JP6017119B2 - 発泡緩衝体および被着体機器の緩衝構造 - Google Patents

発泡緩衝体および被着体機器の緩衝構造 Download PDF

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Publication number
JP6017119B2
JP6017119B2 JP2011115272A JP2011115272A JP6017119B2 JP 6017119 B2 JP6017119 B2 JP 6017119B2 JP 2011115272 A JP2011115272 A JP 2011115272A JP 2011115272 A JP2011115272 A JP 2011115272A JP 6017119 B2 JP6017119 B2 JP 6017119B2
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Japan
Prior art keywords
foam
foam cushion
surface portion
adherend
contact
Prior art date
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JP2011115272A
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Japanese (ja)
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JP2012243371A (ja
Inventor
達也 福岡
達也 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Polymatech Co Ltd
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Polymatech Japan Co Ltd
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Publication date
Application filed by Polymatech Japan Co Ltd filed Critical Polymatech Japan Co Ltd
Priority to JP2011115272A priority Critical patent/JP6017119B2/ja
Priority to TW101113896A priority patent/TWI556230B/zh
Priority to CN201210154367.XA priority patent/CN102800347B/zh
Publication of JP2012243371A publication Critical patent/JP2012243371A/ja
Application granted granted Critical
Publication of JP6017119B2 publication Critical patent/JP6017119B2/ja
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  • Vibration Dampers (AREA)
  • Buffer Packaging (AREA)
  • Vibration Prevention Devices (AREA)
JP2011115272A 2011-05-23 2011-05-23 発泡緩衝体および被着体機器の緩衝構造 Active JP6017119B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011115272A JP6017119B2 (ja) 2011-05-23 2011-05-23 発泡緩衝体および被着体機器の緩衝構造
TW101113896A TWI556230B (zh) 2011-05-23 2012-04-19 A foam buffer body and a cushioning structure covering the buffer body
CN201210154367.XA CN102800347B (zh) 2011-05-23 2012-05-14 泡沫缓冲体及被覆体装置的缓冲结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011115272A JP6017119B2 (ja) 2011-05-23 2011-05-23 発泡緩衝体および被着体機器の緩衝構造

Publications (2)

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JP2012243371A JP2012243371A (ja) 2012-12-10
JP6017119B2 true JP6017119B2 (ja) 2016-10-26

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JP2011115272A Active JP6017119B2 (ja) 2011-05-23 2011-05-23 発泡緩衝体および被着体機器の緩衝構造

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JP (1) JP6017119B2 (zh)
CN (1) CN102800347B (zh)
TW (1) TWI556230B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3687755A1 (en) * 2017-09-29 2020-08-05 3M Innovative Properties Company Polymeric foam layer and methods of making the same
JP7179693B2 (ja) * 2019-06-28 2022-11-29 株式会社東芝 振動検出装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0712646B2 (ja) * 1986-05-27 1995-02-15 東京シ−ト株式会社 軟質フォーム製緩衝材の製造方法
CN2492927Y (zh) * 2001-06-14 2002-05-22 易拓科技有限公司 硬盘驱动器电路板绝缘垫
JP2005243233A (ja) * 2001-12-12 2005-09-08 Matsushita Electric Ind Co Ltd 可搬型ディスクドライブ装置および情報記録再生装置
JP2004127438A (ja) * 2002-10-03 2004-04-22 Sony Corp 情報記憶装置
JP4944528B2 (ja) * 2006-07-25 2012-06-06 ポリマテック株式会社 緩衝部材
JP2008041194A (ja) * 2006-08-08 2008-02-21 Bridgestone Corp 電子部品装置
DE602007006142D1 (de) * 2006-12-28 2010-06-10 Panasonic Corp Pufferelement, Stoßdämpfungsvorrichtung für ein Festplattenlaufwerk und mobile Informationsvorrichtung damit
JP4558760B2 (ja) * 2007-05-14 2010-10-06 レノボ・シンガポール・プライベート・リミテッド 磁気ディスク装置の緩衝部材、衝撃緩衝方法、および電子機器
JP5354923B2 (ja) * 2008-02-14 2013-11-27 アキレス株式会社 電子機器部品用の制振材の製造方法

Also Published As

Publication number Publication date
TW201314678A (zh) 2013-04-01
CN102800347B (zh) 2016-12-14
CN102800347A (zh) 2012-11-28
JP2012243371A (ja) 2012-12-10
TWI556230B (zh) 2016-11-01

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