方法
JP6730450B2 (ja) * 2016-12-06 2020-07-29 株式会社東芝 半導体装置
JP6673246B2 (ja) * 2017-02-06 2020-03-25 株式会社デンソー 半導体装置
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JP2022176744A (ja) * 2021-05-17 2022-11-30 三菱電機株式会社 半導体装置および半導体装置の製造方法
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DE102014221636B4 (de) 2022-08-18
DE102014221636A1 (de) 2015-05-13
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