JP6055918B2 - 電界効果トランジスタ - Google Patents
電界効果トランジスタ Download PDFInfo
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- JP6055918B2 JP6055918B2 JP2015527206A JP2015527206A JP6055918B2 JP 6055918 B2 JP6055918 B2 JP 6055918B2 JP 2015527206 A JP2015527206 A JP 2015527206A JP 2015527206 A JP2015527206 A JP 2015527206A JP 6055918 B2 JP6055918 B2 JP 6055918B2
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- 230000005669 field effect Effects 0.000 title claims description 33
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 108
- 229910052799 carbon Inorganic materials 0.000 claims description 108
- 230000004888 barrier function Effects 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 30
- 150000004767 nitrides Chemical class 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 description 265
- 230000005533 two-dimensional electron gas Effects 0.000 description 12
- 230000015556 catabolic process Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000002950 deficient Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 4
- 229910002704 AlGaN Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005036 potential barrier Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H01L29/1025—Channel region of field-effect devices
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
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- H01L29/41725—Source or drain electrodes for field effect devices
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- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
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- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
基板と、
上記基板上に積層されたバッファ層と、
上記バッファ層上に積層された高抵抗層と、
上記高抵抗層上に積層されたチャネル層と、
上記チャネル層上に積層され、バリア層となる窒化物半導体層と、
上記窒化物半導体層上に互いに間隔をあけて配置されたソース電極およびドレイン電極と、
上記ソース電極と上記ドレイン電極との間かつ上記窒化物半導体層上に形成され、上記窒化物半導体層に直接または絶縁膜を介して接続するゲート電極と
を備え、
上記バッファ層の上記高抵抗層側の炭素濃度が、0.8×1019/cm3以上かつ1.0×1021/cm3以下であり、
上記高抵抗層の上記バッファ層側の炭素濃度が、3.7×1018/cm3以上かつ1.0×1021/cm3以下であり、
上記高抵抗層の上記チャネル層側の炭素濃度が、1.4×1019/cm3以上かつ1.0×1021/cm3以下であることを特徴としている。
上記バッファ層の上記高抵抗層側の炭素濃度が1.2×1019/cm3以上であり、
上記高抵抗層の上記バッファ層側の炭素濃度が4.4×1018/cm3以上であり、
上記高抵抗層の上記チャネル層側の炭素濃度が1.6×1019/cm3以上である。
上記バッファ層の上記高抵抗層側の炭素濃度が1.6×1019/cm3以上であり、
上記高抵抗層の上記バッファ層側の炭素濃度が5.4×1018/cm3以上であり、
上記高抵抗層の上記チャネル層側の炭素濃度が1.9×1019/cm3以上である。
上記高抵抗層の炭素濃度が、上記バッファ層側から上記チャネル層側に近づくにしたがって増加する。
基板1と、
上記基板1上に積層されたバッファ層2と、
上記バッファ層2上に積層された高抵抗層3と、
上記高抵抗層3上に積層されたチャネル層4と、
上記チャネル層4上に積層され、バリア層となる窒化物半導体層5と、
上記窒化物半導体層5上に互いに間隔をあけて配置されたソース電極11およびドレイン電極12と、
上記ソース電極11と上記ドレイン電極12との間かつ上記窒化物半導体層5上に形成され、上記窒化物半導体層5に直接または絶縁膜20を介して接続するゲート電極13と
を備え、
上記バッファ層2の上記高抵抗層3側の炭素濃度が、0.8×1019/cm3以上かつ1.0×1021/cm3以下であり、
上記高抵抗層3の上記バッファ層2側の炭素濃度が、3.7×1018/cm3以上かつ1.0×1021/cm3以下であり、
上記高抵抗層3の上記チャネル層4側の炭素濃度が、1.4×1019/cm3以上かつ1.0×1021/cm3以下であることを特徴としている。
上記バッファ層2の上記高抵抗層3側の炭素濃度が1.2×1019/cm3以上であり、
上記高抵抗層3の上記バッファ層2側の炭素濃度が4.4×1018/cm3以上であり、
上記高抵抗層3の上記チャネル層4側の炭素濃度が1.6×1019/cm3以上である。
上記バッファ層2の上記高抵抗層3側の炭素濃度が1.6×1019/cm3以上であり、
上記高抵抗層3の上記バッファ層2側の炭素濃度が5.4×1018/cm3以上であり、
上記高抵抗層3の上記チャネル層4側の炭素濃度が1.9×1019/cm3以上である。
上記高抵抗層3の炭素濃度が、上記バッファ層2側から上記チャネル層4側に近づくにしたがって増加する。
2 バッファ層
3 高抵抗層
4 チャネル層
5 バリア層
11 ソース電極
12 ドレイン電極
13 ゲート電極
20 第1の絶縁膜
21 第2の絶縁膜
Claims (3)
- 基板(1)と、
上記基板(1)上に積層されていると共に、AlxGa1−xNとAlyGa1−yN(0≦x<1、0≦y<1、x≠y)とで形成された多層積層構造を有するバッファ層(2)と、
上記バッファ層(2)上に積層されていると共に、炭素を含むGaNからなる高抵抗層(3)と、
上記高抵抗層(3)上に積層されたチャネル層(4)と、
上記チャネル層(4)上に積層され、バリア層となる窒化物半導体層(5)と、
上記窒化物半導体層(5)上に互いに間隔をあけて配置されたソース電極(11)およびドレイン電極(12)と、
上記ソース電極(11)と上記ドレイン電極(12)との間かつ上記窒化物半導体層(5)上に形成され、上記窒化物半導体層(5)に直接または絶縁膜(20)を介して接続するゲート電極と
を備え、
上記バッファ層(2)の上記高抵抗層(3)側の炭素濃度が、0.8×1019/cm3以上かつ1.0×1021/cm3以下であり、
上記高抵抗層(3)の上記バッファ層(2)側の炭素濃度が、3.7×1018/cm3以上かつ1.0×1021/cm3以下であり、
上記高抵抗層(3)の上記チャネル層(4)側の炭素濃度が、1.4×1019/cm3以上かつ1.0×1021/cm3以下であり、
上記高抵抗層(3)の炭素濃度が、上記バッファ層(2)側から上記チャネル層(4)側に近づくにしたがって増加することを特徴とする電界効果トランジスタ。 - 請求項1に記載の電界効果トランジスタにおいて、
上記バッファ層(2)の上記高抵抗層(3)側の炭素濃度が1.2×1019/cm3以上かつ1.0×10 21 /cm 3 以下であり、
上記高抵抗層(3)の上記バッファ層(2)側の炭素濃度が4.4×1018/cm3以上かつ1.0×10 21 /cm 3 以下であり、
上記高抵抗層(3)の上記チャネル層(4)側の炭素濃度が1.6×1019/cm3以上かつ1.0×10 21 /cm 3 以下であることを特徴とする電界効果トランジスタ。 - 請求項1または2に記載の電界効果トランジスタにおいて、
上記バッファ層(2)の上記高抵抗層(3)側の炭素濃度が1.6×1019/cm3以上かつ1.0×10 21 /cm 3 以下であり、
上記高抵抗層(3)の上記バッファ層(2)側の炭素濃度が5.4×1018/cm3以上かつ1.0×10 21 /cm 3 以下であり、
上記高抵抗層(3)の上記チャネル層(4)側の炭素濃度が1.9×1019/cm3以上かつ1.0×10 21 /cm 3 以下であることを特徴とする電界効果トランジスタ。
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PCT/JP2014/063101 WO2015008532A1 (ja) | 2013-07-19 | 2014-05-16 | 電界効果トランジスタ |
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WO (1) | WO2015008532A1 (ja) |
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JP2015170776A (ja) * | 2014-03-07 | 2015-09-28 | シャープ株式会社 | 窒化物半導体積層体および電界効果トランジスタ |
JP6261437B2 (ja) * | 2014-04-09 | 2018-01-17 | サンケン電気株式会社 | 半導体基板の製造方法、及び半導体素子の製造方法 |
JP6249868B2 (ja) * | 2014-04-18 | 2017-12-20 | サンケン電気株式会社 | 半導体基板及び半導体素子 |
JP2016167499A (ja) * | 2015-03-09 | 2016-09-15 | 株式会社東芝 | 半導体装置 |
US10586701B2 (en) * | 2016-02-26 | 2020-03-10 | Sanken Electric Co., Ltd. | Semiconductor base having a composition graded buffer layer stack |
DE102016223622A1 (de) * | 2016-11-29 | 2018-05-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
JP7117732B2 (ja) * | 2018-07-11 | 2022-08-15 | 国立大学法人大阪大学 | Iii族窒化物基板およびiii族窒化物結晶の製造方法 |
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JP2013021106A (ja) * | 2011-07-11 | 2013-01-31 | Toyota Central R&D Labs Inc | 半導体装置 |
JP2013080776A (ja) * | 2011-10-03 | 2013-05-02 | Covalent Materials Corp | 窒化物半導体基板 |
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AU2003266544A1 (en) * | 2002-09-20 | 2004-04-08 | Mitsubishi Chemical Corporation | Semiconductor crystal of group iii-v compound |
JP4792814B2 (ja) * | 2005-05-26 | 2011-10-12 | 住友電気工業株式会社 | 高電子移動度トランジスタ、電界効果トランジスタ、エピタキシャル基板、エピタキシャル基板を作製する方法およびiii族窒化物系トランジスタを作製する方法 |
JP4519196B2 (ja) * | 2008-11-27 | 2010-08-04 | Dowaエレクトロニクス株式会社 | 電子デバイス用エピタキシャル基板およびその製造方法 |
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