JP6052688B2 - 半導体ウェハーティーチング治具 - Google Patents
半導体ウェハーティーチング治具 Download PDFInfo
- Publication number
- JP6052688B2 JP6052688B2 JP2015140774A JP2015140774A JP6052688B2 JP 6052688 B2 JP6052688 B2 JP 6052688B2 JP 2015140774 A JP2015140774 A JP 2015140774A JP 2015140774 A JP2015140774 A JP 2015140774A JP 6052688 B2 JP6052688 B2 JP 6052688B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- sides
- stopper
- scale
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 42
- 238000005259 measurement Methods 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 73
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000605 extraction Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000284 extract Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0108433 | 2014-08-20 | ||
KR20140108433A KR101467551B1 (ko) | 2014-08-20 | 2014-08-20 | 반도체 웨이퍼 티칭 지그 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016046518A JP2016046518A (ja) | 2016-04-04 |
JP6052688B2 true JP6052688B2 (ja) | 2016-12-27 |
Family
ID=52677149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015140774A Active JP6052688B2 (ja) | 2014-08-20 | 2015-07-14 | 半導体ウェハーティーチング治具 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6052688B2 (zh) |
KR (1) | KR101467551B1 (zh) |
CN (1) | CN105374258B (zh) |
TW (1) | TWI546237B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107958862B (zh) * | 2016-10-18 | 2021-11-09 | 台湾积体电路制造股份有限公司 | 半导体用治具、半导体的保护层针孔测试用的治具及方法 |
KR102063654B1 (ko) * | 2019-03-04 | 2020-01-09 | 오세덕 | 웨이퍼 티칭 지그 |
CN111013950A (zh) * | 2019-12-02 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | 一种硅片钝化装置及方法 |
KR102397940B1 (ko) * | 2020-05-26 | 2022-05-16 | (주)티에프씨랩 | 웨이퍼 반송 로봇 티칭 상태 확인 장치 |
CN113357991B (zh) * | 2021-05-28 | 2023-06-02 | 艾华(无锡)半导体科技有限公司 | 一种晶圆载具的检测工装 |
KR102342264B1 (ko) * | 2021-06-03 | 2021-12-22 | 정병철 | 반도체 웨이퍼의 티칭을 위한 측정기 |
KR102342270B1 (ko) * | 2021-06-03 | 2021-12-22 | 정병철 | 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07169820A (ja) * | 1993-12-13 | 1995-07-04 | Kokusai Electric Co Ltd | 密閉容器の覗き窓 |
JPH1012700A (ja) * | 1996-06-19 | 1998-01-16 | Sony Corp | インデクサ調整用キャリア |
KR19990006023U (ko) * | 1997-07-23 | 1999-02-18 | 문정환 | 반도체 웨이퍼 증착장치용 보트 |
KR19990068968A (ko) * | 1998-02-03 | 1999-09-06 | 윤종용 | 반도체 웨이퍼 카셋트 |
KR20010027008A (ko) * | 1999-09-10 | 2001-04-06 | 윤종용 | 웨이퍼 카세트의 라벨링 |
JP2001264002A (ja) * | 2000-03-16 | 2001-09-26 | Nomura Kensetsu Kk | 多機能折畳直角定規 |
JP2003297902A (ja) * | 2002-03-29 | 2003-10-17 | Disco Abrasive Syst Ltd | カセットアダプタ |
CN100472743C (zh) * | 2002-11-21 | 2009-03-25 | 奥林巴斯株式会社 | 晶片检验设备 |
KR20070069782A (ko) * | 2005-12-28 | 2007-07-03 | 엘지.필립스 엘시디 주식회사 | 로봇 티칭용 기구 |
JP2008084938A (ja) * | 2006-09-26 | 2008-04-10 | Nec Electronics Corp | 基板処理装置に対する各種設定値の教示方法、教示用装置及びその校正治具 |
CN101728292B (zh) * | 2008-10-31 | 2011-06-01 | 沈阳芯源微电子设备有限公司 | 晶片检测装置 |
CN102005403A (zh) * | 2009-08-28 | 2011-04-06 | 中芯国际集成电路制造(上海)有限公司 | 晶片承载装置 |
KR101842115B1 (ko) * | 2011-10-06 | 2018-03-26 | 세메스 주식회사 | 기판 처리 장치의 로봇 정렬을 위한 티칭 지그 |
-
2014
- 2014-08-20 KR KR20140108433A patent/KR101467551B1/ko active IP Right Grant
-
2015
- 2015-02-09 CN CN201510067805.2A patent/CN105374258B/zh active Active
- 2015-07-14 JP JP2015140774A patent/JP6052688B2/ja active Active
- 2015-07-27 TW TW104124264A patent/TWI546237B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI546237B (zh) | 2016-08-21 |
KR101467551B1 (ko) | 2014-12-02 |
TW201607860A (zh) | 2016-03-01 |
CN105374258B (zh) | 2017-11-14 |
JP2016046518A (ja) | 2016-04-04 |
CN105374258A (zh) | 2016-03-02 |
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