JP5987347B2 - 電子デバイスの製造方法 - Google Patents

電子デバイスの製造方法 Download PDF

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Publication number
JP5987347B2
JP5987347B2 JP2012038376A JP2012038376A JP5987347B2 JP 5987347 B2 JP5987347 B2 JP 5987347B2 JP 2012038376 A JP2012038376 A JP 2012038376A JP 2012038376 A JP2012038376 A JP 2012038376A JP 5987347 B2 JP5987347 B2 JP 5987347B2
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Japan
Prior art keywords
electronic device
metal layer
recess
bonding material
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012038376A
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English (en)
Japanese (ja)
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JP2013175542A5 (https=
JP2013175542A (ja
Inventor
幸弘 橋
幸弘 橋
尚広 中川
尚広 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2012038376A priority Critical patent/JP5987347B2/ja
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Publication of JP2013175542A5 publication Critical patent/JP2013175542A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012038376A 2012-02-24 2012-02-24 電子デバイスの製造方法 Expired - Fee Related JP5987347B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012038376A JP5987347B2 (ja) 2012-02-24 2012-02-24 電子デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012038376A JP5987347B2 (ja) 2012-02-24 2012-02-24 電子デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2013175542A JP2013175542A (ja) 2013-09-05
JP2013175542A5 JP2013175542A5 (https=) 2015-03-19
JP5987347B2 true JP5987347B2 (ja) 2016-09-07

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ID=49268215

Family Applications (1)

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JP2012038376A Expired - Fee Related JP5987347B2 (ja) 2012-02-24 2012-02-24 電子デバイスの製造方法

Country Status (1)

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JP (1) JP5987347B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018102998A1 (zh) * 2016-12-07 2018-06-14 东莞市国瓷新材料科技有限公司 一种带镀铜围坝的陶瓷封装基板制备方法
JP7244712B2 (ja) * 2021-03-19 2023-03-22 Ｎｇｋエレクトロデバイス株式会社 パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01151813A (ja) * 1987-12-09 1989-06-14 Seiko Electronic Components Ltd 小型水晶振動子
JP2004288737A (ja) * 2003-03-19 2004-10-14 Kyocera Corp 電子部品搭載用基板およびそれを用いた電子装置
JP2005079558A (ja) * 2003-09-04 2005-03-24 Miyota Kk 圧電デバイスの製造方法
JP2005216932A (ja) * 2004-01-27 2005-08-11 Kyocera Corp 配線基板及びその製造方法並びに電気部品
JP2012049252A (ja) * 2010-08-25 2012-03-08 Citizen Finetech Miyota Co Ltd 電子部品パッケージ

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Publication number Publication date
JP2013175542A (ja) 2013-09-05

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