CN101092034A - Adjusting device for facility of handling wafers, and adjusting method for facility of handling wafers - Google Patents
Adjusting device for facility of handling wafers, and adjusting method for facility of handling wafers Download PDFInfo
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- CN101092034A CN101092034A CN 200610093847 CN200610093847A CN101092034A CN 101092034 A CN101092034 A CN 101092034A CN 200610093847 CN200610093847 CN 200610093847 CN 200610093847 A CN200610093847 A CN 200610093847A CN 101092034 A CN101092034 A CN 101092034A
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- extraction module
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 235000012431 wafers Nutrition 0.000 title claims description 112
- 238000000605 extraction Methods 0.000 claims description 46
- 238000012545 processing Methods 0.000 claims description 25
- 230000002159 abnormal effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 abstract 5
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- 230000001771 impaired effect Effects 0.000 description 3
- 230000001915 proofreading effect Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 2
- 208000010086 Hypertelorism Diseases 0.000 description 1
- 206010020771 Hypertelorism of orbit Diseases 0.000 description 1
- 206010057855 Hypotelorism of orbit Diseases 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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Abstract
The invention relates to an adjusting device for chip moving device that includes reflecting component, imaging module, image process module and screen. The reflecting component is set beside chip bearing device. Imaging module is located on the light path of reflecting light from reflecting component. The reflecting component is used to reflect the image from bearing device to imaging module, and imaging module is used to pick the image in chip bearing device. The image process module is coupling to imaging module. When the moving device inserts into bearing device, the image process module would analyze the image to judge whether the location of moving device is normal. Thus, the location of moving device would be accurately and real-time adjusted.
Description
Technical field
The present invention relates to the means for correcting of a kind of wafer (wafer) haulage equipment, and particularly relate to a kind of the utilize means for correcting of the carrying wafers equipment that computer proofreaies and correct and the bearing calibration of carrying wafers equipment.
Background technology
In the factory building of making semiconductor wafer, can use accurate mechanical arm to carry wafer usually.Before using mechanical arm carrying wafer, need proofread and correct the position of mechanical arm earlier, to avoid improper, and wafer is damaged because of the position of mechanical arm.In having developed at present the mechanical arm miscellaneous that, mostly be the position of proofreading and correct mechanical arm with visual method.The factor of the angle difference that such correcting mode usually can be observed owing to the operator and judgement of different operating person subjectivity or the like makes the malposition of mechanical arm.So, will cause mechanical arm scratch wafer or cause wafer breakage when picking and placeing wafer.
Fig. 1 stretches into the schematic diagram of front-open wafer box simultaneously for many mechanical arms in the prior art.Please refer to Fig. 1, the mechanical arm 111～115 of mechanical arm machine 110 is used for carrying and is placed in front-open wafer box (Front Opening Unified Pod, FOUP) wafer 121～125 in 130 the storage tank (slot) 131～135, and front-open wafer box 130 places on the carrying port 140.Wherein, because mechanical arm machine 110 has many mechanical arms 111～115, the operator need judge in regular turn whether the position of each mechanical arm 111～115 is normal carrying out mechanical arm 111～115 timings, and therefore the work of proofreading and correct is comparatively time-consuming.In addition, in many mechanical arms 111～115, even wherein during the offsets in height of a mechanical arm (as mechanical arm 113), the operator also difficulty discover.So, when mechanical arm 113 stretches into front-open wafer box 130, will collide the wafer that is positioned on the storage tank 132, and cause wafer 122 impaired.
Therefore, proofread and correct the practice of mechanical arm position in the prior art with visual means, often can't accurately and efficiently adjust, especially to the correction of multilayer mechanical arm to the position of mechanical arm.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of means for correcting of carrying wafers equipment, it can accurately be proofreaied and correct carrying wafers equipment, to avoid damaging wafer when picking and placeing wafer.
Another object of the present invention provides a kind of bearing calibration of carrying wafers equipment, accurately carrying wafers equipment being proofreaied and correct, and then successfully picks and places wafer.
For reaching above-mentioned or other purpose, the present invention proposes a kind of means for correcting of carrying wafers equipment, be suitable for carrying wafers equipment is proofreaied and correct, wherein carrying wafers equipment comprises Handling device, and this Handling device is suitable for a plurality of wafers are moved away from or inserted in a plurality of storage tanks of chip bearing apparatus.The means for correcting of this carrying wafers equipment comprises reflecting element, image extraction module, image processing module and screen.Wherein, reflecting element is disposed at by the chip bearing apparatus, image extraction module is disposed on the optical path of reflecting element reflection ray, and reflecting element is suitable for the image in the chip bearing apparatus is reflexed to image extraction module, and image extraction module is suitable for capturing the image in the chip bearing apparatus.Image processing module is coupled to image extraction module, and in Handling device stretches into chip bearing apparatus the time, whether image processing module is suitable for analyzing the image that image extraction module captures, normal with the position of judging Handling device.Screen is coupled to image extraction module, with the image that shows that image extraction module was captured.
In one embodiment of this invention, the Handling device in the above-mentioned carrying wafers equipment comprises at least one mechanical arm, and image processing module is suitable for judging whether the position when each mechanical arm stretches in the chip bearing apparatus is normal.
In one embodiment of this invention, the image extraction module in the means for correcting of above-mentioned carrying wafers equipment comprises charge coupled cell (CCD) or complement metal oxide semiconductor image sensing element (CMOSimage sensor).
The present invention proposes a kind of bearing calibration of carrying wafers equipment, is suitable for by the means for correcting of above-mentioned carrying wafers equipment carrying wafers equipment being proofreaied and correct.Wherein, carrying wafers equipment comprises Handling device, and it is suitable for a plurality of wafers are moved away from or inserted in a plurality of storage tanks of chip bearing apparatus.The bearing calibration of this carrying wafers equipment comprises the following steps: at first, and the Handling device of carrying wafers equipment is stretched in the chip bearing apparatus.Then, image in the image extraction module acquisition chip bearing apparatus of the means for correcting by carrying wafers equipment, and the image processing module of the means for correcting by the carrying wafers equipment analysis image that image extraction module captured, whether normal with the position of judging Handling device.Afterwards, adjust the position of Handling device according to the result who judges.
In one embodiment of this invention, Handling device comprises at least one mechanical arm in the bearing calibration of above-mentioned carrying wafers equipment, and when a plurality of mechanical arms stretch into carrying wafers equipment, be one of them below of a plurality of storage tanks of stretching into earlier carrying wafers equipment respectively, and judge whether normal method comprises whether the distance of judging each mechanical arm and the storage tank above it is normal for the position of Handling device.
In one embodiment of this invention, in the bearing calibration of above-mentioned carrying wafers equipment, the step of method of adjusting the position of Handling device according to the result who judges comprise with and the storage tank of its top between the abnormal mechanical arm of distance be adjusted to suitable position.
The present invention is the image when stretching in the chip bearing apparatus by image extraction module acquisition haulage equipment, and proofreaies and correct haulage equipment by image processing module according to the image that is captured.So, can accurately proofread and correct, in the process of carrying wafer, damage wafer to avoid haulage equipment to haulage equipment.
For above and other objects of the present invention, feature and advantage can be become apparent, following conjunction with figs. and preferred embodiment are to illustrate in greater detail the present invention.
Description of drawings
Fig. 1 stretches into the schematic diagram of front-open wafer box simultaneously for many mechanical arms in the prior art.
Fig. 2 illustrates and is the carrying wafers equipment of one embodiment of the invention and the schematic diagram of means for correcting thereof.
Fig. 3 is the schematic diagram of the image that image extraction module captured of Fig. 2.
Fig. 4 illustrates the flow chart of steps into the bearing calibration of the carrying wafers equipment of one embodiment of the invention.
The simple symbol explanation
110: the mechanical arm machine
111～115,211～215: mechanical arm
121～125,221～225: wafer
130: front-open wafer box
140,240: the carrying port
200: carrying wafers equipment
210: Handling device
230: chip bearing apparatus
231～235: storage tank
236: the bottom surface
237: the side
250: reflecting element
260: image extraction module
270: image processing module
280: screen
290: the means for correcting of carrying wafers equipment
311～315: the image of mechanical arm
331～335: the image of storage tank
D: distance
N, N1～N5: the quantity of pixel
S410: the Handling device of carrying wafers equipment is stretched in the chip bearing apparatus
S420: the image in the image extraction module acquisition chip bearing apparatus of the means for correcting by carrying wafers equipment
S430: whether the image processing module of the means for correcting by the carrying wafers equipment analysis image that image extraction module captured is normal with the position of judging Handling device
S440: the position of adjusting Handling device according to the result who judges
The specific embodiment
In semiconductor technology, usually can use Handling device wafer remove to or move away from chip bearing apparatus or various machine, to carry out different technology.Because in the prior art, whether the correction of mechanical arm is to utilize its position of eye-observation correct, so be easier to produce erroneous judgement.Therefore, the present invention proposes a kind of bearing calibration of means for correcting and carrying wafers equipment of carrying wafers equipment, accurately mechanical arm being proofreaied and correct, and then avoids wafer to damage to some extent in the process of carrying.Below will the present invention be described, but it is not that those skilled in the art can modify following embodiment slightly according to spirit of the present invention, precisely because still belong to scope of the present invention in order to qualification the present invention for embodiment.
Fig. 2 illustrates and is the carrying wafers equipment of one embodiment of the invention and the schematic diagram of means for correcting thereof.Please refer to Fig. 2, carrying wafers equipment 200 comprises Handling device 210 and chip bearing apparatus 230.Wherein, chip bearing apparatus 230 has a plurality of storage tanks (as storage tank 231～235), with ccontaining a plurality of wafers 221～225.Handling device 210 is suitable for wafer 221～225 being moved away from storage tank 231～235 or inserting in the storage tank 231～235.
Hold above-mentionedly, the means for correcting 290 of carrying wafers equipment comprises reflecting element 250, image extraction module 260, image processing module 270 and screen 280.Wherein, reflecting element 250 is disposed at chip bearing apparatus 230 sides, and image extraction module 260 is disposed on the optical path of reflecting element 250 reflection rays, and image processing module 270 is coupled to image extraction module 260 with screen 280.In addition, reflecting element 250 is suitable for the image in the chip bearing apparatus 230 is reflexed to image extraction module 260, and the image in the image extraction module 260 acquisition chip bearing apparatus 230.Whether in the time of in Handling device 210 stretches into chip bearing apparatus 230, image processing module 270 is suitable for analyzing the image that image extraction module 260 is captured, normal with the position of judging Handling device 210.Screen 280 is suitable for the image that shows that image extraction module 260 the subject of knowledge and the object of knowledges capture.
In this embodiment, Handling device 210 comprises a plurality of mechanical arms, and as mechanical arm 211～215, and chip bearing apparatus 230 for example is a front-open wafer box, but not as limit.This chip bearing apparatus 230 has relative end face (not illustrating), bottom surface 236 and is connected in end face and a plurality of sides 237 of bottom surface 236.One of them has opening 232 these sides 237, so that the mechanical arm 211～215 of Handling device 210 can be stretched in the chip bearing apparatus 230 through opening 232 thus, and then wafer 221～225 is moved away from or is inserted the storage tank 231～235 of chip bearing apparatus 230.In addition, the storage tank 231～235 of chip bearing apparatus 230 for example is parallel to each other, and the distance between the wantonly two adjacent storage tanks equates.In the present embodiment, reflecting element 250 for example is a speculum, and it is configurable not to have the side 237 of opening 232 by one of them in chip bearing apparatus 230.
Hold above-mentioned, carrying wafers equipment 200 also comprise the carrying port 240, and chip bearing apparatus 230 be disposed at the carrying port 240 on.In the time of in mechanical arm stretches into chip bearing apparatus 230, image extraction module 260 can be sent to the image that captures image processing module 270.Whether 270 of image processing modules can be analyzed the image that image extraction module 260 is captured, normal with the position of judging mechanical arm 211～215.In this embodiment, image extraction module 260 for example is charge-coupled image sensor or complement metal oxide semiconductor image sensing element.
Generally speaking, before the carrying wafer, can carry out the correction of carrying wafers equipment earlier, to avoid making wafer impaired because of the malposition of carrying wafers equipment.Below will introduce the bearing calibration of above-mentioned carrying wafers equipment in detail, please refer to Fig. 2 to Fig. 4, wherein Fig. 3 is the schematic diagram of the image that image extraction module captured of Fig. 2, and Fig. 4 is the flow chart of steps of bearing calibration of the carrying wafers equipment of one embodiment of the invention.
The bearing calibration of the carrying wafers equipment of present embodiment comprises the following steps: at first, shown in step S410, the Handling device 210 of carrying wafers equipment 200 is stretched in the chip bearing apparatus 230.Particularly, be to make the mechanical arm 211～215 of Handling device 210 stretch into the below of the storage tank 231～235 of chip bearing apparatus 230 by the opening of chip bearing apparatus 230 in the present embodiment.
Next, shown in step S420, the image in the image extraction module 260 acquisition chip bearing apparatus 230 of the means for correcting 290 by carrying wafers equipment.Wherein, the image that image extraction module 260 is captured as shown in Figure 3, this image comprises the image 311～315 of image 331～335 and a plurality of arms 211～215 of mechanical arm 210 of the storage tank 231～235 of chip bearing apparatus 230.
Afterwards, shown in step S430, whether the image processing module 270 of the means for correcting 290 by carrying wafers equipment is analyzed the image that image extraction modules 260 are captured, normal with the position of judging Handling device 210.Wherein, whether normal whether the position method of judging Handling device 210 for example normal for judging the mechanical arm 211～215 and the distance of storage tank 231～235 above it.
In more detail, because the fixed-site of the storage tank 231～235 of chip bearing apparatus 230, and the spacing of adjacent storage tank 231～235 is also fixing, so can calculate each storage tank 231～235 pairing location of pixels in image extraction module 260 by image processing module 270, and can to calculate the pairing actual range of each pixel according to the occupied pixel quantity N in image extraction module 260 of the space D between the adjacent storage tank be D/N.For instance, if D=10mm and N=10, then the pairing actual range of each pixel is 1mm.When mechanical arm 211～215 stretches into corresponding storage tank 231～235 belows, image processing module 270 can be calculated whether each mechanical arm 211～215 is crossed far with the distance of the storage tank 231～235 of its top according to the pixel quantity N1～N5 at the image 311～315 of each mechanical arm and 331～335 intervals of image of the storage tank of its top or be near excessively, and then judges whether the position of each mechanical arm 211～215 is normal.
Afterwards, shown in step S440, adjust the position of Handling device 210 according to the result who judges.For instance, judge the hypotelorism between the image 333 of the image 313 of mechanical arm 213 and storage tank 223 when image processing module 270, then mechanical arm 213 is adjusted to the appropriate location downwards.Otherwise, judge the hypertelorism between the image 333 of the image 313 of mechanical arm 213 and storage tank 223 when image processing module 270, then mechanical arm 213 is adjusted upward to the appropriate location.
Because the bearing calibration of carrying wafers equipment of the present invention is to utilize image processing module 270 to judge whether the position 211～215 of each mechanical arm is normal, and the abnormal mechanical arm in position adjusted, therefore at the timing that carries out carrying wafers equipment, can effectively avoid the erroneous judgement that causes because of human factor.In addition, the bearing calibration of carrying wafers equipment of the present invention can judge simultaneously whether the position of a plurality of mechanical arms is normal, and the abnormal mechanical arm in position is proofreaied and correct, and therefore can improve correction efficient.
It should be noted that, the bearing calibration of carrying wafers equipment of the present invention is except can be proofreading and correct the mechanical arm of Handling device before the carrying wafer, also can be when Handling device be carried wafer, the position of monitoring mechanical arm, and the real-time abnormal mechanical arm of correction position, to avoid mechanical arm infringement wafer.
In sum, carrying wafers equipment of the present invention and bearing calibration thereof have following advantage at least:
1. the image when the present invention stretches in the chip bearing apparatus by image extraction module acquisition haulage equipment, and proofread and correct haulage equipment according to the image that is captured by image processing module.Therefore, can effectively avoid the erroneous judgement that causes because of human factor, and then prevent that wafer is impaired in the process of carrying.
2. can judge simultaneously owing to the present invention whether the position of a plurality of mechanical arms is normal, and the abnormal mechanical arm in position is proofreaied and correct, therefore can shorten the time of carrying wafers equipment calibration.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with claim the person of being defined be as the criterion.
Claims (6)
1, a kind of means for correcting of carrying wafers equipment, be suitable for carrying wafers equipment is proofreaied and correct, wherein this carrying wafers equipment comprises Handling device, and it is suitable for a plurality of wafers are moved away from or inserted in a plurality of storage tanks of chip bearing apparatus, and the means for correcting of this carrying wafers equipment comprises:
Reflecting element is disposed at by this chip bearing apparatus;
Image extraction module is disposed on the optical path of this reflecting element reflection ray, and wherein this reflecting element is suitable for the image in this chip bearing apparatus is reflexed to this image extraction module, and this image extraction module is suitable for capturing this image in this chip bearing apparatus;
Image processing module is coupled to this image extraction module, and in the time of wherein in this Handling device stretches into this chip bearing apparatus, whether this image processing module is suitable for analyzing this image that this image extraction module captures, normal with the position of judging this Handling device; And
Screen is coupled to this image extraction module, with this image that shows that this image extraction module is captured.
2, the means for correcting of carrying wafers equipment as claimed in claim 1, wherein this Handling device comprises at least one mechanical arm, and this image processing module is suitable for judging whether the position when respectively this mechanical arm stretches in this chip bearing apparatus is normal.
3, the means for correcting of carrying wafers equipment as claimed in claim 1, wherein this image extraction module comprises charge-coupled image sensor or complement metal oxide semiconductor image sensing element.
4, a kind of bearing calibration of carrying wafers equipment, be suitable for carrying wafers equipment being proofreaied and correct by the means for correcting of the described carrying wafers equipment of claim 1, wherein this carrying wafers equipment comprises Handling device, it is suitable for a plurality of wafers are moved away from or inserted in a plurality of storage tanks of chip bearing apparatus, and the bearing calibration of this carrying wafers equipment comprises:
This Handling device of this carrying wafers equipment is stretched in this chip bearing apparatus;
This image extraction module of means for correcting by this carrying wafers equipment captures the image in this chip bearing apparatus;
Whether this image processing module of the means for correcting by this carrying wafers equipment is analyzed this image that this image extraction module captures, normal with the position of judging this Handling device; And
Adjust the position of this Handling device according to the result who judges.
5, the bearing calibration of carrying wafers equipment as claimed in claim 4, wherein this Handling device comprises at least one mechanical arm, and when those mechanical arms stretch in this chip bearing apparatus, be one of them below of those storage tanks of stretching into earlier this chip bearing apparatus respectively, and the position of judging this Handling device whether normal method comprise judgement respectively whether this mechanical arm normal with the distance of this storage tank above it.
6, the bearing calibration of carrying wafers equipment as claimed in claim 5, wherein the method for adjusting the position of this Handling device according to the result who judges comprise with and this storage tank of its top between abnormal this mechanical arm of distance be adjusted to suitable position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610093847 CN101092034A (en) | 2006-06-20 | 2006-06-20 | Adjusting device for facility of handling wafers, and adjusting method for facility of handling wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610093847 CN101092034A (en) | 2006-06-20 | 2006-06-20 | Adjusting device for facility of handling wafers, and adjusting method for facility of handling wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101092034A true CN101092034A (en) | 2007-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610093847 Pending CN101092034A (en) | 2006-06-20 | 2006-06-20 | Adjusting device for facility of handling wafers, and adjusting method for facility of handling wafers |
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| Country | Link |
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| CN (1) | CN101092034A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633173B (en) * | 2009-08-21 | 2010-12-29 | 沈阳建筑大学 | Correcting device of end effector of robot |
| CN105377513A (en) * | 2013-05-17 | 2016-03-02 | 罗信2002有限公司 | Head and automated mechanized method with vision |
| CN105983978A (en) * | 2015-01-09 | 2016-10-05 | 力晶科技股份有限公司 | Detection device and detection method for mechanical arm |
| CN111347449A (en) * | 2018-12-21 | 2020-06-30 | 株式会社达谊恒 | Multi-layer hand pad and transfer robot with same |
-
2006
- 2006-06-20 CN CN 200610093847 patent/CN101092034A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633173B (en) * | 2009-08-21 | 2010-12-29 | 沈阳建筑大学 | Correcting device of end effector of robot |
| CN105377513A (en) * | 2013-05-17 | 2016-03-02 | 罗信2002有限公司 | Head and automated mechanized method with vision |
| CN105377513B (en) * | 2013-05-17 | 2018-05-15 | 罗信2002有限公司 | Automatic machine processing head and method with vision |
| CN105983978A (en) * | 2015-01-09 | 2016-10-05 | 力晶科技股份有限公司 | Detection device and detection method for mechanical arm |
| CN111347449A (en) * | 2018-12-21 | 2020-06-30 | 株式会社达谊恒 | Multi-layer hand pad and transfer robot with same |
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