JP3914299B2 - Arrangement method of substrate support pins - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
According to the present invention, in an electronic component mounting system, the arrangement of board support pins that can automatically calculate a suitable arrangement position of support pins for supporting a printed circuit board from below when mounting electronic components on a support plate. It is about the method.
[0002]
[Prior art]
In the electronic component mounting system, as shown in the plan view and the front view of FIGS. 5A and 5B, the printed circuit board 3 is pressed from above by a plurality of support pins 2 erected on the support plate 1. It supports it from below against this.
[0003]
Here, when the electronic component 7 is mounted in advance on the lower surface of the printed circuit board 3 as shown in FIG. 5B, a position that does not contact the electronic component 7 is selected and the support pin 2 is attached to the support plate 1. Need to be placed. The printed circuit board 3 is supported by the support pins 2 when not only the electronic component 7 is mounted on the printed circuit board 3 but also an adhesive for fixing the electronic component is applied to the printed circuit board or cream solder is printed. This also prevents the printed circuit board 3 from being bent and hindering the work.
[0004]
As shown in FIG. 5A, a large number of pin support holes 4 are formed at a constant pitch on the surface of the support plate 1 for holding the support pins 2 in a vertical state. A desired one of the holes 4 suitable for the printed circuit board 3 is selected, and the support pins 2 are erected in the pin support holes 4. Then, as shown in FIG. 5B, when the printed circuit board 3 is positioned at a predetermined mounting position, the support plate 1 is raised and the tips of the support pins 2 are brought into contact with the lower surface of the printed circuit board 3. The When the mounting of the electronic component 7 on the printed circuit board 3 is completed, the support plate 1 is once lowered, and then again when the mounted printed circuit board 3 is unloaded and the next printed circuit board 3 is positioned at the mounting position. The support pins 2 are brought into contact with the lower surface of the printed circuit board 3 and this operation is repeated.
[0005]
By the way, when the production of a certain type of printed circuit board 3 is completed, the support plate 1 is replaced. That is, when the production of the printed circuit board 3 of the previous product is completed, all the support pins 2 are removed from the support plate 1, and the distance between the guide rails (not shown) for conveying the printed circuit board 3 is the width of the printed circuit board to be produced next Set to match. Subsequently, the worker selects a pin support hole 4 for favorably supporting the printed circuit board 3 to be produced next, and fits and fixes the support pin 2 in the pin support hole 4.
[0006]
When the placement of the support pins 2 on the support plate 1 is completed, the printed circuit board 3 is actually transported and positioned at the mounting position, and then the support plate 1 is lifted so that each support pin 2 is placed on the printed circuit board 3. It is made to contact | abut to a lower surface, and it is confirmed whether the support pin 2 is supporting the printed circuit board 3 by effective arrangement | positioning, without contact | abutting or contacting the electronic component 7. FIG. If there is an inconvenience, reconfirmation is performed again while changing the arrangement position of the support pins 2, and the same operation is repeated until it can be confirmed that the support pins 2 are in a suitable arrangement.
[0007]
[Problems to be solved by the invention]
However, in the above-described arrangement method of the support pins 2, all depends on the visual judgment of the worker, so that it takes too much time to arrange the support pins 2 in a suitable arrangement, and the printed circuit board 3. As a result, it is not possible to set up a new printed circuit board 3 efficiently, especially when the production form of the printed circuit board 3 is a small variety of products. There is a problem that causes a decrease in rate.
[0008]
Moreover, in recent years, minute chip parts are often mounted on the printed circuit board 3, and such chip parts are likely to be overlooked. If the support pins 2 are mistakenly arranged at the position of the support plate 1 facing the mounting position of the chip parts, when the support plate 1 is raised for confirmation, or the support pins 2 are misplaced. If the electronic component is mounted without any problem, the trouble that the chip component is destroyed by the contact of the support pin 2 occurs.
[0009]
Accordingly, the present invention provides a board support pin arrangement method that eliminates the above-mentioned conventional problems and can automatically and quickly automatically set a suitable support pin arrangement position corresponding to a printed circuit board to be produced. It is intended to do.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a plurality of supports for supporting the printed circuit board by bringing respective tips into contact with the lower surface of the printed circuit board when mounting electronic components on the upper surface of the printed circuit board. In the method of arranging the substrate support pins in which the necessary pins are inserted into a plurality of pin support holes provided at a constant pitch on the support plate and are erected, each electron mounted on the lower surface of the printed circuit board A calculation step based on component mounting position data and part data representing the size of these electronic components to calculate a non-placeable range of the support pins on the top surface of the printed circuit board, and within a range excluding the non-placeable range among the pin support hole present in the position of adjacent pin support one to remove and pin support holes to be inserted the support pin holes to each other It has a step of calculating the spin insert data, and a step of displaying the pin insertion data on the screen.
[0011]
In this board support pin arrangement method, the support pins are appropriately arranged by electrical signal processing based on mounting position data of each electronic component mounted on the lower surface of the printed circuit board and part data representing the size of the electronic component. The installation position can be automatically selected, and pin insertion data indicating the position of the selected pin support hole is displayed. Therefore, the operator can easily and quickly arrange a plurality of support pins on the support plate while viewing the display, and the time required for the changeover due to the change of the printed circuit board to be produced can be greatly reduced. Can do. Moreover, even if minute chip parts are present in the mounted electronic parts, the positions of the support pins are arranged by electrical signal processing based on various data without the human judgment by the operator's eyes. Therefore, the support pin placement position can be accurately set within the required range excluding the mounting position of the electronic component, and the destruction of minute chip parts due to incorrect placement of the support pins is reliably prevented. can do.
[0012]
In the above invention, the pin support hole into which the support pin is to be inserted is instructed by irradiation with visible light based on the pin insertion data, and it is determined whether or not the support pin is disposed in the pin support hole. It is preferable that the next pin support holes are sequentially indicated by irradiation with visible light each time.
[0013]
As a result, the support pins can be arranged more quickly and accurately.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.
[0015]
FIG. 1 is a block diagram of a system according to an embodiment of a substrate support pin arranging method of the present invention. In the figure, a central processing unit (CPU) 10 controls the entire system by executing a control program set in advance in a ROM 11 and performing arithmetic processing. Alternatively, calculation processing is performed based on various control data read from the RAM 12, and the calculation result is stored in the RAM 12 and displayed on the display unit 13. Further, the central processing unit 10 controls the operation of the table 17 for operating the support plate via the table control unit 14 based on the calculation result, and provides the required pin support holes of the support plate and electronic components on the printed circuit board 3. The pin detection sensor 19 is positioned at a visible light irradiation position of a visible light irradiation unit 18 provided on a mounting head to be described later for mounting, and a support pin is inserted into a predetermined pin support hole of the support plate. When detected, the operation of the table 17 is controlled through the table control unit 14.
[0016]
Next, a method for arranging the board support pins at the time of changing the production setup of the printed board according to the above configuration will be described based on the flowchart of FIG. 2 with reference to FIGS. When electronic components are mounted on the front surface of the printed circuit board, the electronic components are not mounted on the back surface for supporting the printed circuit board 3 with support pins. What is necessary is just to arrange. Therefore, the selection of the support pin arrangement position becomes a problem only when the printed circuit board on which the electronic component is already mounted is turned over and the electronic component is mounted on the back surface.
[0017]
Now, description will be given of a case where a changeover is made to a component mounting process on the back surface of a certain type of printed circuit board. When the operator operates the key input unit 20 and designates and inputs the type of the printed board to be produced next (step S1), the central processing unit 10 is placed on the surface of the designated printed board (the lower surface at the time of mounting). The mounting position data of each mounted electronic component is read from the RAM 12 (step S2), and further the part data of each electronic component is read from the RAM 12 (step S3).
[0018]
Here, the mounting position data of the electronic component is printed at the center point of each electronic component when mounted on the surface of the printed circuit board 3 by the mounting head unit, as indicated by + in FIG. The coordinates on the substrate 3 are data for positioning an electronic component to be mounted by the mounting head unit. Further, as the part data, data related to the size of each electronic component is read out. The coordinates on the printed circuit board 3 are set based on one of the two reference pin insertion holes 21 provided on the printed circuit board 3. The reference pin insertion hole 21 is for inserting the reference pin and fixing the printed circuit board 3 at the mounting position when the printed circuit board 3 is conveyed and positioned at a predetermined mounting position.
[0019]
As shown in FIG. 3A, the central processing unit 10 has each electronic component mounted on the surface (the lower surface at the time of mounting) based on the coordinates of the center position of the electronic component and the size of the electronic component. The coordinates on the back surface (upper surface at the time of this mounting) of each corner of each are calculated by calculation, and the calculated coordinates of the plurality of corners are represented by horizontal parallel lines in FIG. The range connected for each component is calculated as a support pin non-placeable range A by calculation (step S4).
[0020]
Next, as shown in FIG. 3C, the central processing unit 10 has a pin support hole 4 of the support plate 1 based on a fixed arrangement pitch of the pin support holes 4 provided in the support plate 1. The one that is opposite to the printed circuit board 3 and that is present at a place other than the unplaceable range A is displayed on the screen of the display unit 13 (step S5). Subsequently, the central processing unit 10 extracts the necessary pin support holes 4 from the displayed pin support holes 4 excluding unnecessary ones, and creates pin data (step S6). Each pin support hole 4 corresponding to is displayed as a pin insertion position on the display unit 13 (step S7). Specifically, for example, one of the two adjacent pin support holes 4 among the displayed pin support holes 4 is sequentially deleted to create pin data, and the pin support hole 4 corresponding to the pin data is created. Only the color display or blinking display on the screen.
[0021]
After the central processing unit 10 graphically displays the pin support hole 4 corresponding to the pin data on the screen as described above, the pin data being displayed has been changed by the operation of the key input unit 20 by the operator. Is monitored (step S8). That is, the pin data is created based on a preset process such as sequentially deleting one of the two pin support holes 4 adjacent to each other among the pin support holes 4 into which the support pins can be inserted. Therefore, for example, in the vicinity of a large-sized electronic component, the number of support pins becomes too small, the support force is insufficient, and the strength may be inferior. Therefore, the created pin data is displayed on the screen of the display unit 13 and waits for the operator's judgment.
[0022]
The operator should insert the support pin by operating the key input unit 20 when he / she finds a place where the support of the printed circuit board 3 by the support pin is considered insufficient while looking at the pin data being graphically displayed on the display unit 13. The pin support hole 4 is newly designated. The central processing unit 10 changes the pin data so as to add the newly specified pin support hole 4 and displays the pin support hole 4 in a new graphic (step S9). Is operated (step S10).
[0023]
When the operator operates the confirmation key after finishing the change of the pin data, the central processing unit 10 calculates the pin insertion data by calculation by converting the created pin data into left-right symmetry (step S11). That is, the above-mentioned pin data is created on the assumption that the surface of the printed circuit board 3 that is actually supported by the support pins from below is directed upward, so that the pin insertion when the printed circuit board 3 is turned over is inserted. Need to convert to data.
[0024]
Therefore, the central processing unit 10 prints, for example, using either the interval Sx between the two reference pin insertion holes 21 and 21 of the printed circuit board 3 or the longitudinal size Px of the printed circuit board 3 as shown in FIG. The coordinates of the midpoint in the longitudinal direction of the substrate 3 (left and right direction in the figure) are calculated, and the coordinates of the pin support holes 4 of the above determined pin data are set to symmetrical positions with respect to the coordinates of the midpoint. The coordinates when changed are calculated by calculation to create pin insertion data as shown in FIG. As shown in FIG. 3 (e), the pin insertion data indicates the arrangement positions of support pins for supporting the surface of the printed circuit board 3 on which the electronic component 7 is mounted from below.
[0025]
The central processing unit 10 graphically displays each pin non-insertion position in the created pin insertion data on the screen of the display unit 13 (step S12). That is, at first, since no support pin is inserted into any of the pin support holes 4, all the pin support holes 4 in the created pin insertion data are displayed in color or blinking. Here, the operator can easily and accurately insert the support pin into the pin support hole 4 displayed on the screen of the support plate 1 while observing the pin insertion data displayed on the display unit 13 to stand. Although possible, the support pins can be arranged more easily and quickly in the direction of arrangement of the substrate support pins in this embodiment.
[0026]
That is, in this embodiment, as shown in FIG. 4, the visible light irradiation unit 18 of FIG. 1 provided with a light emitting diode or the like is attached to the mounting head unit 23 for mounting the electronic component 7 on the printed circuit board 3. It is attached in a cantilever manner so as to protrude by a predetermined offset distance Os through the collar 24, and visible light is emitted from the visible light irradiation unit 18 directly below. Then, the central processing unit 10 moves the table 22 for holding the support plate 1 and operating in the horizontal direction and the vertical direction in the horizontal direction via the table control unit 14, and uses the above-described pin insertion data. The support plate 1 is positioned so that the determined first pin support hole 4 is irradiated with visible light (step S13). The spot diameter by the visible light irradiation unit 18 is set to be larger than the diameter of the pin support hole 4, for example, 1.5 to 2 times the diameter of the pin support hole 4. The hole 4 can be visually recognized with certainty.
[0027]
The central processing unit 10 positions and supports the support plate 1 so that the first pin support hole 4 is irradiated with visible light, and then an operator inserts the support pin 2 into the pin support hole 4. It is determined whether or not a detection signal is input from the pin detection sensor 19 of FIG. 1 (step S14). As the pin detection sensor 19, for example, a photoelectric sensor that detects reflected light from the hole floor surface of visible light irradiated to the pin support hole 4 is used. Since the visible light is scattered by the support pins and cannot receive the reflected light, it is detected that the support pins are disposed.
[0028]
When the central processing unit 10 determines that the support pin is disposed in the pin support hole 4 indicated by the visible light by the input of the detection signal from the pin detection sensor 19, the pin non-insertion position data in the pin insertion data is determined. Is temporarily stored in the RAM 12 (step S15), and whether or not the changed pin non-insertion position data is “0”, that is, support to all the pin support holes 4 set in the pin insertion data. It is determined whether or not the pin insertion has been completed (step S16). If not finished, the central processing unit 10 returns to step S12 to continue the graphic display of the pin support hole 4 at the pin non-insertion position changed based on the changed pin non-insertion data, and activate the table 17 again. Then, the pin support hole 4 into which the support pin is to be inserted next on the printed circuit board 3 is positioned at the visible light irradiation position by the visible light irradiation unit 18. The above processing operation is repeated until it is determined that the insertion of the support pins into all the pin support holes 4 of the pin insertion data has been completed (step S16).
[0029]
In the above-described method for arranging the board support pins, when the electronic component 7 is mounted on the back surface of the printed circuit board 3 having the electronic component 7 mounted on the front surface, various types of data can be obtained simply by designating and inputting the type of the printed circuit board 3. Since the appropriate placement position of the support pins is automatically selected by the electrical signal processing based on the signal processing, the time required for the setup change due to the change of the printed board 3 to be produced can be greatly shortened. Moreover, even if minute chip parts are present in the mounted electronic parts, the human judgment by the visual inspection of the worker is eliminated, so that the support pin placement position excludes the electronic part mounting position. Therefore, it is possible to reliably prevent the breakage of minute chip parts due to the erroneous placement of the support pins.
[0030]
In addition, after automatically selecting an appropriate placement position of the support pins by electrical signal processing, the visible light irradiation unit 18 sequentially instructs the pin support holes where the support pins are to be placed next. The support pins can be arranged more quickly and accurately.
[0031]
In the above embodiment, the pin support holes in which the support pins are to be arranged are sequentially indicated based on the pin insertion data. Instead of this, chucking for gripping the support pins based on the pin insertion data. Control of the mechanism can also be easily realized, whereby the removal and installation of the support pins can also be automated. Furthermore, pin insertion data, which is pin support hole data of the support plate into which the support pin is inserted, can be created off-line outside the equipment. For example, the mounting position and support of electronic components in advance using CAD data. It is also possible to generate pin insertion data similar to the embodiment by simulating the pin arrangement range.
[0032]
【The invention's effect】
As described above, according to the board support pin arrangement method of the present invention, an appropriate arrangement position of the support pins can be automatically selected by electrical signal processing based on various data. The time required for the setup change due to the change can be greatly shortened. Moreover, since the support pin placement position is calculated by electrical signal processing based on various data without the human judgment by the operator's visual observation, a minute chip component due to incorrect placement of the support pin is calculated. Destruction can be reliably prevented.
[Brief description of the drawings]
FIG. 1 is a block configuration diagram of a system according to an embodiment of a substrate support pin arrangement method of the present invention.
FIG. 2 is a flowchart showing signal processing of the system.
FIGS. 3A to 3E are explanatory diagrams of processing for creating pin insertion data in the flowchart described above.
FIG. 4 is a side view showing a configuration in which a predetermined pin support hole in the system is supported by visible light.
5A is a plan view showing support of a printed circuit board by support pins, and FIG. 5B is a front view.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Support plate 2 Support pin 3 Printed circuit board 4 Pin support hole 7 Electronic component 18 Visible light irradiation part 19 Pin detection sensor A Pin arrangement impossible range

Claims (2)

When mounting electronic components on the upper surface of the printed circuit board, a plurality of support pins for supporting the printed circuit board by contacting each tip to the lower surface of the printed circuit board are provided on the support plate at a constant pitch. In the method of arranging the substrate support pins that select and fit the required ones for a large number of pin support holes,
Calculation based on mounting position data of each electronic component already mounted on the lower surface of the printed circuit board and part data representing the size of the electronic component, to calculate a non-placeable range of the support pins on the upper surface of the printed circuit board Process,
Of the pin support holes existing within the range excluding the non-placeable range , one of the pin support holes adjacent to each other is deleted to calculate pin insertion data indicating the position of the pin support hole into which the support pin is to be inserted And a process of
And a step of displaying the pin insertion data on a screen. When the pin support hole into which the support pin is to be inserted is instructed by irradiation with visible light based on the pin insertion data, it is determined whether or not the support pin is disposed in the pin support hole, and the arrangement is determined 2. The substrate support pin arranging method according to claim 1, wherein the next pin support hole in which the next support pin is not inserted is sequentially indicated by irradiation with visible light.

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