JP6009513B2 - 半導体装置の製造方法、基板処理装置およびプログラム - Google Patents

半導体装置の製造方法、基板処理装置およびプログラム Download PDF

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JP6009513B2
JP6009513B2 JP2014177763A JP2014177763A JP6009513B2 JP 6009513 B2 JP6009513 B2 JP 6009513B2 JP 2014177763 A JP2014177763 A JP 2014177763A JP 2014177763 A JP2014177763 A JP 2014177763A JP 6009513 B2 JP6009513 B2 JP 6009513B2
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Prior art keywords
gas
processing chamber
substrate
heater
processing
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Japanese (ja)
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JP2016051864A5 (OSRAM
JP2016051864A (ja
Inventor
山本　隆治
隆治 山本
司 鎌倉
司 鎌倉
義朗 ▲ひろせ▼
義朗 ▲ひろせ▼
島本　聡
聡 島本
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Priority to JP2014177763A priority Critical patent/JP6009513B2/ja
Priority to CN201510416824.1A priority patent/CN105390378B/zh
Priority to TW104123434A priority patent/TWI585884B/zh
Priority to US14/838,793 priority patent/US9640387B2/en
Priority to KR1020150123774A priority patent/KR101751599B1/ko
Publication of JP2016051864A publication Critical patent/JP2016051864A/ja
Publication of JP2016051864A5 publication Critical patent/JP2016051864A5/ja
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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