TWI541112B - Device and method for detecting robot blade - Google Patents

Device and method for detecting robot blade Download PDF

Info

Publication number
TWI541112B
TWI541112B TW104100765A TW104100765A TWI541112B TW I541112 B TWI541112 B TW I541112B TW 104100765 A TW104100765 A TW 104100765A TW 104100765 A TW104100765 A TW 104100765A TW I541112 B TWI541112 B TW I541112B
Authority
TW
Taiwan
Prior art keywords
robot arm
detecting device
carrier plate
detecting
distance
Prior art date
Application number
TW104100765A
Other languages
Chinese (zh)
Other versions
TW201625388A (en
Inventor
張光雲
李伯良
Original Assignee
力晶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 力晶科技股份有限公司 filed Critical 力晶科技股份有限公司
Priority to TW104100765A priority Critical patent/TWI541112B/en
Priority to CN201510039855.XA priority patent/CN105983978A/en
Application granted granted Critical
Publication of TWI541112B publication Critical patent/TWI541112B/en
Publication of TW201625388A publication Critical patent/TW201625388A/en

Links

Description

機械手臂的檢測裝置與檢測方法 Robot arm detection device and detection method

本發明是有關於一種檢測裝置與方法,且特別是有關於一種機械手臂(robot blade)的檢測裝置與檢測方法。 The present invention relates to a detecting device and method, and more particularly to a detecting device and a detecting method for a robot blade.

於半導體元件的生產製程中,為了將生產用的晶圓(wafer)移動至特定位置,常需利用機械手臂來抓取存放在晶圓匣(wafer cassette)中的矽晶圓。一般來說,在晶圓匣內的晶圓與晶圓間的距離可能僅約10mm,一般機械手臂的厚度則可達約5mm,因此,在將機械手臂輸送至晶圓匣中時,機械手臂的厚度已佔據了晶圓之間的大部分空間,僅剩下一點間隙可進行操作。在抓取晶圓的過程中,若未先確認機械手臂的位置、角度等,可能會發生因機械手臂的水平度或高度等的異常而撞擊到晶圓的情況,這會導致晶圓的正面或背面刮傷,進而造成晶圓的異常。 In the manufacturing process of a semiconductor device, in order to move a wafer for production to a specific position, it is often necessary to use a robot arm to grab a germanium wafer stored in a wafer cassette. In general, the distance between the wafer and the wafer in the wafer cassette may be only about 10 mm, and the thickness of the general robot arm is about 5 mm. Therefore, when the robot arm is transported into the wafer cassette, the robot arm The thickness already occupies most of the space between the wafers, leaving only a little gap for operation. In the process of grabbing the wafer, if the position and angle of the robot arm are not confirmed first, the wafer may be hit by the abnormality of the level or height of the robot arm, which may cause the front side of the wafer or Scratches on the back side, which in turn causes abnormalities in the wafer.

現行的確認機械手臂的位置之方法主要為以人工方式目測來判斷機械手臂的位置是否正常,然而,以目測方式判斷難以建立穩定的標準,且若沒有相關距離數據可供判斷,也難以得知 機械手臂的位置是否正確無誤,從而容易造成如上所述於生產時晶圓碰撞而損傷的情況。 The current method for confirming the position of the robot arm is mainly to manually judge the position of the robot arm by visual inspection. However, it is difficult to establish a stable standard by visual inspection, and it is difficult to know if there is no relevant distance data for judging. The position of the robot arm is correct, which is likely to cause damage to the wafer collision during production as described above.

有鑒於上述問題,需要設計新的檢測裝置與方式來取代先前以人工目測來判斷的方式,以有效地減少因機械手臂的位置不精確等造成晶圓損傷的問題。 In view of the above problems, it is necessary to design a new detecting device and method to replace the previous method of judging by manual visual inspection, so as to effectively reduce the problem of wafer damage caused by the positional inaccuracy of the robot arm.

本發明提供一種機械手臂的檢測裝置,可藉由實際模擬晶圓匣的配置形態來對機械手臂的水平度、高度等參數進行分析,以確認機械手臂的位置,避免因機械手臂的位置不正確造成晶圓損傷的問題。 The invention provides a detecting device for a robot arm, which can analyze the parameters such as the level and height of the robot arm by actually simulating the configuration of the wafer stack to confirm the position of the robot arm and avoid the position of the robot arm being incorrect. The problem of wafer damage.

本發明另提供一種機械手臂的檢測方法,其應用上述檢測裝置來檢測機械手臂的水平度、高度等參數進行分析,而能夠精準地確認機械手臂的位置,並可適時地對檢測裝置及機械手臂進行調整,避免因機械手臂的位置不正確造成晶圓損傷的問題。 The invention further provides a method for detecting a mechanical arm, which uses the above-mentioned detecting device to detect parameters such as the levelness and height of the robot arm, and can accurately confirm the position of the robot arm, and can timely detect the detecting device and the robot arm. Make adjustments to avoid wafer damage due to incorrect position of the robot arm.

本發明的機械手臂的檢測裝置包括:底座部;支架部,配置在上述底座部上;承載部,包括上承載板以及下承載板,且上述上承載板以及上述下承載板以彼此間隔一距離的方式配置在上述支架部上;以及至少一感測器,配置在上述承載部上,用以對待檢測的機械手臂進行距離資料的收集。 The detecting device of the mechanical arm of the present invention comprises: a base portion; a bracket portion disposed on the base portion; the carrying portion comprising an upper carrying plate and a lower carrying plate, wherein the upper carrying plate and the lower carrying plate are spaced apart from each other by a distance The method is disposed on the bracket portion; and at least one sensor is disposed on the carrying portion for collecting the distance data of the robot arm to be detected.

在本發明的一實施例中,上述底座部能藉由至少一固定構件而與上述待檢測的機械手臂的設備機台連接。 In an embodiment of the invention, the base portion can be coupled to the equipment table of the robot to be detected by at least one fixing member.

在本發明的一實施例中,上述支架部包括多個支撐柱,且上述支撐柱上具有一或多個支撐構件,用以放置上述承載部。 In an embodiment of the invention, the bracket portion includes a plurality of support columns, and the support column has one or more support members for placing the bearing portion.

在本發明的一實施例中,上述至少一感測器配置在上述上承載板的上表面及/或上述下承載板的下表面。 In an embodiment of the invention, the at least one sensor is disposed on an upper surface of the upper carrier plate and/or a lower surface of the lower carrier plate.

在本發明的一實施例中,上述檢測裝置具有多個感測器,且上述多個感測器是相對於上述承載部而以兩個為一組的方式對稱地配置,其中一個配置在上述上承載板的上表面,另一個配置在上述下承載板的下表面。 In an embodiment of the invention, the detecting device has a plurality of sensors, and the plurality of sensors are symmetrically arranged in a group of two with respect to the carrying portion, one of which is disposed in the above The upper surface of the upper carrier plate and the other are disposed on the lower surface of the lower carrier plate.

本發明的機械手臂的檢測方法包括:提供如上上述的機械手臂的檢測裝置;對上述檢測裝置進行驗證;將待檢測的機械手臂輸送至上述檢測裝置中;以上述檢測裝置中的一或多個感測器收集距離資料;以及對所收集的距離資料進行分析。 The detecting method of the robot arm of the present invention comprises: providing the detecting device of the robot arm as described above; verifying the detecting device; and conveying the robot arm to be detected to the detecting device; and one or more of the detecting devices The sensor collects the distance data; and analyzes the collected distance data.

在本發明的一實施例中,在對上述檢測裝置進行驗證之前,將上述檢測裝置與上述待檢測的機械手臂的設備機台連接。 In an embodiment of the invention, the detecting device is connected to the equipment table of the robot to be detected before the detecting device is verified.

在本發明的一實施例中,對上述檢測裝置進行驗證包括利用水平治具來確認上述上承載板與上述下承載板間的距離。 In an embodiment of the invention, verifying the detecting device includes using a horizontal jig to confirm a distance between the upper carrier plate and the lower carrier plate.

在本發明的一實施例中,上述距離資料包括上述機械手臂的上表面至上述上承載板的距離,以及上述機械手臂的下表面至上述下承載板的距離。 In an embodiment of the invention, the distance data includes a distance from an upper surface of the mechanical arm to the upper carrier plate, and a distance from a lower surface of the mechanical arm to the lower carrier plate.

在本發明的一實施例中,在對上述距離資料進行分析之後,依據所獲得的分析結果調整或更換上述機械手臂。 In an embodiment of the invention, after analyzing the distance data, the robot arm is adjusted or replaced according to the obtained analysis result.

基於上述,本發明所提供的機械手臂的檢測裝置及檢測 方法能夠藉由實際模擬晶圓匣的配置形態來對機械手臂的水平度、高度等參數進行分析,以確認機械手臂的位置,從而精準地確認機械手臂的位置,並可適時地對檢測裝置及機械手臂進行調整,避免因機械手臂的位置不正確造成晶圓損傷的問題。 Based on the above, the detection device and detection of the mechanical arm provided by the present invention The method can analyze the parameters such as the level and height of the robot arm by actually simulating the configuration of the wafer stack to confirm the position of the robot arm, thereby accurately confirming the position of the robot arm, and timely detecting the device and The robot arm is adjusted to avoid wafer damage caused by incorrect position of the robot arm.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

10‧‧‧檢測裝置 10‧‧‧Detection device

100‧‧‧底座部 100‧‧‧Base section

102‧‧‧支架部 102‧‧‧ bracket

102a‧‧‧支撐柱 102a‧‧‧Support column

102b‧‧‧支撐構件 102b‧‧‧Support members

104‧‧‧承載部 104‧‧‧Loading Department

104a‧‧‧上承載板 104a‧‧‧Upper carrier board

104b‧‧‧下承載板 104b‧‧‧lower carrier board

106、106a、106b、106c、106d‧‧‧感測器 106, 106a, 106b, 106c, 106d‧‧‧ sensors

200‧‧‧機械手臂 200‧‧‧ Robotic arm

202a、202b‧‧‧前端檔板 202a, 202b‧‧‧ front-end baffle

202c、202d‧‧‧後端檔板 202c, 202d‧‧‧ backend board

300‧‧‧設備機台 300‧‧‧ equipment machine

301‧‧‧腔室 301‧‧ ‧ chamber

302‧‧‧固定式作業平台 302‧‧‧Fixed work platform

303‧‧‧可移動式作業平台 303‧‧‧Mobile work platform

304‧‧‧固定構件 304‧‧‧Fixed components

306‧‧‧水平治具 306‧‧‧Level fixture

306a‧‧‧桿部 306a‧‧‧ Rod

306b‧‧‧量規 306b‧‧‧ gauge

400‧‧‧第一層支撐架 400‧‧‧First support frame

402‧‧‧第二層支撐架 402‧‧‧Second support frame

A、B、C、D‧‧‧位置 A, B, C, D‧‧‧ position

E‧‧‧範圍 E‧‧‧Scope

d、H‧‧‧距離 d, H‧‧‧ distance

T、T’‧‧‧厚度 T, T’‧‧‧ thickness

S01、S02、S02-1、S03、S04、S05、S05-1、S06‧‧‧步驟 S01, S02, S02-1, S03, S04, S05, S05-1, S06‧‧

圖1(A)是依照本發明一實施例的機械手臂的檢測裝置的結構示意圖。 Fig. 1(A) is a schematic structural view of a detecting device for a robot arm according to an embodiment of the present invention.

圖1(B)是依照本發明一實施例的機械手臂的檢測裝置中感測器所在位置的示意圖。 1(B) is a schematic view showing the position of a sensor in a detecting device of a robot arm according to an embodiment of the present invention.

圖2是依照本發明一實施例的機械手臂的檢測方法的流程示意圖。 2 is a flow chart showing a method of detecting a robot arm according to an embodiment of the invention.

圖3是依照本發明一實施例的機械手臂的檢測方法,在對檢測裝置進行驗證時的裝置剖面示意圖以及局部放大圖。 3 is a cross-sectional view of a device and a partial enlarged view of a device for detecting a detecting device according to an embodiment of the present invention.

圖4(A)是依照本發明一實施例的機械手臂的檢測方法,在將待檢測的機械手臂輸送至檢測裝置中進行檢測時的裝置剖面示意圖。 4(A) is a cross-sectional view showing the apparatus for detecting a robot arm according to an embodiment of the present invention, when the robot arm to be detected is transported to the detecting device for detection.

圖4(B)是依照本發明一實施例的機械手臂的檢測方法,在將待檢測的機械手臂輸送至檢測裝置中進行檢測時的裝置的上視 圖。 4(B) is a top view of the apparatus for detecting a robot arm according to an embodiment of the present invention, when the robot arm to be detected is transported to the detecting device for detection. Figure.

以下將參照所附圖式,對本發明的檢測裝置與檢測方法實施方式進行更詳細的說明。 Hereinafter, embodiments of the detecting device and the detecting method of the present invention will be described in more detail with reference to the accompanying drawings.

圖1(A)是依照本發明一實施例的機械手臂的檢測裝置的結構示意圖;圖1(B)是依照本發明一實施例的機械手臂的檢測裝置中感測器所在位置的示意圖。 1(A) is a schematic view showing the structure of a detecting device for a mechanical arm according to an embodiment of the present invention; and FIG. 1(B) is a schematic view showing the position of the sensor in the detecting device of the mechanical arm according to an embodiment of the present invention.

請先參照圖1(A),本發明的機械手臂的檢測裝置10包括底座部100、支架部102、承載部104以及至少一感測器106。 Referring first to FIG. 1(A), the detecting device 10 for a robot arm of the present invention includes a base portion 100, a bracket portion 102, a carrying portion 104, and at least one sensor 106.

底座部100例如是具有中空殼狀結構,其材質例如是鋁合金,但不限於此,亦可為其他結構或材質。底座部100例如是作為檢測裝置的載入埠(load port),而能藉由至少一固定構件(未繪示)而與待檢測的機械手臂的設備機台(未繪示)連接。此外,底座部100還可具有電源供應功能,但本發明並不限於此,亦可視實際空間配置的需求而在檢測裝置10的其他位置(例如檢測裝置10中支架部102的上部)另設置電源供應部。 The base portion 100 has, for example, a hollow shell-like structure, and the material thereof is, for example, an aluminum alloy. However, the base portion 100 is not limited thereto, and may be other structures or materials. The base portion 100 is, for example, a load port as a detecting device, and can be connected to a device machine (not shown) of the robot arm to be detected by at least one fixing member (not shown). In addition, the base portion 100 may also have a power supply function, but the present invention is not limited thereto, and another power source may be disposed at other positions of the detecting device 10 (for example, an upper portion of the bracket portion 102 in the detecting device 10) according to the requirements of the actual space configuration. Supply Department.

支架部102配置在底座部100上。在本實施例中,支架部102包括多個支撐柱102a,且支撐柱上102a具有多個支撐構件102b。如圖1(A)所示,在多個支撐構件102b之間可形成用以放置承載部104的空間,類似於晶圓匣中的插槽式結構。支撐柱102a例如是中空或實心的柱狀物,其材質例如是鋁合金,但不限 於此。支撐構件102b例如是呈片狀的長方體構件,其材質可使用與支撐柱102a相同的材質,例如是鋁合金,但並不限於此。 The bracket portion 102 is disposed on the base portion 100. In the present embodiment, the bracket portion 102 includes a plurality of support columns 102a, and the support post upper portion 102a has a plurality of support members 102b. As shown in FIG. 1(A), a space for placing the carrier portion 104 may be formed between the plurality of support members 102b, similar to the slot structure in the wafer cassette. The support post 102a is, for example, a hollow or solid pillar, and the material thereof is, for example, an aluminum alloy, but is not limited. herein. The support member 102b is, for example, a rectangular parallelepiped member, and the material thereof can be the same as that of the support post 102a, for example, an aluminum alloy, but is not limited thereto.

承載部104包括上承載板104a以及下承載板104b,且上承載板104a以及下承載板104b是以大致相互平行且彼此間隔一距離d的方式配置在支架部102上。距離d例如是8mm~12mm,但不限於此,使用者可依照實際需求決定。上承載板104a以及下承載板104b的材質例如是鋁合金,但並不限於此。 The carrying portion 104 includes an upper carrying plate 104a and a lower carrying plate 104b, and the upper carrying plate 104a and the lower carrying plate 104b are disposed on the bracket portion 102 in such a manner as to be substantially parallel to each other and spaced apart from each other by a distance d. The distance d is, for example, 8 mm to 12 mm, but is not limited thereto, and the user can decide according to actual needs. The material of the upper carrier plate 104a and the lower carrier plate 104b is, for example, an aluminum alloy, but is not limited thereto.

上承載板104a以及下承載板104b可作為虛擬晶圓(dummy wafer)使用。更具體來說,可藉由將上承載板104a以及下承載板104b間的距離d設為待檢測的機械手臂實際所應用的晶圓匣中晶圓間的距離,而在檢測裝置中實際模擬機械手臂運作時的空間關係,以利於確認機械手臂的位置是否正確無誤。 The upper carrier 104a and the lower carrier 104b can be used as a dummy wafer. More specifically, the actual simulation can be performed in the detecting device by setting the distance d between the upper carrier plate 104a and the lower carrier plate 104b as the distance between the wafers in the wafer cassette to be actually applied by the robot arm to be detected. The spatial relationship of the robot arm during operation to help confirm the correct position of the robot arm.

應注意的是,圖1(A)的實施例中僅繪示安裝兩個承載板(即,上承載板104a以及下承載板104b)的結構,但實際上並不限於此,本發明的檢測裝置中亦可具有三個以上的承載板。舉例來說,可藉由在支架部102的多個支撐柱102a上分別設置更多支撐構件102b,以形成更多插槽式結構,從而可承載三個以上的承載板。 It should be noted that the embodiment of FIG. 1(A) only shows the structure of installing two carrier boards (ie, the upper carrier board 104a and the lower carrier board 104b), but is not limited thereto, and the detection of the present invention There may also be more than three carrier plates in the device. For example, more support members 102b can be respectively disposed on the plurality of support columns 102a of the bracket portion 102 to form a more slot structure, so that more than three carrier plates can be carried.

感測器106配置在承載部104上,用以對待檢測的機械手臂進行距離資料的收集。具體來說,感測器106可配置在上承載板104a的上表面及/或下承載板104b的下表面。在本實施例中,多個感測器106是相對於承載部104而以兩個為一組的方式對稱 地配置,其中一個配置在上承載板104a的上表面,另一個配置在下承載板104b的下表面。詳細而言,如圖1(A)所示,承載部104上配置有成組的感測器106a、感測器106b、感測器106c以及感測器106b,總計有8個感測器,且各組感測器中的兩個感測器分別配置在承載部104的兩側(即,在上承載板104a的上表面與下承載板104b的下表面分別配置有一個感應器)上相互對稱的位置。 The sensor 106 is disposed on the carrying portion 104 for collecting distance data from the robot arm to be detected. In particular, the sensor 106 can be disposed on the upper surface of the upper carrier plate 104a and/or the lower surface of the lower carrier plate 104b. In the present embodiment, the plurality of sensors 106 are symmetric with respect to the carrier portion 104 in a group of two. The ground configuration, one of which is disposed on the upper surface of the upper carrier plate 104a and the other is disposed on the lower surface of the lower carrier plate 104b. In detail, as shown in FIG. 1(A), the carrier 104 is provided with a group of sensors 106a, a sensor 106b, a sensor 106c, and a sensor 106b, for a total of eight sensors. And two sensors in each group of sensors are respectively disposed on both sides of the carrying portion 104 (ie, one sensor is disposed on the upper surface of the upper carrier plate 104a and the lower surface of the lower carrier plate 104b, respectively). Symmetrical position.

具體來說,感測器106的配置可依照待檢測的機械手臂的形狀與尺寸來決定。請參照圖1(B)的上視圖,其中以虛線框起的範圍E表示承載部104的上承載板104a或下承載板104b的面積大小,當欲對機械手臂200進行檢測時,例如是將多個感測器106分別配置在承載板上與機械手臂200前端與後端兩側的檔板相對應的位置,即,圖1(B)中以虛線框起的位置A、位置B、位置C及位置D。藉由將感測器配置在對應於機械手臂的端部,更有利於機械手臂位置的確認。 In particular, the configuration of the sensor 106 can be determined in accordance with the shape and size of the robot arm to be detected. Referring to the top view of FIG. 1(B), a range E indicated by a broken line indicates the size of the upper carrier plate 104a or the lower carrier plate 104b of the carrier portion 104. When the robot arm 200 is to be detected, for example, The plurality of sensors 106 are respectively disposed at positions corresponding to the baffles on both sides of the front end and the rear end of the robot arm 200 on the carrier board, that is, the position A, the position B, and the position framed by the dotted line in FIG. 1(B) C and position D. Confirmation of the position of the robot arm is facilitated by arranging the sensor at the end corresponding to the robot arm.

感測器106例如是用於收集距離資料的感測器。作為感測器106的實例,可列舉:雷射測距器(laser distance meter)、電容感測測距器等,但並不以此為限。其中,就實用性與精確性的觀點來考慮,較佳為使用雷射測距器。此外,感測器106的個數並無特別限定,只要足以完成所需資料的收集,亦可僅使用一個。就能夠快速而準確地收集距離資料的觀點來看,較佳為使用4~8個感測器。 The sensor 106 is, for example, a sensor for collecting distance data. As an example of the sensor 106, a laser distance meter, a capacitance sensing range finder, etc. are mentioned, but not limited thereto. Among them, in view of practicality and accuracy, it is preferable to use a laser range finder. Further, the number of the sensors 106 is not particularly limited, and as long as it is sufficient to complete the collection of the required data, only one may be used. From the viewpoint of being able to collect distance data quickly and accurately, it is preferable to use 4 to 8 sensors.

此外,檢測裝置10整體的高度例如是25cm~35cm,寬度例如是20cm~30cm,長度例如是25cm~35cm;然而,本領域中具通常知識者應理解檢測裝置10整體及其構件的尺寸或形狀可依照實際需求來決定,並無特別限制,較佳為設定為能夠直接整合至待檢測的機械手臂的設備機台中的尺寸或形狀。 Further, the height of the entire detecting device 10 is, for example, 25 cm to 35 cm, the width is, for example, 20 cm to 30 cm, and the length is, for example, 25 cm to 35 cm; however, those skilled in the art should understand the size and shape of the entire detecting device 10 and its members. It can be determined according to actual needs, and is not particularly limited, and is preferably set to a size or shape that can be directly integrated into the equipment table of the robot arm to be detected.

圖2是依照本發明一實施例的機械手臂的檢測方法的流程示意圖。圖2所示的檢測方法例如是藉由圖1的實施例所述檢測裝置10來執行,但並不限於此。以下,將參照圖1(A)的實施例所繪示的檢測裝置10,並搭配圖2、圖3及圖4(A)、圖4(B)以更詳細說明本發明的機械手臂的檢測方法。 2 is a flow chart showing a method of detecting a robot arm according to an embodiment of the invention. The detection method shown in FIG. 2 is performed by, for example, the detecting device 10 of the embodiment of FIG. 1, but is not limited thereto. Hereinafter, the detecting device 10 illustrated in the embodiment of FIG. 1(A) will be described in more detail with reference to FIGS. 2, 3, and 4(A) and 4(B) to describe the detection of the robot arm of the present invention in more detail. method.

首先,提供機械手臂的檢測裝置10(步驟S01),由於檢測裝置10的結構與材質等已於先前段落中進行了詳盡的說明,故於此不再贅述。 First, the detecting device 10 for the robot arm is provided (step S01). Since the structure and material of the detecting device 10 have been described in detail in the previous paragraph, they will not be described again.

之後,為了便於進行機械手臂的檢測,可將檢測裝置10與待檢測的機械手臂的設備機台連接。具體來說,如圖3所示,在待檢測的機械手臂的設備機台300具有固定式作業平台302以及可移動式作業平台303的情況下,可藉由多個固定構件304而將檢測裝置10中的底座部100固定至可移動式作業平台303,藉此,檢測裝置10即可整合至待檢測的機械手臂200的設備機台。 Thereafter, in order to facilitate the detection of the robot arm, the detecting device 10 can be connected to the equipment table of the robot arm to be detected. Specifically, as shown in FIG. 3, in the case where the equipment machine 300 of the robot arm to be detected has the fixed working platform 302 and the movable working platform 303, the detecting device can be used by the plurality of fixing members 304. The base portion 100 of the 10 is fixed to the movable work platform 303, whereby the detecting device 10 can be integrated into the equipment machine of the robot arm 200 to be detected.

固定構件304例如是配置於可移動式作業平台303上的導腳或固定器,但並不限於此。例如,在可移動式作業平台303上還可具有一或多個壓力感應器作為固定構件,藉此,當將檢測 裝置10安裝至可移動式作業平台303時,可藉由壓力感應器是否感測到檢測裝置10的重量造成的壓力來確認檢測裝置10與可移動式作業平台303間的連接是否已完成。 The fixing member 304 is, for example, a guide pin or a holder disposed on the movable work platform 303, but is not limited thereto. For example, one or more pressure sensors may also be provided on the movable work platform 303 as a fixing member, whereby when the detection is to be performed When the device 10 is mounted to the movable work platform 303, whether the connection between the detecting device 10 and the movable work platform 303 is completed can be confirmed by whether the pressure sensor senses the pressure caused by the weight of the detecting device 10.

接下來,對檢測裝置10進行驗證(步驟S02)。具體來說,進行驗證的主要目的在於確認檢測裝置10中構件間的空間關係是否與實際上待檢測的機械手臂欲應用的對象相同(例如,上承載板104a與下承載板104b間的距離d是否與實際上待檢測的機械手臂欲應用的晶圓匣中晶圓之間的距離相等)。 Next, the detection device 10 is verified (step S02). Specifically, the main purpose of the verification is to confirm whether the spatial relationship between the components in the detecting device 10 is the same as the object to be applied by the mechanical arm to be detected (for example, the distance d between the upper carrier plate 104a and the lower carrier plate 104b) Whether it is equal to the distance between the wafers in the wafer cassette to be applied by the robot to be tested.

圖3是依照本發明一實施例的機械手臂的檢測方法,在對檢測裝置進行驗證時的裝置剖面示意圖以及局部放大圖。 3 is a cross-sectional view of a device and a partial enlarged view of a device for detecting a detecting device according to an embodiment of the present invention.

如圖3所示,可利用包括桿部306a以及量規(gauge)306b的水平治具306來進行檢測裝置10的驗證。例如,先將水平治具306架設在下承載板104b上,並利用量規306b測量出水平治具306到固定式作業平台302的表面的距離H。將距離H減去桿部306a的厚度T,即可得到下承載板104b的上表面至固定式作業平台302的表面的距離。亦即,可獲得置放在由支撐構件102b所形成的第一層支撐架400上的下承載板104b的上表面的高度。此外,利用位於水平治具306的桿部306a兩側的量規306b來進行上述距離量測的順序並無特別限定,亦即,可同時或先後分別利用兩側的量規306b來對檢測裝置10進行驗證。 As shown in FIG. 3, verification of the detecting device 10 can be performed using a horizontal jig 306 including a stem portion 306a and a gauge 306b. For example, the horizontal jig 306 is first placed on the lower carrier plate 104b, and the distance H of the horizontal jig 306 to the surface of the stationary work platform 302 is measured by the gauge 306b. The distance T of the stem portion 306a is subtracted from the distance H to obtain the distance from the upper surface of the lower carrier plate 104b to the surface of the stationary work platform 302. That is, the height of the upper surface of the lower carrier plate 104b placed on the first layer support frame 400 formed by the support member 102b can be obtained. In addition, the order of the distance measurement by using the gauge 306b located on both sides of the rod portion 306a of the horizontal jig 306 is not particularly limited, that is, the detecting device can be used by using the gauges 306b on both sides simultaneously or sequentially. 10 to verify.

可以相同的方式對實際上待檢測的機械手臂欲應用的晶圓匣中的第一層支撐架上的晶圓表面之高度進行測量,並將所得 的結果與下承載板104b的上表面的高度進行比對,確認所得的結果是否與下承載板104b的上表面的高度相等。 The height of the wafer surface on the first layer of the wafer carrier to be applied to the robot arm to be detected can be measured in the same manner, and the result will be obtained. The result is compared with the height of the upper surface of the lower carrier plate 104b, and it is confirmed whether the obtained result is equal to the height of the upper surface of the lower carrier plate 104b.

接下來,可再以相同的方式確認在檢測裝置10的第二層支撐架402上的上承載板104a的上表面的高度(即,上承載板104a的上表面至固定式作業平台302的表面的距離),並與實際上待檢測的機械手臂欲應用的晶圓匣中的第二層支撐架上的晶圓表面之高度進行比對,確認兩者是否相等。 Next, the height of the upper surface of the upper carrier plate 104a on the second layer support frame 402 of the detecting device 10 can be confirmed in the same manner (i.e., the upper surface of the upper carrier plate 104a to the surface of the stationary work platform 302). The distance is compared with the height of the wafer surface on the second support frame in the wafer cassette to be applied by the robot arm to be detected, to confirm whether the two are equal.

藉由上述以水平治具進行驗證的方式,可確認上承載板104a與下承載板104b間的距離d是否與實際上待檢測的機械手臂欲應用的晶圓匣中晶圓之間的距離相等,亦可確認支撐構件102b的厚度T’是否等同於欲應用的晶圓匣中對應結構之厚度。 By verifying the horizontal fixture, it can be confirmed whether the distance d between the upper carrier 104a and the lower carrier 104b is equal to the distance between the wafers of the wafers to be applied by the robot to be detected. It is also confirmed whether the thickness T' of the support member 102b is equivalent to the thickness of the corresponding structure in the wafer cassette to be applied.

當比對的結果發現下承載板104b的上表面的高度、上承載板104a的上表面的高度、距離d或厚度T’有不相等的情況(例如是誤差大於0.15mm~0.25mm)時,則需進一步調整檢測裝置10(步驟S02-1),例如:調整上承載板104a及下承載板104b的厚度等,以在檢測裝置10中實際模擬機械手臂運作時的空間關係,而更有利於後續檢測。 When the result of the comparison finds that the height of the upper surface of the lower carrier plate 104b, the height of the upper surface of the upper carrier plate 104a, the distance d or the thickness T' are not equal (for example, the error is greater than 0.15 mm to 0.25 mm), Therefore, the detecting device 10 needs to be further adjusted (step S02-1), for example, adjusting the thickness of the upper carrier plate 104a and the lower carrier plate 104b, etc., to actually simulate the spatial relationship when the robot arm operates in the detecting device 10, and is more advantageous. Subsequent testing.

接下來,在經過驗證步驟之後,將待檢測的機械手臂200輸送至檢測裝置10中(步驟S03)。具體來說,可藉由開啟設備機台內機械手臂200所在的腔室(chamber)301的閘門,進而將待檢測的機械手臂輸送至檢測裝置10中上承載板104a及下承載板104b間所形成的空間內。 Next, after the verification step, the robot arm 200 to be detected is transported to the detecting device 10 (step S03). Specifically, the mechanical arm to be detected can be transported to the upper carrier board 104a and the lower carrier board 104b of the detecting device 10 by opening the gate of the chamber 301 where the robot arm 200 is located in the equipment machine. Within the space formed.

之後,以檢測裝置10中的一或多個感測器106收集距離資料(步驟S04)。上述距離資料例如是機械手臂200的上表面至上承載板104a的距離,以及機械手臂200的下表面至下承載板104b的距離等數據。 Thereafter, the distance data is collected by one or more sensors 106 in the detecting device 10 (step S04). The above distance information is, for example, data of the distance from the upper surface of the robot arm 200 to the upper carrier plate 104a, and the distance from the lower surface of the robot arm 200 to the lower carrier plate 104b.

圖4(A)是依照本發明一實施例的機械手臂的檢測方法,在將待檢測的機械手臂輸送至檢測裝置中進行檢測時的裝置剖面示意圖;圖4(B)是依照本發明一實施例的機械手臂的檢測方法,在將待檢測的機械手臂輸送至檢測裝置中進行檢測時的裝置的上視圖。 4(A) is a cross-sectional view showing a method of detecting a mechanical arm according to an embodiment of the present invention, when a mechanical arm to be detected is transported to a detecting device for detecting; FIG. 4(B) is an embodiment of the present invention. The method of detecting the robot arm is a top view of the device when the robot arm to be detected is transported to the detecting device for detection.

具體來說,請參照圖4(A)以及圖4(B),例如是利用上承載板104a上的感測器106c及感測器106d對機械手臂200的前端部份進行檢測,而分別取得機械手臂200的前端檔板202b及前端檔板202a的表面至上承載板104a的距離數據,並利用下承載板104b上的感測器106c及感測器106d對機械手臂200的前端下表面的部份進行檢測,而分別取得機械手臂200下表面的與前端檔板202b及前端檔板202a對應的位置至下承載板104b的距離數據。 Specifically, referring to FIG. 4(A) and FIG. 4(B), for example, the front end portion of the robot arm 200 is detected by the sensor 106c and the sensor 106d on the upper carrier plate 104a, and respectively obtained. The distance data of the front end baffle 202b of the robot arm 200 and the surface of the front end baffle 202a to the upper carrying plate 104a, and the portion of the lower surface of the front end of the robot arm 200 by the sensor 106c and the sensor 106d on the lower carrying plate 104b. The detection is performed, and the distance data from the position corresponding to the front end plate 202b and the front end plate 202a of the lower surface of the robot arm 200 to the lower carrier plate 104b is obtained.

同理,可利用上承載板104a上的感測器106a及感測器106b對機械手臂200的後端部份進行檢測,而分別取得機械手臂200的後端檔板202d及後端檔板202c的表面至上承載板104a的距離數據,並利用下承載板104b上的感測器106a及感測器106b對機械手臂200後端下表面的部份進行檢測,而分別取得機械手 臂200下表面的與後端檔板202d及後端檔板202c對應的位置至下承載板104b的距離數據。 Similarly, the rear end portion of the robot arm 200 can be detected by the sensor 106a and the sensor 106b on the upper carrier plate 104a, and the rear end plate 202d and the rear end plate 202c of the robot arm 200 are respectively obtained. The surface is up to the distance data of the upper carrying plate 104a, and the portion of the lower surface of the rear end of the robot arm 200 is detected by the sensor 106a and the sensor 106b on the lower carrying plate 104b, and the robots are respectively obtained. Distance data from the position of the lower surface of the arm 200 corresponding to the rear end plate 202d and the rear end plate 202c to the lower carrier plate 104b.

最後,對所收集的距離資料進行分析(步驟S05)。具體來說,例如是利用人工或電腦軟體的運算來整合並分析上述由各個感測器所獲得的距離數據,從而確認機械手臂200的前後左右之端部高度及水平度是否正常。 Finally, the collected distance data is analyzed (step S05). Specifically, for example, the distance data obtained by the respective sensors is integrated and analyzed by the calculation of the manual or computer software, thereby confirming whether the heights and levels of the front, rear, left and right ends of the robot arm 200 are normal.

在對上述距離資料進行分析之後,若發現有數據異常的情況,則可依據所獲得的分析結果調整或更換機械手臂(步驟S05-1)。上述數據異常的情況例如是各感測器所取得的距離數據超過可容許的上限高度(例如,超過上承載板104a及下承載板104b間距離的50%)或者低於可容許的下限高度。在調整或更換機械手臂之後,再重複上述步驟S03至步驟S05,確認機械手臂的位置是否已正常。 After analyzing the above distance data, if a data abnormality is found, the robot arm can be adjusted or replaced according to the obtained analysis result (step S05-1). The case where the above data is abnormal is, for example, that the distance data acquired by each sensor exceeds an allowable upper limit height (for example, more than 50% of the distance between the upper carrier plate 104a and the lower carrier plate 104b) or lower than the allowable lower limit height. After adjusting or replacing the robot arm, repeat the above steps S03 to S05 to confirm whether the position of the robot arm is normal.

進而,在確認到機械手臂200的位置已正常而完成檢測(步驟S06)之後,例如是透過機械手臂200的設備機台300之控制系統發出訊號,以將機械手臂200收回至腔室301內,並且將檢測裝置10自可移動式作業平台303上卸下,而結束檢測。 Further, after confirming that the position of the robot arm 200 is normal and the detection is completed (step S06), for example, a signal is transmitted through the control system of the equipment machine 300 of the robot arm 200 to retract the robot arm 200 into the chamber 301. And the detecting device 10 is detached from the movable working platform 303, and the detection is ended.

綜上所述,本發明所提供的機械手臂的檢測裝置及檢測方法能夠藉由實際模擬晶圓匣的配置形態來對機械手臂的水平度、高度等參數進行分析,以確認機械手臂的位置,從而精準而快速地確認機械手臂的位置與狀態,並可適時地對檢測裝置及機械手臂進行調整,避免因機械手臂的位置不正確造成晶圓損傷的 問題。此外,本發明的機械手臂的檢測裝置可藉由構件的設計而容易整合至現有的設備機台,而有利於應用在現行的半導體製程等中。 In summary, the detecting device and the detecting method of the robot arm provided by the present invention can analyze the parameters such as the level and height of the robot arm by actually simulating the configuration of the wafer stack to confirm the position of the robot arm. Therefore, the position and state of the robot arm can be accurately and quickly confirmed, and the detecting device and the robot arm can be adjusted in time to avoid wafer damage caused by incorrect position of the robot arm. problem. In addition, the detecting device of the robot arm of the present invention can be easily integrated into an existing equipment machine by the design of the member, and is advantageously used in current semiconductor processes and the like.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧檢測裝置 10‧‧‧Detection device

100‧‧‧底座部 100‧‧‧Base section

102‧‧‧支架部 102‧‧‧ bracket

102a‧‧‧支撐柱 102a‧‧‧Support column

102b‧‧‧支撐構件 102b‧‧‧Support members

104‧‧‧承載部 104‧‧‧Loading Department

104a‧‧‧上承載板 104a‧‧‧Upper carrier board

104b‧‧‧下承載板 104b‧‧‧lower carrier board

106、106a、106b、106c、106d‧‧‧感測器 106, 106a, 106b, 106c, 106d‧‧‧ sensors

d‧‧‧距離 D‧‧‧distance

Claims (10)

一種機械手臂的檢測裝置,包括:底座部;支架部,配置在所述底座部上;承載部,包括上承載板以及下承載板,且所述上承載板以及所述下承載板以彼此間隔一距離的方式配置在所述支架部上;以及至少一感測器,配置在所述承載部上,用以對待檢測的機械手臂進行距離資料的收集。 A detecting device for a mechanical arm, comprising: a base portion; a bracket portion disposed on the base portion; the carrying portion comprising an upper carrying plate and a lower carrying plate, and the upper carrying plate and the lower carrying plate are spaced apart from each other A distance is disposed on the bracket portion; and at least one sensor is disposed on the bearing portion for collecting distance data of the robot arm to be detected. 如申請專利範圍第1項所述的機械手臂的檢測裝置,其中所述底座部能藉由至少一固定構件而與所述待檢測的機械手臂的設備機台連接。 The detecting device of the robot arm according to claim 1, wherein the base portion can be connected to the equipment table of the robot arm to be detected by at least one fixing member. 如申請專利範圍第1項所述的機械手臂的檢測裝置,其中所述支架部包括多個支撐柱,且所述支撐柱上具有一或多個支撐構件,用以放置所述承載部。 The detecting device for a robot arm according to claim 1, wherein the bracket portion includes a plurality of support columns, and the support column has one or more supporting members for placing the bearing portion. 如申請專利範圍第1項所述的機械手臂的檢測裝置,其中所述至少一感測器配置在所述上承載板的上表面及/或所述下承載板的下表面。 The detecting device for a robot arm according to claim 1, wherein the at least one sensor is disposed on an upper surface of the upper carrier plate and/or a lower surface of the lower carrier plate. 如申請專利範圍第1項所述的機械手臂的檢測裝置,其具有多個感測器,且所述多個感測器是相對於所述承載部而以兩個為一組的方式對稱地配置,其中一個配置在所述上承載板的上表面,另一個配置在所述下承載板的下表面。 The detecting device of the robot arm according to claim 1, which has a plurality of sensors, and the plurality of sensors are symmetrically arranged in a group of two with respect to the carrying portion One of the configurations is disposed on an upper surface of the upper carrier plate and the other is disposed on a lower surface of the lower carrier plate. 一種機械手臂的檢測方法,包括:提供如申請專利範圍第1項至第5項中任一項所述的機械手臂的檢測裝置;對所述檢測裝置進行驗證;將待檢測的機械手臂輸送至所述檢測裝置中;以所述檢測裝置中的一或多個感測器收集距離資料;以及對所收集的距離資料進行分析。 A method for detecting a robot arm, comprising: providing a detecting device for a robot arm according to any one of claims 1 to 5; verifying the detecting device; and conveying the robot arm to be detected to In the detecting device; collecting distance data by one or more sensors in the detecting device; and analyzing the collected distance data. 如申請專利範圍第6項所述的機械手臂的檢測方法,其中,在對所述檢測裝置進行驗證之前,將所述檢測裝置與所述待檢測的機械手臂的設備機台連接。 The method of detecting a robot arm according to claim 6, wherein the detecting device is connected to the equipment machine of the robot arm to be detected before the detecting device is verified. 如申請專利範圍第6項所述的機械手臂的檢測方法,其中對所述檢測裝置進行驗證包括利用水平治具來確認所述上承載板與所述下承載板間的距離。 The method for detecting a robot arm according to claim 6, wherein the verifying the detecting device comprises using a horizontal jig to confirm a distance between the upper carrier plate and the lower carrier plate. 如申請專利範圍第6項所述的機械手臂的檢測方法,其中所述距離資料包括所述機械手臂的上表面至所述上承載板的距離,以及所述機械手臂的下表面至所述下承載板的距離。 The method for detecting a robot arm according to claim 6, wherein the distance data includes a distance from an upper surface of the robot arm to the upper carrier plate, and a lower surface of the mechanical arm to the lower The distance of the carrier board. 如申請專利範圍第6項所述的機械手臂的檢測方法,其中在對所述距離資料進行分析之後,依據所獲得的分析結果調整或更換所述機械手臂。 The method for detecting a robot arm according to claim 6, wherein after the distance data is analyzed, the robot arm is adjusted or replaced according to the obtained analysis result.
TW104100765A 2015-01-09 2015-01-09 Device and method for detecting robot blade TWI541112B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104100765A TWI541112B (en) 2015-01-09 2015-01-09 Device and method for detecting robot blade
CN201510039855.XA CN105983978A (en) 2015-01-09 2015-01-27 Detection device and detection method for mechanical arm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104100765A TWI541112B (en) 2015-01-09 2015-01-09 Device and method for detecting robot blade

Publications (2)

Publication Number Publication Date
TWI541112B true TWI541112B (en) 2016-07-11
TW201625388A TW201625388A (en) 2016-07-16

Family

ID=56984996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104100765A TWI541112B (en) 2015-01-09 2015-01-09 Device and method for detecting robot blade

Country Status (2)

Country Link
CN (1) CN105983978A (en)
TW (1) TWI541112B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11158040B2 (en) 2018-06-29 2021-10-26 Taiwan Semiconductor Manufacturing Co., Ltd. Method for identifying robot arm responsible for wafer scratch
CN112908926B (en) * 2021-01-20 2022-03-08 无锡邑文电子科技有限公司 Calibration jig of manipulator for semiconductor processing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250455A (en) * 1988-08-12 1990-02-20 Nec Kyushu Ltd Semiconductor wafer carrier
JP2005136280A (en) * 2003-10-31 2005-05-26 Mitsubishi Heavy Ind Ltd Carrying device
CN101092034A (en) * 2006-06-20 2007-12-26 力晶半导体股份有限公司 Adjusting device for facility of handling wafers, and adjusting method for facility of handling wafers
CN101190525A (en) * 2006-11-22 2008-06-04 富士迈半导体精密工业(上海)有限公司 Automatic correction mechanical arm
JP5447431B2 (en) * 2011-05-09 2014-03-19 株式会社安川電機 Robot system
CN102956436B (en) * 2011-08-23 2015-05-27 和舰科技(苏州)有限公司 Monitoring device and monitoring method for relative position of manipulator and chip to be handled in station adjusting
CN103646904B (en) * 2013-11-08 2017-05-17 上海华力微电子有限公司 Mechanical arm
CN104807401B (en) * 2015-03-04 2017-06-23 京东方科技集团股份有限公司 Substrate cartridge detection means

Also Published As

Publication number Publication date
TW201625388A (en) 2016-07-16
CN105983978A (en) 2016-10-05

Similar Documents

Publication Publication Date Title
CN102607502B (en) Automatic detection device and method for size of automobile rear axle assembly
TWI512875B (en) System and method for adjusting the position and orientation of a feed arm associated with a wafer handling robot
TWI548878B (en) Probe device
KR102287763B1 (en) Manufacturing system of battery cell
JP2018503256A5 (en)
JP2011517094A5 (en)
EP3431920A1 (en) Device, system, and method for inspecting crankshaft shape
KR102122325B1 (en) IC Handler
CN104626142A (en) Method for automatically locating and moving binocular vision mechanical arm for weight testing
TWI541112B (en) Device and method for detecting robot blade
CN205619882U (en) Header board crossbeam automatic checkout device
JP6789221B2 (en) IC test system
CN207789007U (en) A kind of testing agency of robot work position offset
TW201443458A (en) Alignment support device and alignment support method for probe devices
CN104089552B (en) Inclined groove slope detector for shade-pole motor rotor
KR101977305B1 (en) Themal testing apparatus for flatpanel display
CN107718049A (en) A kind of testing agency of robot work position skew and detection method
CN206348064U (en) A kind of amplitude detection mechanism
CN108548508A (en) A kind of non-accurate detection method of breakage of thickness of concrete floor
CN210268508U (en) Advanced generation TFT glass A type frame detection device
KR101947178B1 (en) Performance test apparatus and method for hand of substrate transfer robot
JPH05126981A (en) Inspecting device for cell size of support grid for nuclear fuel assembly
CN205655789U (en) Flatness testing apparatus
TWI467139B (en) Device for testing luminance
CN205619902U (en) Cell -phone flatness detecting device