JP6054612B2 - 半導体集積装置 - Google Patents
半導体集積装置 Download PDFInfo
- Publication number
- JP6054612B2 JP6054612B2 JP2012048870A JP2012048870A JP6054612B2 JP 6054612 B2 JP6054612 B2 JP 6054612B2 JP 2012048870 A JP2012048870 A JP 2012048870A JP 2012048870 A JP2012048870 A JP 2012048870A JP 6054612 B2 JP6054612 B2 JP 6054612B2
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- Prior art keywords
- diffusion region
- metal pad
- region
- electrostatic protection
- bump
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims description 58
- 238000009792 diffusion process Methods 0.000 claims description 94
- 229910052751 metal Inorganic materials 0.000 claims description 65
- 239000002184 metal Substances 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 20
- 230000003071 parasitic effect Effects 0.000 description 29
- 230000015556 catabolic process Effects 0.000 description 7
- 230000006378 damage Effects 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
10 半導体基板
20 バンプ
21 金属パッド
HCa、HCb 静電気保護回路
Claims (3)
- 静電気保護回路が主面に形成されている半導体基板と、前記主面に対して下面が対向する金属パッドと、前記金属パッドの上面に対向して形成されている導電性バンプと、を含む半導体集積装置であって、
前記静電気保護回路は、互いに隣接する第1の拡散領域及び第2の拡散領域を含み、
前記金属パッドと前記半導体基板の主面との間には絶縁層が形成されており、
前記絶縁層を貫通して前記金属パッドと前記第1の拡散領域とを電気的に接続する導電部材が設けられており、
前記導電性バンプは前記第1及び第2の拡散領域に対向する対向面を有する板状電極であり、前記対向面内の前記第1の拡散領域に対向する位置における前記導電部材が形成されている位置のみに前記金属パッドに接触する突起部が形成されていることを特徴とする半導体集積装置。 - 前記対向面において前記突起部を除く領域と前記金属パッドとの間に絶縁膜が形成されていることを特徴とする請求項1記載の半導体集積装置。
- 前記第2の拡散領域が電源ライン又は接地ラインに接続されていることを特徴とする請求項1又は2記載の半導体集積装置。
Priority Applications (3)
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JP2012048870A JP6054612B2 (ja) | 2012-03-06 | 2012-03-06 | 半導体集積装置 |
US13/777,951 US9041113B2 (en) | 2012-03-06 | 2013-02-26 | Semiconductor integrated device |
CN201310067617.0A CN103311238B (zh) | 2012-03-06 | 2013-03-04 | 半导体集成装置 |
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JP2012048870A JP6054612B2 (ja) | 2012-03-06 | 2012-03-06 | 半導体集積装置 |
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JP2013187218A JP2013187218A (ja) | 2013-09-19 |
JP6054612B2 true JP6054612B2 (ja) | 2016-12-27 |
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Country Status (3)
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US (1) | US9041113B2 (ja) |
JP (1) | JP6054612B2 (ja) |
CN (1) | CN103311238B (ja) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3602745B2 (ja) * | 1999-06-30 | 2004-12-15 | 株式会社東芝 | 半導体装置 |
JP3727220B2 (ja) * | 2000-04-03 | 2005-12-14 | Necエレクトロニクス株式会社 | 半導体装置 |
US6638847B1 (en) * | 2000-04-19 | 2003-10-28 | Advanced Interconnect Technology Ltd. | Method of forming lead-free bump interconnections |
JP2005085820A (ja) * | 2003-09-04 | 2005-03-31 | Seiko Instruments Inc | 半導体装置 |
JP4186970B2 (ja) * | 2005-06-30 | 2008-11-26 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4293563B2 (ja) | 2006-11-28 | 2009-07-08 | Okiセミコンダクタ株式会社 | 半導体装置及び半導体パッケージ |
JPWO2008126468A1 (ja) * | 2007-03-30 | 2010-07-22 | 日本電気株式会社 | 半導体装置及び半導体装置の製造方法 |
TWI372457B (en) * | 2009-03-20 | 2012-09-11 | Ind Tech Res Inst | Esd structure for 3d ic tsv device |
US8502338B2 (en) * | 2010-09-09 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Through-substrate via waveguides |
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2012
- 2012-03-06 JP JP2012048870A patent/JP6054612B2/ja active Active
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2013
- 2013-02-26 US US13/777,951 patent/US9041113B2/en active Active
- 2013-03-04 CN CN201310067617.0A patent/CN103311238B/zh active Active
Also Published As
Publication number | Publication date |
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US9041113B2 (en) | 2015-05-26 |
CN103311238A (zh) | 2013-09-18 |
JP2013187218A (ja) | 2013-09-19 |
US20130234251A1 (en) | 2013-09-12 |
CN103311238B (zh) | 2017-08-08 |
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