JP6067191B1 - 導電材料及び接続構造体 - Google Patents

導電材料及び接続構造体 Download PDF

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Publication number
JP6067191B1
JP6067191B1 JP2016535202A JP2016535202A JP6067191B1 JP 6067191 B1 JP6067191 B1 JP 6067191B1 JP 2016535202 A JP2016535202 A JP 2016535202A JP 2016535202 A JP2016535202 A JP 2016535202A JP 6067191 B1 JP6067191 B1 JP 6067191B1
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Japan
Prior art keywords
solder
conductive
electrode
particles
connection
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JP2016535202A
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Japanese (ja)
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JPWO2016190244A1 (ja
Inventor
敬士 久保田
敬士 久保田
高橋　英之
英之 高橋
敬三 西岡
敬三 西岡
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/115—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/1152—Self-assembly, e.g. self-agglomeration of the bump material in a fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83886—Involving a self-assembly process, e.g. self-agglomeration of a material dispersed in a fluid

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2016535202A 2015-05-25 2016-05-20 導電材料及び接続構造体 Active JP6067191B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015105681 2015-05-25
JP2015105681 2015-05-25
PCT/JP2016/065014 WO2016190244A1 (ja) 2015-05-25 2016-05-20 導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
JP6067191B1 true JP6067191B1 (ja) 2017-01-25
JPWO2016190244A1 JPWO2016190244A1 (ja) 2017-06-15

Family

ID=57392783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016535202A Active JP6067191B1 (ja) 2015-05-25 2016-05-20 導電材料及び接続構造体

Country Status (5)

Country Link
JP (1) JP6067191B1 (zh)
KR (1) KR102569944B1 (zh)
CN (1) CN107210084A (zh)
TW (1) TWI679266B (zh)
WO (1) WO2016190244A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168187A1 (ja) * 2017-03-15 2018-09-20 日立化成株式会社 接合用金属ペースト、接合体及びその製造方法、並びに半導体装置及びその製造方法
JP2019204784A (ja) * 2018-05-17 2019-11-28 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013125517A1 (ja) * 2012-02-21 2013-08-29 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
WO2014112541A1 (ja) * 2013-01-17 2014-07-24 積水化学工業株式会社 電子部品用硬化性組成物、接続構造体及び接続構造体の製造方法
JP2015005502A (ja) * 2013-05-23 2015-01-08 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
JP2015004056A (ja) * 2013-05-22 2015-01-08 積水化学工業株式会社 電子部品用硬化性組成物及び接続構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288245A (ja) * 2000-04-03 2001-10-16 Tamura Kaken Co Ltd 難燃性活性エネルギー線硬化性樹脂、難燃性活性エネルギー線硬化性樹脂組成物、プリント配線板及び多層プリント配線板
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
JP3955302B2 (ja) 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
CN101501154B (zh) 2006-08-25 2013-05-15 住友电木株式会社 粘合带、接合体和半导体封装件
JP5602743B2 (ja) * 2009-08-26 2014-10-08 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
MY169367A (en) * 2011-11-29 2019-03-26 Toray Industries Resin composition, resin composition sheet, semiconductor device and production method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013125517A1 (ja) * 2012-02-21 2013-08-29 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
WO2014112541A1 (ja) * 2013-01-17 2014-07-24 積水化学工業株式会社 電子部品用硬化性組成物、接続構造体及び接続構造体の製造方法
JP2015004056A (ja) * 2013-05-22 2015-01-08 積水化学工業株式会社 電子部品用硬化性組成物及び接続構造体
JP2015005502A (ja) * 2013-05-23 2015-01-08 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
TWI679266B (zh) 2019-12-11
KR102569944B1 (ko) 2023-08-24
JPWO2016190244A1 (ja) 2017-06-15
KR20180011041A (ko) 2018-01-31
TW201708470A (zh) 2017-03-01
CN107210084A (zh) 2017-09-26
WO2016190244A1 (ja) 2016-12-01

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