JP6052688B2 - Semiconductor wafer teaching jig - Google Patents
Semiconductor wafer teaching jig Download PDFInfo
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- JP6052688B2 JP6052688B2 JP2015140774A JP2015140774A JP6052688B2 JP 6052688 B2 JP6052688 B2 JP 6052688B2 JP 2015140774 A JP2015140774 A JP 2015140774A JP 2015140774 A JP2015140774 A JP 2015140774A JP 6052688 B2 JP6052688 B2 JP 6052688B2
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- 239000004065 semiconductor Substances 0.000 title claims description 42
- 238000005259 measurement Methods 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 73
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000605 extraction Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000284 extract Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length-Measuring Instruments Using Mechanical Means (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Description
本発明は、半導体製造ラインのうち、半導体ウェハーキャリアが装着されて作業する積載台からウェハー（Ｗａｆｅｒ）を抽出するインデックスアーム（Ｉｎｄｅｘ Ａｒｍ）の破損、故障またはエラーなどが発生した場合、或いはＰＭ（Ｐｒｅｖｅｎｔｉｖｅ Ｍａｉｎｔｅｎａｎｃｅ；突発故障が起こる前に設備を停止して未然に点検して修理する作業行為）を行う場合など、正常な製造工程の稼働前に、テストのためにさらにティーチング（Ｔｅａｃｈｉｎｇ）する半導体ウェハーティーチング治具に係り、より具体的には、インデックスアームなどの製造設備を再びセットするためのティーチング作業の際にインデックスアームの位置測定および校正を正確かつ容易にするとともに、インデックスアームとウェハーが正確にホールドされてインデックスアームによってウェハーが正確に挿入装着および抽出されるかを容易に確認することができるなど、ティーチング（ｔｅａｃｈｉｎｇ）の際にインデックスアームとウェハーとの作動関係を容易かつ正確に確認することができる半導体ウェハーティーチング治具に関する。 The present invention is applicable to a case where an index arm (index arm) for extracting a wafer from a loading table on which a semiconductor wafer carrier is mounted in a semiconductor manufacturing line is damaged, failed, or has an error. Preventive maintenance: A semiconductor wafer that is further taught for testing before operation of normal manufacturing processes, such as when equipment is shut down and inspected and repaired before a sudden failure occurs. It is related to the teaching jig, and more specifically, the index arm position measurement and calibration can be accurately and easily performed during teaching work for setting the manufacturing equipment such as the index arm again, and the index arm and the wafer are accurate. Hold on It is possible to easily and accurately confirm the operating relationship between the index arm and the wafer during teaching, for example, it is possible to easily confirm whether the wafer is correctly inserted and mounted and extracted by the index arm. It is related with the semiconductor wafer teaching jig which can be performed.
敷衍すると、半導体製造ラインにおいて、インデックスアームの破損、故障またはエラーなどが発生して工程の稼働を停止し、さらに稼働のために設備をセットしようとする場合、インデックスアームによって半導体ウェハーキャリア（以下、「キャリア」と略記する。）から正確にウェハーをホールドして抽出および装着することができるかを予め確認点検および校正してインデックスアームの設備をセットするようにするためのティーチング治具に関する。 In the semiconductor manufacturing line, if the index arm is damaged, failed, or error occurs, the operation of the process is stopped, and if the equipment is to be set for operation, the index arm uses a semiconductor wafer carrier (hereinafter, The present invention relates to a teaching jig for setting an index arm by checking and calibrating in advance and checking whether or not a wafer can be accurately held and extracted and mounted from “carrier”.
一般に、半導体製造工程中に多数のウェハーが収納装着されたキャリア（すなわち、Ｆｒｏｎｔ Ｏｐｅｎｉｎｇ Ｕｎｉｆｉｅｄ Ｐｏｄ、「ＦＯＵＰ」とも呼ばれる。）に対して半導体ウェハーを挿入装着および抽出するインデックスアームなどの設備が破損、故障またはエラーなどが発生した場合、従来は、製造工程の稼働を停止し、設備をさらに取替または修理した後、インデックスアームがキャリアに対してウェハーを正常かつ正確に抽出および挿入装着することができるかを予め点検するために、キャリアを用いてティーチングを行った。 In general, equipment such as an index arm that inserts and mounts and extracts a semiconductor wafer with respect to a carrier in which a large number of wafers are stored and mounted during a semiconductor manufacturing process (that is, also referred to as “Front Opening Unified Pod”) is damaged. When a failure or error occurs, the index arm can normally extract and insert the wafer into the carrier normally and accurately after stopping the operation of the manufacturing process and further replacing or repairing the equipment. Teaching was performed using a carrier in order to check in advance whether it was possible.
前記キャリアは、一例として、特許文献１の図１に「樹脂製の薄板収納容器」として提示されている。 As an example, the carrier is presented as “resin-made thin plate container” in FIG.
ところが、キャリアは、もともと、半導体製造工程ラインで半導体ウェハーを収納装着して供給および移送するために使用するものである。このようなキャリアをティーチング用として使用する場合、ティーチング作業の際にインデックスアームがウェハーを正確にホールドして正常に挿入装着および抽出を行うことができるか、或いはインデックスアームとウェハーとの作動関係が正確であるかを明確に確認することが難しいうえ、不便で作業性に劣る。 However, the carrier is originally used for storing and mounting a semiconductor wafer in a semiconductor manufacturing process line and supplying and transporting it. When such a carrier is used for teaching, the index arm can accurately hold the wafer during teaching work and can perform normal insertion and extraction, or there is an operational relationship between the index arm and the wafer. It is difficult to clearly confirm whether it is accurate, and it is inconvenient and inferior in workability.
つまり、インデックスアームの高さや真直度、水平、センター、傾き、位置などの精密な測定および校正が難しく、不便であるから、設備セット後の工程稼働の際にさらにティーチング（Ｔｅａｃｈｉｎｇ）を行わなければならない場合が発生する。 In other words, precise measurement and calibration of index arm height, straightness, horizontal, center, tilt, position, etc. are difficult and inconvenient, so further teaching (teaching) must be performed during operation after the equipment is set. There are cases where this is not possible.
そこで、本発明は、上述した問題点を解決するためになされたもので、その目的は、インデックスアームなどの製造設備を再びセットするためのティーチング作業の際に、インデックスアームの位置測定および校正を正確かつ容易にするとともに、インデックスアームとウェハーが正確にホールドされてインデックスアームによってウェハーが正確に挿入装着および抽出されるかを容易に確認することができるなど、ティーチング（Ｔｅａｃｈｉｎｇ）の際にインデックスアームとウェハーとの作動関係を容易かつ正確に確認することができる半導体ウェハーティーチング治具を提供することにある。 Therefore, the present invention has been made to solve the above-described problems, and its purpose is to perform index arm position measurement and calibration during teaching work for resetting a manufacturing facility such as an index arm. The index arm and the wafer are accurately held and the index arm can be easily checked whether the wafer is correctly inserted and loaded by the index arm. It is an object of the present invention to provide a semiconductor wafer teaching jig capable of easily and accurately confirming the operation relationship between a wafer and a wafer.
上記目的を達成するための本発明は、支持板の上に両側に立設され、半導体ウェハーが挿入装着される多数のホルダー溝を有するホルダー軸と、前記ホルダー軸の後方の両側部に立設され、半導体ウェハーを位置に合わせて固定させるためのストッパー軸と、前記両側のストッパー軸の後方中央に立設され、半導体ウェハーの位置を確認するための目盛りが表示された目盛りバーと、前記ホルダー軸、前記ストッパー軸および目盛りバーの上端部に固定設置され、透視窓を有するフレーム天板とを含んでなり、前記ホルダー軸のホルダー溝は棚段によって形成され、前記棚段の入口には傾斜部を形成し、棚段上には半導体ウェハーが装着される支持突部を両側に突設し、前記ストッパー軸にはストッパー溝を凹設し、前記ストッパー溝には前記支持突部と同じ水平線上に半導体ウェハーが装着される支持突部を形成してなる、半導体ウェハーティーチング治具を提供する。 In order to achieve the above object, the present invention provides a holder shaft standing on both sides on a support plate and having a plurality of holder grooves into which a semiconductor wafer is inserted and mounted, and standing on both side portions behind the holder shaft. A stopper shaft for fixing the semiconductor wafer in accordance with the position, a scale bar standing on the rear center of the stopper shafts on both sides and displaying a scale for confirming the position of the semiconductor wafer, and the holder A frame top plate having a see-through window fixedly installed on the upper end of the shaft, the stopper shaft and the scale bar, the holder groove of the holder shaft is formed by a shelf, and the inlet of the shelf is inclined A support protrusion for mounting a semiconductor wafer is provided on both sides of the shelf, and a stopper groove is provided in the stopper shaft, and a front of the stopper groove is provided in the stopper groove. Semiconductor wafer is obtained by forming a support projections mounted on the same horizontal line as the support projection, to provide a semiconductor wafer teaching jig.
ここで、前記ホルダー軸の前後方にはそれぞれ第１及び第２位置測定装置を構成するが、前記第１及び第２位置測定装置は両側にガイドレールを固定設置し、前記ガイドレールにはストッパーを有する測定固定ブロックをレールブロックによってガイドされるように挿設し、前記測定固定ブロックには位置目盛りが表示された測定板をヒンジ軸で回動自在に設置し、前記ストッパーと測定板にはそれぞれ極性の異なる磁石を固定設置し、前記測定固定ブロックの端部には目盛り指示チップを固定設置し、前記両側の目盛り指示チップの前方には目盛り板を構成することを特徴とする。 Here, the first and second position measuring devices are respectively configured in front and rear of the holder shaft, and the first and second position measuring devices are fixedly installed with guide rails on both sides, and the guide rails have stoppers. A measurement fixing block having a guide is inserted so as to be guided by a rail block, a measurement plate with a position scale displayed on the measurement fixing block is rotatably installed on a hinge shaft, and the stopper and the measurement plate are Magnets having different polarities are fixedly installed, a scale indicating chip is fixedly installed at an end of the measurement fixing block, and a scale plate is formed in front of the scale indicating chips on both sides.
前記支持板の前後には、左右水平状態を測定する水平測定レベル計測器および前後水平状態を測定する水平測定レベル計測器をそれぞれ設置構成することを特徴とする。 A horizontal measurement level measuring instrument for measuring a horizontal state and a horizontal measurement level measuring instrument for measuring a front and rear horizontal state are respectively installed and configured before and after the support plate.
前記支持板にはティーチングの際にキャリア固定ポストピンに固定するためのホールブロックを所定の位置に設置構成し、前記支持板の両側には運搬またはティーチング時の遊動などのためのハンドルを設置構成することを特徴とする。 A hole block for fixing to a carrier fixing post pin at the time of teaching is installed and configured on the support plate at a predetermined position, and handles for transporting or floating during teaching are installed on both sides of the support plate. It is characterized by that.
本発明によれば、インデックスアームなどの製造設備を再びセットするためのティーチング作業の際に、インデックスアームおよびウェハーの真直度、水平、高さ、左右偏心、傾きおよび位置などの精密な測定を正確かつ容易に行うのはもとより、このような測定で校正を容易にするとともに、インデックスアームとウェハーが正確にホールドされ、インデックスアームによってウェハーが正確に挿入装着および抽出されるかを容易に確認することができるなど、ティーチング（Ｔｅａｃｈｉｎｇ）の際にインデックスアームとウェハーとの作動関係を容易かつ正確に確認することができる。 According to the present invention, accurate measurement such as straightness, horizontal, height, left-right eccentricity, tilt and position of the index arm and wafer is accurately performed during teaching work for resetting the manufacturing equipment such as the index arm. In addition to making it easy, it is easy to calibrate with such measurements, and to easily check whether the index arm and wafer are accurately held, and that the index arm can accurately insert and load the wafer. For example, the operating relationship between the index arm and the wafer can be easily and accurately confirmed during teaching.
以下に添付図面を参照しながら、好適な実施例を詳細に説明する。 Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings.
本発明を説明するにあたり、定義される用語は、本発明における機能や形態などを考慮して定義されたもので、本発明の技術構成要素を限定する意味で理解されてはならない。 In describing the present invention, the defined terms are defined in consideration of the functions and forms of the present invention, and should not be understood to limit the technical components of the present invention.
本発明は多様な変更を加えることができ、様々な形態を持つことができるもので、その具現例（態様、ａｓｐｅｃｔ）（または実施例）をここに詳細に説明する。しかし、これは本発明を特定の開示形態に限定しようとするものではなく、本発明の思想及び技術範囲に含まれるすべての変更、均等物ないし代替物を含むものと理解されなければならない。 The present invention can be variously modified and can have various forms, and embodiments (or aspects) (or embodiments) thereof will be described in detail herein. However, this should not be construed as limiting the invention to the particular forms disclosed, but should be understood to include all modifications, equivalents or alternatives that fall within the spirit and scope of the invention.
また、各図面において、構成要素は、理解の便宜などのために、大きさや厚さを誇張して大きく（または厚く）或いは小さく（または薄く）表現しているか単純化して表現しているが、これによって本発明の保護範囲が制限的に解釈されてはならない。 In each drawing, the components are exaggerated in terms of size and thickness for the sake of convenience of understanding, and are expressed as large (or thick) or small (or thin) or simplified. This should not limit the scope of protection of the invention.
本明細書で使用する用語は、特定の具現例（態様、ａｓｐｅｃｔ）（または実施例）を説明するために使用されたもので、本発明を限定しようとするものではない。 The terminology used herein is for the purpose of describing particular embodiments (or aspects) (or examples), and is not intended to be limiting of the invention.
一般に使われる辞典に定義されている用語は、関連技術の文脈上で持つ意味と一致する意味を持つものと解釈されなければならず、本明細書で明らかに定義しない限り、理想的な意味または過度に形式的な意味に解釈されない。 Terms defined in commonly used dictionaries should be construed as having a meaning consistent with the meaning in the context of the related art, and unless otherwise explicitly defined herein, Not overly formalized.
図１〜図７を参照すると、本発明の好適な実施例に係る半導体ウェハーティーチング治具は、支持板１の上に両側に立設され、半導体ウェハーが挿入装着される多数のホルダー溝２を有するホルダー軸３と、前記ホルダー軸３の後方両側部に立設され、半導体ウェハーを位置に合わせて固定させるためのストッパー溝４ａを有するストッパー軸４と、前記両側のストッパー軸４の後方中央に立設され、半導体ウェハーの位置を確認するための目盛りが表示された目盛りバー５と、前記ホルダー軸３、前記ストッパー軸４および前記目盛りバー５の上端部に固定設置され、透視窓６を有するフレーム天板７とを含んでなる。 Referring to FIGS. 1 to 7, a semiconductor wafer teaching jig according to a preferred embodiment of the present invention is erected on both sides on a support plate 1 and includes a plurality of holder grooves 2 into which a semiconductor wafer is inserted and mounted. A holder shaft 3, a stopper shaft 4 provided on both rear sides of the holder shaft 3, having a stopper groove 4 a for fixing the semiconductor wafer in position, and at the rear center of the stopper shafts 4 on both sides. A scale bar 5 which is erected and displays a scale for confirming the position of the semiconductor wafer, and is fixedly installed at the upper end of the holder shaft 3, the stopper shaft 4 and the scale bar 5, and has a see-through window 6. Frame top plate 7.
前記ホルダー軸３のホルダー溝２は棚段２ａによって形成され、前記棚段２ａの入り口には傾斜部２ｂを形成し、前記棚段２ａ上には半導体ウェハーが装着される支持突部２ｃを両側に突設し、前記ストッパー軸４のストッパー溝４ａには前記支持突部２ｃと同じ水平線上に半導体ウェハーが装着される支持突部４ｂを形成する。 The holder groove 2 of the holder shaft 3 is formed by a shelf 2a, an inclined portion 2b is formed at the entrance of the shelf 2a, and support protrusions 2c on which a semiconductor wafer is mounted are provided on both sides of the shelf 2a. In the stopper groove 4a of the stopper shaft 4, a support protrusion 4b on which the semiconductor wafer is mounted is formed on the same horizontal line as the support protrusion 2c.
前記ホルダー軸３の前後側にはそれぞれ第１及び第２位置測定装置Ｐ、Ｐ１を構成するが、前記第１及び第２位置測定装置Ｐ、Ｐ１は、両側にガイドレール８を固定設置し、前記ガイドレール８には、ストッパー９を有する測定固定ブロック１０をレールブロック１１によってガイドされるように挿設する。 First and second position measuring devices P and P1 are configured on the front and rear sides of the holder shaft 3, respectively, and the first and second position measuring devices P and P1 are fixedly installed with guide rails 8 on both sides, A measurement fixing block 10 having a stopper 9 is inserted into the guide rail 8 so as to be guided by the rail block 11.
前記測定固定ブロック１０には位置目盛り１２の表示された測定板１３をヒンジ軸１４で回動自在に設置し、前記ストッパー９と測定板１３にはそれぞれ極性の異なる磁石１５、１５ａを固定設置し、前記測定固定ブロック１０の端部には目盛り指示チップ１６を固定設置する。 The measurement fixing block 10 is provided with a measuring plate 13 with a position scale 12 displayed thereon so as to be rotatable by a hinge shaft 14. The scale indicating chip 16 is fixedly installed at the end of the measurement fixing block 10.
また、前記両側の目盛り指示チップ１６の前方には目盛り板１７を構成する。 A scale plate 17 is formed in front of the scale instruction chips 16 on both sides.
こうしてそれぞれ第１及び第２位置測定装置Ｐ、Ｐ１を構成する。 Thus, the first and second position measuring devices P and P1 are configured, respectively.
前記支持板１の前後には、左右水平状態を測定する水平測定レベル計測器１８と、前後水平状態を測定する水平測定レベル計測器１９をそれぞれ設置構成する。 Before and after the support plate 1, a horizontal measurement level measuring device 18 for measuring the horizontal state and a horizontal measurement level measuring device 19 for measuring the front and rear horizontal state are respectively installed and configured.
前記支持板１には、ティーチングの際にキャリア固定ポストピン（図示せず）に固定するためのホールブロック２０を所定の位置に設置構成し、前記支持板１の両側には、運搬やティーチング時の遊動などのためのハンドル２１を設置構成する。 A hole block 20 for fixing to a carrier fixing post pin (not shown) at the time of teaching is installed on the support plate 1 at a predetermined position, and both sides of the support plate 1 are used for transportation and teaching. A handle 21 for play or the like is installed and configured.
上述したような本発明は、まず、半導体ウェハーキャリアが装着されて作業する積載台の基準プレート上に位置させ、支持板１の底面に設けられたホールブロック２０を、前記基準プレートに設置されたキャリア固定ポストピンとセットする。 In the present invention as described above, first, the hole block 20 provided on the bottom surface of the support plate 1 is placed on the reference plate, which is positioned on the reference plate of the loading table on which the semiconductor wafer carrier is mounted and works. Set with carrier fixing post pin.
この場合、本発明のティーチング治具は前記積載台上に定位置に配置し、インデックスアームを有するロボットもティーチングしようとする位置に移動させる。 In this case, the teaching jig of the present invention is arranged at a fixed position on the loading table, and the robot having the index arm is also moved to the position where teaching is to be performed.
この状態でロボットのティーチング位置（例えば、ＸＹＺ空間座標）を保存し、本発明のティーチング治具を用いてウェハーの挿入装着および抽出テストを実施してティーチングデータを保存する。 In this state, the teaching position (for example, XYZ space coordinates) of the robot is saved, and the wafer insertion / extraction test and extraction test are performed using the teaching jig of the present invention to save the teaching data.
テストが完了すると、本発明のティーチング治具は積載台の基準プレートから分離する。 When the test is completed, the teaching jig of the present invention is separated from the reference plate of the loading table.
次に、本発明のティーチング治具を用いてウェハーの挿入装着および抽出テストを実施する方法について説明する。 Next, a method for carrying out wafer insertion and extraction tests using the teaching jig of the present invention will be described.
ロボットに連結構成されたインデックスアームＲにウェハーＷを装着した後、両側のホルダー軸３内に設けられたホルダー溝２に挿入して進入させる（図４及び図７参照）。 After the wafer W is mounted on the index arm R connected to the robot, it is inserted into the holder grooves 2 provided in the holder shafts 3 on both sides (see FIGS. 4 and 7).
この場合、ウェハーＷのエッジ（ｅｄｇｅ）は、ホルダー溝２に挿入されて棚段２ａの支持突部２ｃ上に装着され、併せて、ウェハーＷの後方部のエッジ部分は、ストッパー軸４の支持突部４ｂ上に装着され、ウェハーが定位置に進入すると、前記両側のストッパー軸４に設けられたストッパー溝４ａに係止されてそれ以上の進入は中止される。 In this case, the edge of the wafer W is inserted into the holder groove 2 and mounted on the support protrusion 2c of the shelf 2a. At the same time, the edge portion of the rear portion of the wafer W is supported by the stopper shaft 4. When the wafer is mounted on the protrusion 4b and enters the fixed position, the wafer is locked in the stopper grooves 4a provided on the stopper shafts 4 on both sides and the further entry is stopped.
このようにウェハーＷの挿入装着が完了すると、この状態でウェハーＷの水平、高さ、左右偏心、傾きおよび位置などの精密な測定を行い、エラーが発生した部分をさらに校正した後、正常な作動が確認されると、テストしたテータを保存する。 When the insertion and mounting of the wafer W is completed in this way, in this state, the wafer W is accurately measured for horizontal, height, left and right eccentricity, inclination, position, etc. When the operation is confirmed, the tested data is saved.
前記目盛りバー５に表示された目盛り表示５ａを介してウェハーが進入したときの高さを測定することができ、両側のホルダー軸３の支持突部２ｃとストッパー軸４の支持突部４ｂ上に装着されたウェハーの状態を確認すると、水平状態、左右偏心および傾きを確認することができ、これらの測定を全て肉眼で容易に確認することができる。 The height when the wafer enters can be measured via the scale display 5 a displayed on the scale bar 5, and can be measured on the support protrusions 2 c of the holder shaft 3 and the support protrusions 4 b of the stopper shaft 4 on both sides. When the state of the mounted wafer is confirmed, the horizontal state, left-right eccentricity and inclination can be confirmed, and all these measurements can be easily confirmed with the naked eye.
その理由は、ティーチング治具全体の前、後、左、右、上側が全てオープンされているためである。 This is because the front, rear, left, right, and upper sides of the entire teaching jig are all open.
ウェハーＷが挿入装着された状態でインデックスアームＲによって抽出する場合でも、透視窓６を介して、ウェハーＷがインデックスアームＲに正確にロードされて抽出されるかを確認することができるなどの作動関係を容易に確認することができる。 Even when extraction is performed by the index arm R in a state where the wafer W is inserted and mounted, it is possible to confirm whether the wafer W is accurately loaded and extracted through the fluoroscopic window 6 or the like. The relationship can be easily confirmed.
前記ホルダー軸３の前後方にそれぞれ設けた第１及び第２位置測定装置Ｐ、Ｐ１は、インデックスアームＲが進入したとき、前記インデックスアームＲを停止した状態で両側の測定固定ブロック１０をガイドレール８に沿って互いに内方へ移動させて両側の測定板１３をインデックスアームＲの両側縁に密着させた後、両側の目盛り指示チップ１６が目盛り板１７に位置するようにすることにより、インデックスアームＲの進入および抽出の際にセンターを正確に測定して確認することができるため、左右偏心状態を測定することができる。 The first and second position measuring devices P and P1 provided on the front and rear sides of the holder shaft 3, respectively, guide the measurement fixing blocks 10 on both sides with the guide rails while the index arm R is stopped when the index arm R enters. 8, the measuring plates 13 on both sides are brought into close contact with both side edges of the index arm R, and the index indicating chips 16 on both sides are positioned on the scale plate 17. Since the center can be accurately measured and confirmed during the entry and extraction of R, the left-right eccentric state can be measured.
ホルダー軸３の前後方に第１及び第２位置測定装置Ｐ、Ｐ１が設けられ、インデックスアームの進入および抽出の際に真直度を測定することができ、前記両側の測定板１３の位置目盛り１２によって水平度および傾きを測定することができる。 First and second position measuring devices P, P1 are provided on the front and rear of the holder shaft 3 so that the straightness can be measured when the index arm enters and extracts, and the position scales 12 of the measurement plates 13 on both sides are measured. Can measure the level and tilt.
前記支持板１の前方一側に設けられ、左右水平状態を測定する水平測定レベル計測器１８は、ウェハーが積載される積載台の左右水平状態を測定する。前記支持板１の後方一側に設けられ、前後水平状態を測定する水平測定レベル計測器１９は、ウェハーが積載される積載台の前後水平状態を測定する。 A horizontal measurement level measuring device 18 provided on one front side of the support plate 1 and measuring a horizontal horizontal state measures a horizontal horizontal state of a loading table on which a wafer is loaded. A horizontal measurement level measuring device 19 provided on one rear side of the support plate 1 and measuring the front-rear horizontal state measures the front-rear horizontal state of the loading table on which the wafer is loaded.
前記棚段２ａの前方下側に形成した傾斜面２ｂは、ウェハーがロードされたインデックスアームの進入の際に衝突を予め防止するためのものであり、支持突部２ｃ、４ｂの突出は、ウェハーの当接面積を最小化することで水平状態の精度の高い測定を実現し且つウェハーの損傷を防止するためのものである。 The inclined surface 2b formed on the lower front side of the shelf 2a is for preventing collision in advance when the index arm loaded with the wafer enters, and the protrusions of the support protrusions 2c and 4b are formed on the wafer. By minimizing the contact area, it is possible to realize a highly accurate measurement in the horizontal state and prevent damage to the wafer.
上述したようにすべての測定および校正を介して、テストが完了し、工程稼働の際にインデックスの正常な作動と判別されると、本発明のティーチング治具によるティーチングが完了する。 As described above, when the test is completed through all the measurements and calibrations and it is determined that the index is operating normally during the process operation, the teaching by the teaching jig of the present invention is completed.
以上のように、本発明は、インデックスアームなどの製造設備を再びセットするためのティーチング作業の際に、インデックスアームの位置測定および校正を正確かつ容易にするとともに、インデックスアームとウェハーが正確にホールドされてインデックスアームによってウェハーが正確に挿入装着および抽出されるかを容易に確認することができるなど、ティーチング（Ｔｅａｃｈｉｎｇ）の際にインデックスアームとウェハーとの作動関係を容易かつ正確に確認することができる。 As described above, the present invention makes it possible to accurately and easily measure and calibrate the position of the index arm and accurately hold the index arm and the wafer during teaching work for setting the manufacturing equipment such as the index arm again. Thus, it is possible to easily confirm whether the index arm and the wafer are in operation during teaching, for example, it is possible to easily confirm whether the wafer is correctly inserted and mounted and extracted by the index arm. it can.
１ 支持板
２ ホルダー溝
２ａ 棚段
２ｂ 傾斜面
２ｃ、４ｂ：支持突部
３ ホルダー軸
４ ストッパー軸
４ａ ストッパー溝
５ 目盛りバー
５ａ 目盛り表示
６ 透視窓
７ フレーム天板
８ ガイドレール
９ ストッパー
１０ 測定固定ブロック
１１ レールブロック
１２ 位置目盛り
１３ 測定板
１４ ヒンジ軸
１５、１５ａ 磁石
１６ 目盛り指示チップ
１７ 目盛り板
１８、１９ 水平測定レベル計測器
２０ ホールブロック
Ｐ、Ｐ１ 第１および第２位置測定装置
DESCRIPTION OF SYMBOLS 1 Support plate 2 Holder groove 2a Shelf 2b Inclined surface 2c, 4b: Support protrusion 3 Holder shaft 4 Stopper shaft 4a Stopper groove 5 Scale bar 5a Scale display 6 Viewing window 7 Frame top plate 8 Guide rail 9 Stopper 10 Measurement fixed block DESCRIPTION OF SYMBOLS 11 Rail block 12 Position scale 13 Measurement board 14 Hinge shaft 15, 15a Magnet 16 Scale indication chip 17 Scale board 18, 19 Horizontal measurement level measuring device 20 Hole block P, P1 1st and 2nd position measurement apparatus
Claims (3)
前記ホルダー軸の後方の両側部に立設され、半導体ウェハーを位置に合わせて固定させるためのストッパー軸と、
前記両側のストッパー軸の後方中央に立設され、半導体ウェハーの位置を確認するための目盛りが表示された目盛りバーと、
前記ホルダー軸、前記ストッパー軸および前記目盛りバーの上端部に固定設置され、透視窓を有するフレーム天板とを含んでなり、
前記ホルダー軸のホルダー溝は棚段によって形成され、前記棚段の入口には傾斜部が形成され、棚段上には半導体ウェハーが装着される支持突部が両側に突設され、前記ストッパー軸にはストッパー溝が凹設され、前記ストッパー溝には前記支持突部と同じ水平線上に半導体ウェハーが装着される支持突部が形成されてなり、
前記ホルダー軸の前後方にはそれぞれ第１及び第２位置測定装置が構成され、
前記第１及び第２位置測定装置は両側にガイドレールを固定設置され、前記ガイドレールにはストッパーを有する測定固定ブロックをレールブロックによってガイドされるように挿設され、
前記測定固定ブロックには位置目盛りが表示された測定板がヒンジ軸で回動自在に設置され、前記ストッパーと前記測定板にはそれぞれ極性の異なる磁石を固定設置し、前記測定固定ブロックの端部には目盛り指示チップが固定設置され、
前記両側の目盛り指示チップの前方には目盛り板が構成されてなる、ことを特徴とする、半導体ウェハーティーチング治具。 A holder shaft having a plurality of holder grooves which are erected on both sides on a support plate and into which a semiconductor wafer is inserted and mounted;
Stopper shafts that are erected on both sides of the holder shaft at the rear and for fixing the semiconductor wafer in position,
A scale bar that is erected at the rear center of the stopper shafts on both sides and displays a scale for confirming the position of the semiconductor wafer;
The holder shaft, the stopper shaft, and a frame top plate that is fixedly installed at the upper end of the scale bar and has a see-through window;
Holder groove of the holder shaft is formed by a tray, the the entrance of shelves inclined portion is formed, the support projections semiconductor wafer is mounted is protruded on both sides to the shelf rows above the stopper shaft The stopper groove is recessed , and the stopper groove is formed with a support protrusion on which the semiconductor wafer is mounted on the same horizontal line as the support protrusion .
First and second position measuring devices are configured on the front and rear sides of the holder shaft, respectively.
The first and second position measuring devices are fixedly installed with guide rails on both sides, and a measurement fixing block having a stopper is inserted into the guide rail so as to be guided by the rail block,
A measuring plate with a position scale displayed on the measurement fixing block is rotatably installed on a hinge shaft, and magnets having different polarities are fixedly installed on the stopper and the measuring plate, respectively. The scale indicator chip is fixedly installed in the
A semiconductor wafer teaching jig, characterized in that a scale plate is formed in front of the scale indicating chips on both sides .
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| KR102063654B1 (en) * | 2019-03-04 | 2020-01-09 | 오세덕 | Wafer teaching jig |
| CN111013950A (en) * | 2019-12-02 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | Silicon wafer passivation device and method |
| KR102397940B1 (en) * | 2020-05-26 | 2022-05-16 | (주)티에프씨랩 | Maintenance apparatus for wafer transfer robot |
| CN113357991B (en) * | 2021-05-28 | 2023-06-02 | 艾华(无锡)半导体科技有限公司 | Detection tool for wafer carrier |
| KR102342264B1 (en) * | 2021-06-03 | 2021-12-22 | 정병철 | Measuring instrument for calibration of semiconductor wafers |
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| KR19990006023U (en) * | 1997-07-23 | 1999-02-18 | 문정환 | Boat for Semiconductor Wafer Deposition Equipment |
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| JP2008084938A (en) * | 2006-09-26 | 2008-04-10 | Nec Electronics Corp | Method for teaching various setting values to substrate processing apparatus, teachingapparatus, and calibration jig thereof |
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