JP6020715B2 - レーザ加工機および孔開け加工方法 - Google Patents

レーザ加工機および孔開け加工方法 Download PDF

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Publication number
JP6020715B2
JP6020715B2 JP2015512437A JP2015512437A JP6020715B2 JP 6020715 B2 JP6020715 B2 JP 6020715B2 JP 2015512437 A JP2015512437 A JP 2015512437A JP 2015512437 A JP2015512437 A JP 2015512437A JP 6020715 B2 JP6020715 B2 JP 6020715B2
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Japan
Prior art keywords
laser
cutting
closed path
plate material
laser processing
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JP2015512437A
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English (en)
Japanese (ja)
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JPWO2014171325A1 (ja
Inventor
圭太 松本
圭太 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Machinery Ltd
Original Assignee
Murata Machinery Ltd
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Publication of JP6020715B2 publication Critical patent/JP6020715B2/ja
Publication of JPWO2014171325A1 publication Critical patent/JPWO2014171325A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2015512437A 2013-04-19 2014-03-31 レーザ加工機および孔開け加工方法 Active JP6020715B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013088023 2013-04-19
JP2013088023 2013-04-19
PCT/JP2014/059559 WO2014171325A1 (ja) 2013-04-19 2014-03-31 レーザ加工機および孔開け加工方法

Publications (2)

Publication Number Publication Date
JP6020715B2 true JP6020715B2 (ja) 2016-11-02
JPWO2014171325A1 JPWO2014171325A1 (ja) 2017-02-23

Family

ID=51731277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015512437A Active JP6020715B2 (ja) 2013-04-19 2014-03-31 レーザ加工機および孔開け加工方法

Country Status (4)

Country Link
US (1) US9981345B2 (zh)
JP (1) JP6020715B2 (zh)
CN (1) CN105142855B (zh)
WO (1) WO2014171325A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113547236A (zh) * 2021-07-01 2021-10-26 上海美维电子有限公司 激光钻机性能检测方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6643439B1 (ja) * 2018-09-27 2020-02-12 株式会社アマダホールディングス レーザ加工方法、レーザ加工装置、及びレーザ加工品の製造方法
CN112756809A (zh) * 2020-12-31 2021-05-07 深圳市诚瑞丰科技股份有限公司 一种精密孔件的激光切割方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07232289A (ja) * 1994-02-24 1995-09-05 Mitsubishi Electric Corp レーザ切断方法
JPH08206856A (ja) * 1995-01-31 1996-08-13 Mitsubishi Electric Corp レーザ加工装置および加工方法
JPH09216082A (ja) * 1996-02-07 1997-08-19 Mitsubishi Electric Corp レーザ加工方法
JPH09220683A (ja) * 1996-02-14 1997-08-26 Amada Co Ltd 丸穴加工方法
JPH1080783A (ja) * 1996-09-06 1998-03-31 Amada Co Ltd 熱切断機における丸穴切断方法およびその装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169976A (en) * 1976-02-27 1979-10-02 Valfivre S.P.A. Process for cutting or shaping of a substrate by laser
US4266112A (en) * 1979-02-14 1981-05-05 Niedermeyer William P Web-cutting process
JPS63104793A (ja) * 1986-10-20 1988-05-10 Canon Inc レ−ザ切断方法
JPH04189421A (ja) * 1990-11-20 1992-07-07 Mitsubishi Electric Corp ワイヤ放電加工方法及びその装置
JPH06179092A (ja) * 1992-12-14 1994-06-28 Fanuc Ltd レーザロボットのレーザ加工方法および装置
JPH07112287A (ja) * 1993-10-15 1995-05-02 Fanuc Ltd Ｎｃレーザ装置
JP3162255B2 (ja) * 1994-02-24 2001-04-25 三菱電機株式会社 レーザ加工方法及びその装置
JP3372339B2 (ja) * 1994-02-25 2003-02-04 ファナック株式会社 レーザ加工装置
US7463395B2 (en) 2005-03-31 2008-12-09 Lintec Corporation Method for recording information into rewritable thermal label of the non-contact type
CN101450420B (zh) 2007-11-29 2011-04-27 上海团结普瑞玛激光设备有限公司 大台面数控激光切割机

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07232289A (ja) * 1994-02-24 1995-09-05 Mitsubishi Electric Corp レーザ切断方法
JPH08206856A (ja) * 1995-01-31 1996-08-13 Mitsubishi Electric Corp レーザ加工装置および加工方法
JPH09216082A (ja) * 1996-02-07 1997-08-19 Mitsubishi Electric Corp レーザ加工方法
JPH09220683A (ja) * 1996-02-14 1997-08-26 Amada Co Ltd 丸穴加工方法
JPH1080783A (ja) * 1996-09-06 1998-03-31 Amada Co Ltd 熱切断機における丸穴切断方法およびその装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113547236A (zh) * 2021-07-01 2021-10-26 上海美维电子有限公司 激光钻机性能检测方法

Also Published As

Publication number Publication date
CN105142855A (zh) 2015-12-09
JPWO2014171325A1 (ja) 2017-02-23
US20160045984A1 (en) 2016-02-18
WO2014171325A1 (ja) 2014-10-23
US9981345B2 (en) 2018-05-29
CN105142855B (zh) 2017-09-29

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