JP6061496B2 - パターン計測装置、パターン計測方法及びパターン計測プログラム - Google Patents

パターン計測装置、パターン計測方法及びパターン計測プログラム Download PDF

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JP6061496B2
JP6061496B2 JP2012115295A JP2012115295A JP6061496B2 JP 6061496 B2 JP6061496 B2 JP 6061496B2 JP 2012115295 A JP2012115295 A JP 2012115295A JP 2012115295 A JP2012115295 A JP 2012115295A JP 6061496 B2 JP6061496 B2 JP 6061496B2
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pattern
contour
measurement
sample
charged particles
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Japanese (ja)
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JP2013242216A5 (https=
JP2013242216A (ja
Inventor
桃井　義典
義典 桃井
浜田　宏一
宏一 浜田
高木　裕治
裕治 高木
道夫 波田野
道夫 波田野
秀之 数見
秀之 数見
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2012115295A priority Critical patent/JP6061496B2/ja
Priority to US13/898,620 priority patent/US9521372B2/en
Publication of JP2013242216A publication Critical patent/JP2013242216A/ja
Publication of JP2013242216A5 publication Critical patent/JP2013242216A5/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
JP2012115295A 2012-05-21 2012-05-21 パターン計測装置、パターン計測方法及びパターン計測プログラム Active JP6061496B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012115295A JP6061496B2 (ja) 2012-05-21 2012-05-21 パターン計測装置、パターン計測方法及びパターン計測プログラム
US13/898,620 US9521372B2 (en) 2012-05-21 2013-05-21 Pattern measuring apparatus, pattern measuring method, and computer-readable recording medium on which a pattern measuring program is recorded

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012115295A JP6061496B2 (ja) 2012-05-21 2012-05-21 パターン計測装置、パターン計測方法及びパターン計測プログラム

Publications (3)

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JP2013242216A JP2013242216A (ja) 2013-12-05
JP2013242216A5 JP2013242216A5 (https=) 2015-06-11
JP6061496B2 true JP6061496B2 (ja) 2017-01-18

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JP2012115295A Active JP6061496B2 (ja) 2012-05-21 2012-05-21 パターン計測装置、パターン計測方法及びパターン計測プログラム

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US (1) US9521372B2 (https=)
JP (1) JP6061496B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5542478B2 (ja) * 2010-03-02 2014-07-09 株式会社日立ハイテクノロジーズ 荷電粒子線顕微鏡
JP2016058637A (ja) * 2014-09-11 2016-04-21 株式会社日立ハイテクノロジーズ オーバーレイ計測方法、装置、および表示装置
US20160093465A1 (en) * 2014-09-26 2016-03-31 Kabushiki Kaisha Toshiba Defect inspection apparatus and defect inspection method
US9858379B2 (en) * 2015-02-18 2018-01-02 Toshiba Memory Corporation Mask data generation system, mask data generation method, and recording medium
US9793183B1 (en) * 2016-07-29 2017-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for measuring and improving overlay using electronic microscopic imaging and digital processing
JP2019011972A (ja) * 2017-06-29 2019-01-24 株式会社 Ｎｇｒ パターンエッジ検出方法
US10748290B2 (en) * 2018-10-31 2020-08-18 Fei Company Smart metrology on microscope images
KR102909696B1 (ko) * 2020-12-30 2026-01-07 삼성전자주식회사 패턴 분석 시스템 및 상기 시스템을 이용한 반도체 장치 제조 방법
JPWO2023233492A1 (https=) * 2022-05-30 2023-12-07
CN118280868B (zh) * 2024-06-03 2024-08-13 华芯程(杭州)科技有限公司 测量曲线图案线边缘粗糙度的方法、装置、终端、介质及程序产品

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197510A (ja) * 1984-10-19 1986-05-16 Hitachi Ltd 走査型電子顕微鏡による立体形状測定装置
JPH07111336B2 (ja) * 1990-02-07 1995-11-29 株式会社東芝 パターン寸法測定方法及び装置
JP2978034B2 (ja) 1993-06-24 1999-11-15 株式会社日立製作所 測長機能を備えた走査電子顕微鏡
JP3109785B2 (ja) * 1993-12-21 2000-11-20 株式会社日立製作所 走査電子顕微鏡の自動焦点合わせ装置
US6067164A (en) * 1996-09-12 2000-05-23 Kabushiki Kaisha Toshiba Method and apparatus for automatic adjustment of electron optics system and astigmatism correction in electron optics device
US6538249B1 (en) * 1999-07-09 2003-03-25 Hitachi, Ltd. Image-formation apparatus using charged particle beams under various focus conditions
JP4871350B2 (ja) 1999-07-09 2012-02-08 株式会社日立製作所 パターン寸法測定方法、及びパターン寸法測定装置
JP3819828B2 (ja) * 2002-10-21 2006-09-13 株式会社東芝 微細パターン測定方法
JP3961438B2 (ja) * 2003-03-25 2007-08-22 株式会社東芝 パターン計測装置、パターン計測方法および半導体装置の製造方法
JP4988274B2 (ja) * 2006-08-31 2012-08-01 株式会社日立ハイテクノロジーズ パターンのずれ測定方法、及びパターン測定装置
JP5425601B2 (ja) * 2009-12-03 2014-02-26 株式会社日立ハイテクノロジーズ 荷電粒子線装置およびその画質改善方法
JP2013088415A (ja) * 2011-10-24 2013-05-13 Hitachi High-Technologies Corp 半導体パターン計測方法及び半導体パターン計測装置

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JP2013242216A (ja) 2013-12-05
US9521372B2 (en) 2016-12-13
US20130321610A1 (en) 2013-12-05

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