JP6002487B2 - 分析方法、分析装置、及びエッチング処理システム - Google Patents

分析方法、分析装置、及びエッチング処理システム Download PDF

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JP6002487B2
JP6002487B2 JP2012161130A JP2012161130A JP6002487B2 JP 6002487 B2 JP6002487 B2 JP 6002487B2 JP 2012161130 A JP2012161130 A JP 2012161130A JP 2012161130 A JP2012161130 A JP 2012161130A JP 6002487 B2 JP6002487 B2 JP 6002487B2
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JP2014022621A5 (enExample
JP2014022621A (ja
Inventor
涼次 朝倉
涼次 朝倉
玉置　研二
研二 玉置
鹿子嶋　昭
昭 鹿子嶋
白石　大輔
大輔 白石
増田　俊夫
俊夫 増田
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2012161130A priority Critical patent/JP6002487B2/ja
Priority to US13/945,285 priority patent/US9091595B2/en
Priority to TW102125810A priority patent/TWI517246B/zh
Priority to KR1020130085658A priority patent/KR101571928B1/ko
Publication of JP2014022621A publication Critical patent/JP2014022621A/ja
Publication of JP2014022621A5 publication Critical patent/JP2014022621A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G01J3/443—Emission spectrometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
JP2012161130A 2012-07-20 2012-07-20 分析方法、分析装置、及びエッチング処理システム Active JP6002487B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012161130A JP6002487B2 (ja) 2012-07-20 2012-07-20 分析方法、分析装置、及びエッチング処理システム
US13/945,285 US9091595B2 (en) 2012-07-20 2013-07-18 Analysis method, analysis device, and etching processing system
TW102125810A TWI517246B (zh) 2012-07-20 2013-07-18 Analytical methods, analytical devices and etching processing systems
KR1020130085658A KR101571928B1 (ko) 2012-07-20 2013-07-19 분석 방법, 분석 장치 및 에칭 처리 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161130A JP6002487B2 (ja) 2012-07-20 2012-07-20 分析方法、分析装置、及びエッチング処理システム

Publications (3)

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JP2014022621A JP2014022621A (ja) 2014-02-03
JP2014022621A5 JP2014022621A5 (enExample) 2015-05-28
JP6002487B2 true JP6002487B2 (ja) 2016-10-05

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JP2012161130A Active JP6002487B2 (ja) 2012-07-20 2012-07-20 分析方法、分析装置、及びエッチング処理システム

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US (1) US9091595B2 (enExample)
JP (1) JP6002487B2 (enExample)
KR (1) KR101571928B1 (enExample)
TW (1) TWI517246B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6239294B2 (ja) 2013-07-18 2017-11-29 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理装置の運転方法
US9293303B2 (en) * 2013-08-30 2016-03-22 Taiwan Semiconductor Manufacturing Company, Ltd. Low contamination chamber for surface activation
JP6173851B2 (ja) * 2013-09-20 2017-08-02 株式会社日立ハイテクノロジーズ 分析方法およびプラズマエッチング装置
JP6220319B2 (ja) * 2014-07-17 2017-10-25 株式会社日立ハイテクノロジーズ データ解析方法及びプラズマエッチング方法並びにプラズマ処理装置
WO2016105036A1 (ko) * 2014-12-22 2016-06-30 주식회사 두산 유기 전계 발광 소자
KR20160120382A (ko) 2015-04-07 2016-10-18 삼성전자주식회사 광학 분광 분석 장치 및 플라즈마 처리 장치
JP6549917B2 (ja) 2015-06-26 2019-07-24 株式会社日立ハイテクノロジーズ プラズマ処理装置およびそのデータ解析装置
KR102415329B1 (ko) 2015-09-08 2022-06-30 삼성전자주식회사 튜브형 렌즈, 그 튜브형 렌즈를 포함한 ｏｅｓ 장치, 그 ｏｅｓ 장치를 포함한 플라즈마 모니터링 시스템 및 그 시스템을 이용한 반도체 소자 제조방법
US10215704B2 (en) * 2017-03-02 2019-02-26 Tokyo Electron Limited Computed tomography using intersecting views of plasma using optical emission spectroscopy during plasma processing
KR102396143B1 (ko) 2018-02-09 2022-05-09 삼성전자주식회사 Oes 장치와 이를 포함하는 플라즈마 처리 장치, 및 반도체 장치의 제조 방법
KR102508505B1 (ko) 2018-08-27 2023-03-09 삼성전자주식회사 플라즈마 모니터링 장치 및 플라즈마 처리 시스템
JP7094377B2 (ja) * 2019-12-23 2022-07-01 株式会社日立ハイテク プラズマ処理方法およびプラズマ処理に用いる波長選択方法
JP7467292B2 (ja) * 2020-03-13 2024-04-15 東京エレクトロン株式会社 解析装置、解析方法及び解析プログラム
TWI895368B (zh) * 2020-03-13 2025-09-01 日商東京威力科創股份有限公司 解析裝置、解析方法及解析程式
JP7253668B2 (ja) * 2021-03-15 2023-04-06 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
KR102722616B1 (ko) * 2021-07-14 2024-10-29 주식회사 히타치하이테크 플라스마 처리 장치, 데이터 해석 장치 및 반도체 장치 제조 시스템
KR102685624B1 (ko) * 2021-12-15 2024-07-17 숭실대학교산학협력단 반도체 식각 장비의 고장을 탐지하는 장치, 방법 및 이를 위한 컴퓨터 판독가능 프로그램

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206074A (ja) * 1992-01-28 1993-08-13 Kokusai Electric Co Ltd プラズマエッチング終点検出方法及びその装置
JPH09306894A (ja) 1996-05-17 1997-11-28 Sony Corp 最適発光スペクトル自動検出システム
US6153115A (en) * 1997-10-23 2000-11-28 Massachusetts Institute Of Technology Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra
TW512248B (en) * 1998-07-15 2002-12-01 Toshiba Corp Manufacturing method and apparatus of semiconductor device
JP4051470B2 (ja) * 1999-05-18 2008-02-27 東京エレクトロン株式会社 終点検出方法
JP4694064B2 (ja) 2001-09-18 2011-06-01 住友精密工業株式会社 プラズマエッチング終点検出方法及び装置
DE602004017983D1 (de) * 2003-05-09 2009-01-08 Unaxis Usa Inc Endpunkt-Erkennung in einem zeitlich gemultiplexten Verfahren unter Verwendung eines Hüllkurvenalgorithmus
JP4086190B2 (ja) 2003-09-02 2008-05-14 株式会社日立ハイテクノロジーズ 発光スペクトルの起因物質特定支援装置及び支援方法
JP2008218898A (ja) * 2007-03-07 2008-09-18 Hitachi High-Technologies Corp プラズマ処理装置
JP5192850B2 (ja) 2008-02-27 2013-05-08 株式会社日立ハイテクノロジーズ エッチング終点判定方法
JP5383265B2 (ja) 2009-03-17 2014-01-08 株式会社日立ハイテクノロジーズ エッチング装置、分析装置、エッチング処理方法、およびエッチング処理プログラム
JP5778893B2 (ja) * 2010-03-19 2015-09-16 株式会社東芝 終点検出装置、プラズマ処理装置および終点検出方法
JP5648157B2 (ja) 2011-12-28 2015-01-07 株式会社日立ハイテクノロジーズ 半導体製造装置

Also Published As

Publication number Publication date
JP2014022621A (ja) 2014-02-03
TWI517246B (zh) 2016-01-11
TW201409565A (zh) 2014-03-01
US9091595B2 (en) 2015-07-28
KR101571928B1 (ko) 2015-11-25
KR20140011996A (ko) 2014-01-29
US20140022540A1 (en) 2014-01-23

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