JP6002337B1 - 半導体装置用ボンディングワイヤ - Google Patents

半導体装置用ボンディングワイヤ Download PDF

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Publication number
JP6002337B1
JP6002337B1 JP2015560454A JP2015560454A JP6002337B1 JP 6002337 B1 JP6002337 B1 JP 6002337B1 JP 2015560454 A JP2015560454 A JP 2015560454A JP 2015560454 A JP2015560454 A JP 2015560454A JP 6002337 B1 JP6002337 B1 JP 6002337B1
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Prior art keywords
bonding wire
wire
bonding
concentration
coating layer
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Japanese (ja)
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JPWO2017026077A1 (ja
Inventor
大造 小田
大造 小田
基稀 江藤
基稀 江藤
齋藤　和之
和之 齋藤
榛原　照男
照男 榛原
良 大石
良 大石
山田　隆
隆 山田
宇野　智裕
智裕 宇野
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Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
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Nippon Micrometal Corp
Nippon Steel and Sumikin Materials Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B15/00—Layered products comprising a layer of metal
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    • C22C9/00—Alloys based on copper
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
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JP2018078229A (ja) * 2016-11-11 2018-05-17 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
US11373934B2 (en) 2017-12-28 2022-06-28 Nippon Micrometal Corporation Bonding wire for semiconductor device

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MY168617A (en) 2014-04-21 2018-11-14 Nippon Micrometal Corp Bonding wire for semiconductor device
WO2016203659A1 (ja) 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2017013796A1 (ja) 2015-07-23 2017-01-26 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
MY183371A (en) * 2015-08-12 2021-02-18 Nippon Micrometal Corp Bonding wire for semiconductor device
JP6371932B1 (ja) * 2017-02-22 2018-08-08 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
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