JP6042281B2 - 積層セラミックキャパシタ及びその実装基板 - Google Patents
積層セラミックキャパシタ及びその実装基板 Download PDFInfo
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- JP6042281B2 JP6042281B2 JP2013151449A JP2013151449A JP6042281B2 JP 6042281 B2 JP6042281 B2 JP 6042281B2 JP 2013151449 A JP2013151449 A JP 2013151449A JP 2013151449 A JP2013151449 A JP 2013151449A JP 6042281 B2 JP6042281 B2 JP 6042281B2
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- 239000003985 ceramic capacitor Substances 0.000 title claims description 84
- 239000003990 capacitor Substances 0.000 claims description 69
- 239000004020 conductor Substances 0.000 claims description 64
- 239000000919 ceramic Substances 0.000 claims description 57
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
110、210 セラミック本体
111、211 誘電体層
121、122、123、124、221、222、223、224 第1から第4内部電極
225、226 第5及び第6内部電極
125 内部連結導体
227、228 第1及び第2内部連結導体
122a、124a、224a、226a リード
131、132、133、134、231、232、233、234 第1から第4外部電極
300 実装基板
310 印刷回路基板
321、322 第1及び第2電極パッド
330 はんだ
Claims (17)
- 複数の誘電体層を含み、相対する第1、第2主面、相対する第1、第2側面及び相対する第1、第2端面を有するセラミック本体と、
前記セラミック本体内に形成され、第1端面に露出した第1内部電極及び第2端面に露出し、第1側面に露出したリードを有する第2内部電極を含む第1キャパシタ部と第1端面に露出した第3内部電極及び第2側面に露出したリードを有する第4内部電極を含む第2キャパシタ部と、
前記セラミック本体内に形成され、第1及び第2側面に露出した内部連結導体と、
前記セラミック本体の外側に形成され、前記第1から第4内部電極及び内部連結導体と電気的に連結された第1から第4外部電極と、を含み、
前記第1キャパシタ部の静電容量は、前記第2キャパシタ部の静電容量より大きい、積層セラミックキャパシタ。 - 前記第1及び第2外部電極は、前記セラミック本体の相対する第1及び第2端面に配置され、前記第3及び第4外部電極は、前記セラミック本体の相対する第1及び第2側面に配置される、請求項1に記載の積層セラミックキャパシタ。
- 前記積層セラミックキャパシタの等価直列抵抗(ESR)は、低周波領域に比べて高周波領域において増加する、請求項1に記載の積層セラミックキャパシタ。
- 前記内部連結導体は、第4外部電極を通じて前記第4内部電極と連結される、請求項1に記載の積層セラミックキャパシタ。
- 前記内部連結導体は、前記第3外部電極を通じて前記第2内部電極と連結される、請求項4に記載の積層セラミックキャパシタ。
- 前記第3外部電極と第4外部電極の離隔された距離は、前記セラミック本体の幅方向に向かって120〜240μmである、請求項1に記載の積層セラミックキャパシタ。
- 前記積層セラミックキャパシタの等価直列抵抗(ESR)は、前記内部連結導体によって調節される、請求項1に記載の積層セラミックキャパシタ。
- 複数の誘電体層を含み、相対する第1、第2主面、相対する第1、第2側面及び相対する第1、第2端面を有するセラミック本体と、
前記セラミック本体内に形成され、第1端面に露出した第1内部電極及び第2端面に露出した第2内部電極を含む第1キャパシタ部、第1端面に露出した第3内部電極及び第1側面に露出したリードを有する第4内部電極を含む第2キャパシタ部及び第1端面に露出した第5内部電極及び第2側面に露出したリードを有する第6内部電極を含む第3キャパシタ部と、
前記セラミック本体内に形成され、第2端面及び第1側面に露出した第1内部連結導体と第1側面及び第2側面に露出した第2内部連結導体と、
前記セラミック本体の外側に形成され、前記第1から第6内部電極及び第1及び第2内部連結導体と電気的に連結された第1から第4外部電極と、を含み、
前記第1キャパシタ部の静電容量は、前記第2及び第3キャパシタ部の静電容量より大きい、積層セラミックキャパシタ。 - 前記第1及び第2外部電極は、前記セラミック本体の相対する第1及び第2端面に配置され、前記第3及び第4外部電極は、前記セラミック本体の相対する第1及び第2側面に配置される、請求項8に記載の積層セラミックキャパシタ。
- 前記積層セラミックキャパシタの等価直列抵抗(ESR)は、低周波領域に比べて高周波領域において増加する、請求項8に記載の積層セラミックキャパシタ。
- 前記第1内部連結導体は、第3外部電極を通じて前記第4内部電極と連結される、請求項8に記載の積層セラミックキャパシタ。
- 前記第1内部連結導体は、第2外部電極を通じて前記第2内部電極と連結される、請求項11に記載の積層セラミックキャパシタ。
- 前記第2内部連結導体は、第4外部電極を通じて前記第6内部電極と連結される、請求項8に記載の積層セラミックキャパシタ。
- 前記第2内部連結導体は、第3外部電極を通じて前記第1内部連結導体と連結される、請求項13に記載の積層セラミックキャパシタ。
- 前記第3外部電極と第4外部電極の離隔された距離は、前記セラミック本体の幅方向に向かって120〜240μmである、請求項8に記載の積層セラミックキャパシタ。
- 前記積層セラミックキャパシタの等価直列抵抗(ESR)は、前記第1及び第2内部連結導体によって調節される、請求項8に記載の積層セラミックキャパシタ。
- 上部に第1及び第2電極パッドを有する印刷回路基板と、
前記印刷回路基板上に設置された前記請求項1から16のいずれか一項に記載の積層セラミックキャパシタと、を含む、積層セラミックキャパシタの実装基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0044154 | 2013-04-22 | ||
KR1020130044154A KR101994712B1 (ko) | 2013-04-22 | 2013-04-22 | 적층 세라믹 커패시터 및 그 실장 기판 |
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Publication Number | Publication Date |
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JP2014216639A JP2014216639A (ja) | 2014-11-17 |
JP6042281B2 true JP6042281B2 (ja) | 2016-12-14 |
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JP2013151449A Expired - Fee Related JP6042281B2 (ja) | 2013-04-22 | 2013-07-22 | 積層セラミックキャパシタ及びその実装基板 |
Country Status (4)
Country | Link |
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US (1) | US9024206B2 (ja) |
JP (1) | JP6042281B2 (ja) |
KR (1) | KR101994712B1 (ja) |
CN (1) | CN104112589B (ja) |
Cited By (1)
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CN112321305B (zh) * | 2020-11-06 | 2022-06-03 | 营口四通高温新材料科技有限公司 | 一种精炼钢包用多气泡透气元件 |
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KR101504017B1 (ko) | 2013-07-11 | 2015-03-18 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR102004781B1 (ko) * | 2014-01-27 | 2019-07-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR102089693B1 (ko) * | 2014-05-07 | 2020-03-16 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR102016485B1 (ko) * | 2014-07-28 | 2019-09-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
CN105070504B (zh) * | 2015-07-22 | 2018-01-19 | 广东欧珀移动通信有限公司 | 一种电阻电容共体器件 |
KR101740825B1 (ko) | 2015-12-04 | 2017-05-26 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR102402798B1 (ko) | 2017-07-13 | 2022-05-27 | 삼성전기주식회사 | 커패시터 및 이를 포함하는 실장기판 |
KR20200062354A (ko) | 2017-10-23 | 2020-06-03 | 에이브이엑스 코포레이션 | 향상된 연결성을 갖는 다층 전자 디바이스 및 다층 전자 디바이스의 제조 방법 |
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JP7231340B2 (ja) * | 2018-06-05 | 2023-03-01 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
KR20210088875A (ko) * | 2020-01-07 | 2021-07-15 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
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JP2008117999A (ja) * | 2006-11-07 | 2008-05-22 | Sanyo Electric Co Ltd | 電気素子 |
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KR100925628B1 (ko) * | 2008-03-07 | 2009-11-06 | 삼성전기주식회사 | 적층형 칩 커패시터 |
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JP4737301B2 (ja) | 2009-01-30 | 2011-07-27 | Tdk株式会社 | 積層コンデンサ |
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JP5218545B2 (ja) | 2010-12-24 | 2013-06-26 | Tdk株式会社 | 積層コンデンサ |
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2013
- 2013-04-22 KR KR1020130044154A patent/KR101994712B1/ko active IP Right Grant
- 2013-07-22 JP JP2013151449A patent/JP6042281B2/ja not_active Expired - Fee Related
- 2013-07-24 US US13/950,119 patent/US9024206B2/en active Active
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CN112321305B (zh) * | 2020-11-06 | 2022-06-03 | 营口四通高温新材料科技有限公司 | 一种精炼钢包用多气泡透气元件 |
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US9024206B2 (en) | 2015-05-05 |
CN104112589B (zh) | 2018-03-16 |
JP2014216639A (ja) | 2014-11-17 |
KR20140126081A (ko) | 2014-10-30 |
CN104112589A (zh) | 2014-10-22 |
KR101994712B1 (ko) | 2019-09-30 |
US20140311788A1 (en) | 2014-10-23 |
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