KR101467551B1 - 반도체 웨이퍼 티칭 지그 - Google Patents

반도체 웨이퍼 티칭 지그 Download PDF

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Publication number
KR101467551B1
KR101467551B1 KR20140108433A KR20140108433A KR101467551B1 KR 101467551 B1 KR101467551 B1 KR 101467551B1 KR 20140108433 A KR20140108433 A KR 20140108433A KR 20140108433 A KR20140108433 A KR 20140108433A KR 101467551 B1 KR101467551 B1 KR 101467551B1
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KR
South Korea
Prior art keywords
wafer
semiconductor wafer
shaft
stopper
sides
Prior art date
Application number
KR20140108433A
Other languages
English (en)
Korean (ko)
Inventor
정병철
Original Assignee
정병철
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정병철 filed Critical 정병철
Priority to KR20140108433A priority Critical patent/KR101467551B1/ko
Application granted granted Critical
Publication of KR101467551B1 publication Critical patent/KR101467551B1/ko
Priority to CN201510067805.2A priority patent/CN105374258B/zh
Priority to JP2015140774A priority patent/JP6052688B2/ja
Priority to TW104124264A priority patent/TWI546237B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length-Measuring Instruments Using Mechanical Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
KR20140108433A 2014-08-20 2014-08-20 반도체 웨이퍼 티칭 지그 KR101467551B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR20140108433A KR101467551B1 (ko) 2014-08-20 2014-08-20 반도체 웨이퍼 티칭 지그
CN201510067805.2A CN105374258B (zh) 2014-08-20 2015-02-09 半导体晶片示教夹具
JP2015140774A JP6052688B2 (ja) 2014-08-20 2015-07-14 半導体ウェハーティーチング治具
TW104124264A TWI546237B (zh) 2014-08-20 2015-07-27 半導體晶圓教示夾具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20140108433A KR101467551B1 (ko) 2014-08-20 2014-08-20 반도체 웨이퍼 티칭 지그

Publications (1)

Publication Number Publication Date
KR101467551B1 true KR101467551B1 (ko) 2014-12-02

Family

ID=52677149

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140108433A KR101467551B1 (ko) 2014-08-20 2014-08-20 반도체 웨이퍼 티칭 지그

Country Status (4)

Country Link
JP (1) JP6052688B2 (zh)
KR (1) KR101467551B1 (zh)
CN (1) CN105374258B (zh)
TW (1) TWI546237B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210146169A (ko) * 2020-05-26 2021-12-03 (주)티에프씨랩 웨이퍼 반송 로봇 티칭 상태 확인 장치
KR102342270B1 (ko) * 2021-06-03 2021-12-22 정병철 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법
KR102342264B1 (ko) * 2021-06-03 2021-12-22 정병철 반도체 웨이퍼의 티칭을 위한 측정기

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107958862B (zh) * 2016-10-18 2021-11-09 台湾积体电路制造股份有限公司 半导体用治具、半导体的保护层针孔测试用的治具及方法
KR102063654B1 (ko) * 2019-03-04 2020-01-09 오세덕 웨이퍼 티칭 지그
CN111013950A (zh) * 2019-12-02 2020-04-17 西安奕斯伟硅片技术有限公司 一种硅片钝化装置及方法
CN113357991B (zh) * 2021-05-28 2023-06-02 艾华(无锡)半导体科技有限公司 一种晶圆载具的检测工装

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990006023U (ko) * 1997-07-23 1999-02-18 문정환 반도체 웨이퍼 증착장치용 보트
KR20010027008A (ko) * 1999-09-10 2001-04-06 윤종용 웨이퍼 카세트의 라벨링
JP2003297902A (ja) * 2002-03-29 2003-10-17 Disco Abrasive Syst Ltd カセットアダプタ
KR20130037344A (ko) * 2011-10-06 2013-04-16 세메스 주식회사 기판 처리 장치의 로봇 정렬을 위한 티칭 지그

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07169820A (ja) * 1993-12-13 1995-07-04 Kokusai Electric Co Ltd 密閉容器の覗き窓
JPH1012700A (ja) * 1996-06-19 1998-01-16 Sony Corp インデクサ調整用キャリア
KR19990068968A (ko) * 1998-02-03 1999-09-06 윤종용 반도체 웨이퍼 카셋트
JP2001264002A (ja) * 2000-03-16 2001-09-26 Nomura Kensetsu Kk 多機能折畳直角定規
CN100472743C (zh) * 2002-11-21 2009-03-25 奥林巴斯株式会社 晶片检验设备
KR20070069782A (ko) * 2005-12-28 2007-07-03 엘지.필립스 엘시디 주식회사 로봇 티칭용 기구
JP2008084938A (ja) * 2006-09-26 2008-04-10 Nec Electronics Corp 基板処理装置に対する各種設定値の教示方法、教示用装置及びその校正治具
CN101728292B (zh) * 2008-10-31 2011-06-01 沈阳芯源微电子设备有限公司 晶片检测装置
CN102005403A (zh) * 2009-08-28 2011-04-06 中芯国际集成电路制造(上海)有限公司 晶片承载装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990006023U (ko) * 1997-07-23 1999-02-18 문정환 반도체 웨이퍼 증착장치용 보트
KR20010027008A (ko) * 1999-09-10 2001-04-06 윤종용 웨이퍼 카세트의 라벨링
JP2003297902A (ja) * 2002-03-29 2003-10-17 Disco Abrasive Syst Ltd カセットアダプタ
KR20130037344A (ko) * 2011-10-06 2013-04-16 세메스 주식회사 기판 처리 장치의 로봇 정렬을 위한 티칭 지그

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210146169A (ko) * 2020-05-26 2021-12-03 (주)티에프씨랩 웨이퍼 반송 로봇 티칭 상태 확인 장치
KR102397940B1 (ko) * 2020-05-26 2022-05-16 (주)티에프씨랩 웨이퍼 반송 로봇 티칭 상태 확인 장치
KR102342270B1 (ko) * 2021-06-03 2021-12-22 정병철 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법
KR102342264B1 (ko) * 2021-06-03 2021-12-22 정병철 반도체 웨이퍼의 티칭을 위한 측정기

Also Published As

Publication number Publication date
JP6052688B2 (ja) 2016-12-27
TWI546237B (zh) 2016-08-21
TW201607860A (zh) 2016-03-01
CN105374258B (zh) 2017-11-14
JP2016046518A (ja) 2016-04-04
CN105374258A (zh) 2016-03-02

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