JP5236255B2 - Inspection device - Google Patents

Inspection device Download PDF

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JP5236255B2
JP5236255B2 JP2007291485A JP2007291485A JP5236255B2 JP 5236255 B2 JP5236255 B2 JP 5236255B2 JP 2007291485 A JP2007291485 A JP 2007291485A JP 2007291485 A JP2007291485 A JP 2007291485A JP 5236255 B2 JP5236255 B2 JP 5236255B2
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support pin
support
height
installation
visible light
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JP2009115725A (en
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忠士 遠藤
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Description

本発明は、基板を下方から支持するサポートピンの設置状態を検査する検査装置に関するものである。   The present invention relates to an inspection apparatus for inspecting the installation state of support pins that support a substrate from below.

実装対象となる基板を部品の実装が可能な姿勢で支持する方法として、複数のサポートピンを起立姿勢で設置し、サポートピンの先端面で基板の裏面を下方から支持する方法が知られている。個々のサポートピンは、それぞれの先端面が接触する基板の裏面の高さに対応した長さのものが選択され、これらを正しい起立姿勢で設置することで基板の表面（実装面）を水平にした状態で支持することができる。これらのサポートピンの設置作業は人手によって行われるため、斜め姿勢となって設置されたり、対応しない長さのものが設置されたりするなどの人為的ミスが介入する余地がある。このような状態で基板を支持した場合、基板の表面の水平度が維持できなくなり、部品実装時の高さ制御機能が不全となって部品の破損や実装個所、実装強度が設計値を満たさないという事態を招くことになる。   As a method of supporting a board to be mounted in a posture in which components can be mounted, a method is known in which a plurality of support pins are installed in a standing posture and the back surface of the substrate is supported from below by the front end surfaces of the support pins. . Each support pin has a length corresponding to the height of the back surface of the board that contacts the tip of each of the pins. By placing these pins in the correct standing position, the surface of the board (mounting surface) is leveled. Can be supported. Since these support pins are installed manually, there is room for human error such as installation in an oblique posture or installation of an unsupported length. If the board is supported in such a state, the level of the board surface cannot be maintained, and the height control function during component mounting will fail, resulting in component damage, mounting location, and mounting strength not meeting the design values. Will lead to the situation.

このような問題を解決するため、従来、複数のサポートピンによって支持された基板自体の高さを測定することで基板の支持状態の適否を判断する方法が提案されている（特許文献１参照）。
特開２００３−２１８５９５号公報 In order to solve such a problem, conventionally, a method for determining the suitability of a substrate support state by measuring the height of the substrate itself supported by a plurality of support pins has been proposed (see Patent Document 1). .
JP 2003-218595 A

しかし、この方法では、サポートピンの設置状態に異常がある場合に基板に偏荷重が作用し、基板が使用不可になるだけではなく、サポートピン自体にも想定外の荷重による変形や破損を招く可能性がある。また、どのサポートピンの設置状態に異常があるのかを特定することができないので、異常箇所だけを修正して素早く正常化するという処置を施すことができず、生産性の低下を招くという問題がある。   However, with this method, when there is an abnormality in the installation state of the support pins, an unbalanced load acts on the board and the board becomes unusable, and the support pins themselves are also deformed or damaged by an unexpected load. there is a possibility. In addition, since it is not possible to identify which support pin is in an abnormal installation state, it is not possible to take action to correct only the abnormal part and quickly normalize it, resulting in a decrease in productivity. is there.

そこで本発明は、設置状態に異常があるサポートピンを特定することができる装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a device that can identify a support pin having an abnormal installation state.

請求項１に記載の検査装置は、基板を下方から支持する複数のサポートピンの設置状態を検査する検査装置であって、個々のサポートピンの先端面に光を照射する照射手段と、照射手段によって照射された光の反射光を受光して先端面の高さを測定する測定手段と、個々のサポートピンの先端面の高さのばらつきを許容する許容高さと個々のサポートピンの設置予定箇所とを記憶する記憶手段と、先端面の高さが許容高さを外れたサポートピンに可視光を照射する可視光照射手段を備え、前記測定手段が反射光の有無によってサポートピンの有無を検出し、前記可視光照射手段が、設置を予定する個所でサポートピンが検出されなかったときは当該個所を照射し、設置を予定しない個所でサポートピンが検出されたときは当該サポートピンを照射する。 The inspection apparatus according to claim 1 is an inspection apparatus that inspects an installation state of a plurality of support pins that support a substrate from below, and an irradiation unit that irradiates light on a tip surface of each support pin, and an irradiation unit Measuring means to measure the height of the tip surface by receiving the reflected light of the light irradiated by the, and the allowable height to allow variation in the height of the tip surface of each support pin and the planned installation of each support pin Storage means for storing the location, and visible light irradiation means for irradiating the support pin whose tip surface is out of the allowable height with visible light, and the measurement means determines whether the support pin is present depending on the presence or absence of reflected light. And when the support pin is not detected at the place where the installation is planned to be performed, the support pin is irradiated.When the support pin is detected at a place where the installation is not planned, the support pin is applied. Cum to.

請求項２に記載の検査装置は、請求項１に記載の検査装置であって、前記可視光照射手段が前記照射手段としても機能する。   An inspection apparatus according to a second aspect is the inspection apparatus according to the first aspect, wherein the visible light irradiation unit also functions as the irradiation unit.

本発明によれば、基板が載置される前段階で個々のサポートピンについて設置状態を検査し、異常な設置状態を示すサポートピンについては可視光によって照射するので、オペレータは照射されたサポートピンについてのみ異常内容を確認して適宜修正すればよく、修正作業が容易であり、技量や習熟度を問わず効率的で正確な修正が可能である。   According to the present invention, the installation state of each support pin is inspected before the substrate is placed, and the support pin indicating the abnormal installation state is irradiated with visible light. It is only necessary to confirm the abnormality content and correct it appropriately, and the correction work is easy, and an efficient and accurate correction is possible regardless of the skill and the skill level.

本発明の実施の形態について図面を参照して説明する。図１は本発明の実施の形態の検査装置の構成を示すブロック図、図２は基板支持装置の斜視図、図３は基板支持装置の側面図、図４は本発明の実施の形態の検査装置を用いてサポートピンの設置状態の検査を行う工程を示したフローチャートである。   Embodiments of the present invention will be described with reference to the drawings. 1 is a block diagram showing a configuration of an inspection apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the substrate support apparatus, FIG. 3 is a side view of the substrate support apparatus, and FIG. 4 is an inspection according to the embodiment of the present invention. It is the flowchart which showed the process of inspecting the installation state of a support pin using an apparatus.

図１において、検査装置は、光センサ１と制御部２と移動装置３と表示装置４とで構成されている。制御部２は、照射部５と高さ測定部６とデータ記憶部７と異常箇所検出部８と異常箇所記憶部９と駆動部１０と可視光照射部１１と表示部１２とで構成されている。   In FIG. 1, the inspection device includes an optical sensor 1, a control unit 2, a moving device 3, and a display device 4. The control unit 2 includes an irradiation unit 5, a height measurement unit 6, a data storage unit 7, an abnormal part detection unit 8, an abnormal part storage unit 9, a drive unit 10, a visible light irradiation unit 11, and a display unit 12. Yes.

図２は基板支持装置の斜視図である。基板支持装置２０は、実装機や印刷機などの部品実装用装置において基板搬送レール１３を搬送される基板１４を支持するために用いられ、サポートプレート２１、２２、２３を上下に間隔をおいて鉛直方向に揃えた３層構造のピン支持部と、ピン支持部に設置された複数のサポートピン２４と、基板に対してピン支持部を相対的に昇降させる昇降部で構成されている。上層の２つのサポートプレート２１、２２にはサポートピン２４の設置箇所となる複数の孔２５が所定の配置で形成されている。図３の基板支持装置の側面図に示すように、最上層のサポートプレート２１に形成された複数の孔２５と中間層のサポートプレート２２に形成された複数の孔２５は鉛直方向に貫通しており、貫通する２つの孔２５にサポートピン２４を上方から挿入し、最下層のサポートプレート２３に下端が当接するまで押し込むことでサポートピン２４をピン支持部に装着する。サポートピン２４は鉛直方向に起立した姿勢でピン支持部に適宜間隔をおいて設置され、先端面２６に載置された基板を下方から支持する。   FIG. 2 is a perspective view of the substrate support apparatus. The substrate support device 20 is used to support the substrate 14 conveyed on the substrate conveyance rail 13 in a component mounting apparatus such as a mounting machine or a printing machine, and the support plates 21, 22, and 23 are spaced vertically. It comprises a pin support portion having a three-layer structure aligned in the vertical direction, a plurality of support pins 24 installed on the pin support portion, and an elevating portion that raises and lowers the pin support portion relative to the substrate. A plurality of holes 25 serving as installation locations for the support pins 24 are formed in a predetermined arrangement in the two upper support plates 21 and 22. As shown in the side view of the substrate support device of FIG. 3, the plurality of holes 25 formed in the uppermost support plate 21 and the plurality of holes 25 formed in the support plate 22 of the intermediate layer penetrate vertically. Then, the support pins 24 are inserted into the two through holes 25 from above and pushed into the lowermost support plate 23 until the lower end comes into contact therewith, so that the support pins 24 are attached to the pin support portion. The support pins 24 are installed at appropriate intervals on the pin support portions in an upright posture, and support the substrate placed on the front end surface 26 from below.

移動装置３は、光センサ１を基板支持装置２０の上方で水平方向に移動させる装置であり、例えば部品実装を行う実装機の実装ヘッド１５に光センサ１を装着した場合は実装ヘッド１５を基板１４の上方で水平移動させるための水平移動機構を用いることができる。移動装置３は駆動部１０によって動作制御が行われ、サポートピン２４の設置箇所となる複数の孔２５の鉛直上方に光センサ１を順次移動させて位置決めを行う。   The moving device 3 is a device that moves the optical sensor 1 in the horizontal direction above the substrate support device 20. For example, when the optical sensor 1 is mounted on the mounting head 15 of a mounting machine that mounts components, the mounting head 15 is mounted on the substrate. A horizontal movement mechanism for moving horizontally above 14 can be used. The operation of the moving device 3 is controlled by the drive unit 10, and the optical sensor 1 is sequentially moved vertically above the plurality of holes 25 where the support pins 24 are installed to perform positioning.

表示装置４は、ＣＲＴや液晶パネルのような情報の可視表示を行う装置であり、表示部１２から送られてきた情報をオペレータに提示する。照射部５は、光センサ１が個々のサポートピン２４の先端面２６に向けて可視光を照射する動作を司る。   The display device 4 is a device that performs visual display of information such as a CRT or a liquid crystal panel, and presents information sent from the display unit 12 to an operator. The irradiation unit 5 controls the operation in which the optical sensor 1 irradiates visible light toward the tip surface 26 of each support pin 24.

高さ測定部６は、光センサ１から鉛直下方に向けて照射された可視光の発光位置と、先端面２６で反射した反射光の受光位置との距離が光センサ１と先端面２６との高さの差に比例することを利用し、光センサ１との高さの差が既知である基準点からの先端面２６の高さを測定する。サポートピン２４の先端面２６が鏡面処理されていると反射光がうまく拡散せず、高さ測定が不能になるので、基板の支持を妨げない程度に先端面２６を粗面処理するか、セラミック等の多孔質素材を先端面２６に装着しておくことが望ましい。また、光センサ１の鉛直下方にサポートピン２４が存在すれば先端面２６で反射した反射光を受光し、鉛直下方にサポートピン２４が存在しなければ反射光を受光しないので、高さ測定部６は反射光の有無によってサポートピン２４の有無を検出することができる。   The height measuring unit 6 is configured such that the distance between the light emission position of the visible light irradiated vertically downward from the optical sensor 1 and the light reception position of the reflected light reflected by the distal end surface 26 is the distance between the optical sensor 1 and the distal end surface 26. Utilizing the fact that it is proportional to the difference in height, the height of the tip face 26 from the reference point where the difference in height from the optical sensor 1 is known is measured. If the tip surface 26 of the support pin 24 is mirror-finished, the reflected light is not diffused well and the height measurement becomes impossible. Therefore, the tip surface 26 is roughened to the extent that it does not interfere with the support of the substrate, or ceramic. It is desirable to attach a porous material such as a material to the tip surface 26. Further, if the support pin 24 exists vertically below the optical sensor 1, the reflected light reflected by the tip surface 26 is received. If the support pin 24 does not exist vertically below, the reflected light is not received. 6 can detect the presence or absence of the support pin 24 based on the presence or absence of reflected light.

データ記憶部７は、サポートピン２４の設置可能箇所と設置予定箇所をそれぞれ記憶している。また、個々のサポートピン２４の先端面２６の基準点からの高さの許容値（許容高さ）も記憶している。設置可能箇所とはサポートピン２４を設置するための孔２５が形成された箇所のことであり、設置予定箇所とは設置可能箇所のうち実際にサポートピン２４の設置を予定する箇所のことである。基板の種類に対応してサポートピン２４を設置すべきもしくは設置すべきでない箇所が決まり、設置すべき箇所である設置予定箇所に人手によってサポートピン２４を装着する。   The data storage unit 7 stores a place where the support pin 24 can be installed and a place where the support pin 24 is to be installed. Moreover, the allowable value (allowable height) of the height from the reference point of the tip surface 26 of each support pin 24 is also stored. The installable location is a location where a hole 25 for installing the support pin 24 is formed, and the planned installation location is a location where the installation of the support pin 24 is actually planned among the installable locations. . The place where the support pin 24 should or should not be installed is determined according to the type of substrate, and the support pin 24 is manually attached to the place where the support pin 24 is to be installed.

このサポートピン２４の設置作業に人為的ミスが介入する余地があり、例えば図３に示す４本のサポートピン２４のうち左端の２本は正確に装着されているが、その右隣のサポートピン２４は最下層のサポートプレート２３に落下していた部品２７に乗り上げた状態で装着されている。また右端のサポートピン２４は他の３本のサポートピン２４より短い別の種類のものが誤装着されている。右端の２本の先端面２６は正確に装着された左端の２本の先端面２６と高さが揃っていないが、その差が僅少であれば肉眼での判別は困難であるのでミスに気付かないことが多い。このため基板１４を水平に支持することができない状態になっているにも関わらず基板を載置し、部品実装時の高さ制御機能が不全となって部品の破損や実装個所、実装強度が設計値を満たさないという事態を招きかねない。   There is room for human error to intervene in the installation work of the support pin 24. For example, the leftmost two of the four support pins 24 shown in FIG. 24 is mounted in a state where it rides on the part 27 that has fallen on the lowermost support plate 23. In addition, another type of support pin 24 at the right end that is shorter than the other three support pins 24 is erroneously mounted. The two rightmost tip surfaces 26 are not exactly the same height as the two leftmost tip surfaces 26 that are correctly mounted, but if the difference is small, it is difficult to distinguish with the naked eye, so you will notice a mistake. Often not. For this reason, although the board 14 cannot be supported horizontally, the board is placed, and the height control function at the time of component mounting becomes incomplete, resulting in damage to parts, mounting locations, and mounting strength. It can lead to a situation where design values are not met.

異常箇所検出部８は、高さ測定部６によって測定された個々のサポートピン２４の先端面２６の基準点からの高さと、データ記憶部７に記憶されたそれぞれの許容高さを比較し、測定された先端面２６の高さが許容高さを外れたサポートピン２４が設置された箇所を検出する。許容高さは設計上要求される設計高さを挟んで上下に任意の幅をもって設定されており、各先端面２６の高さがこの幅に収まる程度のばらつきであれば基板１４の水平度を確保する上で許容できるという観点から設定されている。図３に示す左側の２本のサポートピン２４は許容高さに収まっているが、右端の２本のサポートピン２４は許容高さを上下に大きく外れている。また、異常箇所検出部８は、設置予定個所であるにも関わらずサポートピン２４が設置されていない箇所、および設置予定個所でないにも関わらずサポートピン２４が設置された箇所を検出する。異常箇所検出部８によって検出された箇所は異常箇所データとして異常箇所記憶部９に記憶する。   The abnormal point detection unit 8 compares the height from the reference point of the distal end surface 26 of each support pin 24 measured by the height measurement unit 6 with each allowable height stored in the data storage unit 7, A place where the support pin 24 where the height of the measured tip surface 26 is outside the allowable height is installed is detected. The allowable height is set with an arbitrary width above and below the design height required in design, and the level of the substrate 14 is adjusted if the height of each front end face 26 is within a range that fits within this width. It is set from the viewpoint that it is acceptable in securing. Although the two left support pins 24 shown in FIG. 3 are within the allowable height, the two rightmost support pins 24 are greatly deviated from the upper and lower allowable heights. In addition, the abnormal location detection unit 8 detects a location where the support pin 24 is not installed although it is a planned installation location, and a location where the support pin 24 is installed although it is not a planned location. The part detected by the abnormal part detection unit 8 is stored in the abnormal part storage unit 9 as abnormal part data.

可視光照射部１１は、光センサ１が可視光を異常箇所に向けて上方から照射する動作を司る。可視光の照射は、異常箇所記憶部９に記憶された異常箇所データに基づいて駆動部１０が移動装置３を駆動し、光センサ１を異常箇所の鉛直上方に順次位置決めして行う。可視光が照射された箇所はサポートピン２４の設置に関して何らかの異常がある箇所であり、オペレータが可視光を認識し、可視光が照射された箇所におけるサポートピン２４の設置状態を正しい設置状態に修正する。   The visible light irradiation unit 11 controls the operation in which the optical sensor 1 irradiates visible light toward the abnormal part from above. Irradiation with visible light is performed by the driving unit 10 driving the moving device 3 based on the abnormal part data stored in the abnormal part storage unit 9 and sequentially positioning the optical sensor 1 vertically above the abnormal part. The place irradiated with visible light is a place where there is some abnormality regarding the installation of the support pin 24, the operator recognizes the visible light, and corrects the installation state of the support pin 24 at the place irradiated with visible light to the correct installation state. To do.

表示部１２は可視光が照射された箇所における異常内容を表示装置４に表示する。表示装置４は、許容高さを外れたサポートピン２４が設置されている場合は「測定高さ＞許容高さ」、「測定高さ＜許容高さ」等と表示し、設置すべきでないサポートピン２４が誤って設置されている場合は「設置不要」等と表示し、設置すべきサポートピン２４が設置されていない場合は「設置必要」等と表示する。   The display unit 12 displays on the display device 4 the details of the abnormality at the location irradiated with visible light. The display device 4 displays “measurement height> allowable height”, “measurement height <allowable height”, etc., when the support pin 24 outside the allowable height is installed, and should not be installed. When the pin 24 is installed by mistake, “installation is unnecessary” or the like is displayed, and when the support pin 24 to be installed is not installed, “installation is necessary” or the like is displayed.

オペレータは、「測定高さ＞許容高さ」とされたサポートピン２４については、部品等に乗り上げた状態になっていれば部品等を取り除き、全長が長い別の種類のものが設置されていれば正しい種類のものに差し替える等の処置を行う。一方「測定高さ＜許容高さ」とされたサポートピン２４については、傾斜姿勢で装着された場合であれば起立姿勢に修正し、全長が短い別の種類のものが設置されていれば正しい種類のものに差し替える等の処置を行う。また「設置不要」とされたサポートピン２４は除去し、「設置必要」とされた箇所にはサポートピン２４を設置する。   The operator can remove the support pin 24 with “measured height> allowable height” if it is in the state of riding on the component, etc., and install another type with a long overall length. If necessary, take appropriate measures such as replacing it with the correct type. On the other hand, the support pin 24 with “measured height <allowable height” is corrected to a standing posture if it is mounted in an inclined posture, and is correct if another type with a short overall length is installed. Take measures such as switching to a different type. Further, the support pins 24 that are set as “installation unnecessary” are removed, and the support pins 24 are set at the locations that are set as “installation required”.

オペレータがサポートピン２４の設置状態を修正する間も可視光を照射し続けることで、修正後のサポートピン２４についての設置状態が即時に検査され、正しく修正されていれば表示装置４は「修正済」等の表示を行い、全ての異常箇所について正しく修正を終えると表示装置は「修正完了」等の表示を行う。これにより、修正後のサポートピン２４について設置ミスがあれば直ちに再修正することができる。   By continuing to irradiate visible light while the operator corrects the installation state of the support pin 24, the installation state of the support pin 24 after the correction is inspected immediately. Display ”is displayed, and when all the abnormal portions are corrected correctly, the display device displays“ correction complete ”or the like. Thereby, if there is an installation mistake about the support pin 24 after correction, it can be corrected again immediately.

このように構成された検査装置によれば、基板支持装置２０に配置された複数のサポートピン２４について基板が載置される前段階で個々に検査し、異常な設置状態を示す箇所は可視光によって照射されるので、オペレータは照射された箇所についてのみ異常内容を確認して適宜修正すればよく、修正作業が容易であり、技量や習熟度を問わず効率的で正確な修正が可能となる。   According to the inspection apparatus configured as described above, a plurality of support pins 24 arranged on the substrate support apparatus 20 are individually inspected before the substrate is placed, and a portion showing an abnormal installation state is visible light. Therefore, the operator only needs to check the contents of the abnormality for the irradiated part and correct it appropriately, the correction work is easy, and efficient and accurate correction is possible regardless of skill and skill level. .

本実施の形態の検査装置の構成において、光センサ１と照射部５は、個々のサポートピン２４の先端面２６に光を照射する照射手段である。光センサ１と可視光照射部１１は、許容高さを外れたサポートピンに可視光を照射し、設置を予定しない個所でサポートピンが検出されたときは当該サポートピンに可視光を照射し、設置を予定する箇所でサポートピンが検出されなかったときは当該箇所に可視光を照射する可視光照射手段である。光センサ１と高さ測定部６は、光センサ１によって照射された光の反射光を受光して先端面２６の高さを測定する測定手段である。データ記憶部７は、個々のサポートピン２４の先端面２６の許容高さを記憶する記憶手段である。   In the configuration of the inspection apparatus according to the present embodiment, the optical sensor 1 and the irradiation unit 5 are irradiation units that irradiate light to the tip surfaces 26 of the individual support pins 24. The optical sensor 1 and the visible light irradiating unit 11 irradiate the support pin that is out of the allowable height with visible light. When the support pin is detected at a place where the installation is not planned, the support pin is irradiated with visible light. When the support pin is not detected at the place where the installation is planned, the visible light irradiating means irradiates the spot with visible light. The optical sensor 1 and the height measuring unit 6 are measuring units that receive the reflected light of the light irradiated by the optical sensor 1 and measure the height of the distal end surface 26. The data storage unit 7 is a storage unit that stores the allowable height of the distal end surface 26 of each support pin 24.

図４は本実施の形態の検査装置を用いてサポートピンの設置状態の検査を行う工程を示したフローチャートである。最初にオペレータが複数のサポートピン２４を設置予定箇所に設置する（ＳＴ１）。次に検査装置が全ての設置可能箇所におけるサポートピン２４の設置状態を検査する（ＳＴ２）。検査の結果、設置状態に異常がある箇所が検出されなければ、基板支持装置に基板を載置して部品実装等の生産を開始する（ＳＴ３）。設置状態に異常がある箇所が検出されれば、その異常箇所を順番に照射し（ＳＴ４）、オペレータは照射された箇所についてサポートピン２４の設置状態を修正する（ＳＴ５）。修正作業が完了すると再度設置状態を検査し（ＳＴ２）、異常箇所が検出されなければ生産を開始する（ＳＴ３）。   FIG. 4 is a flowchart showing a process for inspecting the installation state of the support pins using the inspection apparatus of the present embodiment. First, the operator installs a plurality of support pins 24 at a planned installation location (ST1). Next, the inspection device inspects the installation state of the support pins 24 in all the installable locations (ST2). As a result of the inspection, if a location where there is an abnormality in the installation state is not detected, the substrate is placed on the substrate support device and production such as component mounting is started (ST3). If a location where there is an abnormality in the installation state is detected, the abnormal locations are irradiated in order (ST4), and the operator corrects the installation state of the support pin 24 for the irradiated location (ST5). When the correction work is completed, the installation state is inspected again (ST2), and if no abnormal part is detected, production is started (ST3).

本発明は、基板支持装置に配置された複数のサポートピンについて基板が載置される前の段階で個々に検査し、異常な設置状態を示す箇所については可視光によって照射することで、オペレータは照射された箇所についてのみ異常内容を確認して適宜修正すればよく、修正作業が容易であり、技量や習熟度を問わず効率的で正確な修正が可能であるという効果を奏し、基板の水平度が要求される実装分野において特に有用である。   The present invention individually inspects a plurality of support pins arranged in the substrate support device before the substrate is placed, and irradiates a portion showing an abnormal installation state with visible light, so that the operator can It is only necessary to check the contents of the abnormalities only for the irradiated part and correct them appropriately, making the correction work easy, and effective and accurate correction is possible regardless of skill and proficiency. This is particularly useful in the mounting field where the degree is required.

本発明の実施の形態の検査装置の構成を示すブロック図The block diagram which shows the structure of the inspection apparatus of embodiment of this invention 基板支持装置の斜視図Perspective view of substrate support device 基板支持装置の側面図Side view of substrate support device 本発明の実施の形態の検査装置を用いてサポートピンの設置状態の検査を行う工程を示したフローチャートThe flowchart which showed the process of inspecting the installation state of a support pin using the inspection apparatus of embodiment of this invention

符号の説明Explanation of symbols

１ 光センサ
５ 照射部
６ 高さ測定部
７ データ記憶部
１１ 可視光照射部
２４ サポートピン
２６ 先端面 DESCRIPTION OF SYMBOLS 1 Optical sensor 5 Irradiation part 6 Height measurement part 7 Data storage part 11 Visible light irradiation part 24 Support pin 26 Tip surface

Claims (2)

基板を下方から支持する複数のサポートピンの設置状態を検査する検査装置であって、
個々のサポートピンの先端面に光を照射する照射手段と、照射手段によって照射された光の反射光を受光して先端面の高さを測定する測定手段と、個々のサポートピンの先端面の高さのばらつきを許容する許容高さと個々のサポートピンの設置予定箇所とを記憶する記憶手段と、先端面の高さが許容高さを外れたサポートピンに可視光を照射する可視光照射手段、を備え、
前記測定手段が反射光の有無によってサポートピンの有無を検出し、
前記可視光照射手段が、設置を予定する個所でサポートピンが検出されなかったときは当該個所を照射し、設置を予定しない個所でサポートピンが検出されたときは当該サポートピンを照射する検査装置。 An inspection device for inspecting the installation state of a plurality of support pins for supporting a substrate from below,
Irradiation means for irradiating light to the tip surface of each support pin, measurement means for measuring the height of the tip surface by receiving reflected light of the light irradiated by the irradiation means, and the tip surface of each support pin Storage means for storing the allowable height that allows variation in height and the planned installation location of each support pin, and visible light irradiation that irradiates the support pin whose tip surface height is outside the allowable height with visible light Means,
The measuring means detects the presence or absence of a support pin by the presence or absence of reflected light,
The inspection device that irradiates the support pin when the visible light irradiation means does not detect the support pin at the place where the installation is planned and irradiates the support pin when the support pin is detected at the place where the installation is not planned. . 前記可視光照射手段が前記照射手段としても機能する請求項１に記載の検査装置。   The inspection apparatus according to claim 1, wherein the visible light irradiation unit also functions as the irradiation unit.
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