JP5983955B2 - 位置合わせ装置、ワークピースローディング装置および位置合わせ方法 - Google Patents
位置合わせ装置、ワークピースローディング装置および位置合わせ方法 Download PDFInfo
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- JP5983955B2 JP5983955B2 JP2013557898A JP2013557898A JP5983955B2 JP 5983955 B2 JP5983955 B2 JP 5983955B2 JP 2013557898 A JP2013557898 A JP 2013557898A JP 2013557898 A JP2013557898 A JP 2013557898A JP 5983955 B2 JP5983955 B2 JP 5983955B2
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- 238000000034 method Methods 0.000 title claims description 13
- 239000000463 material Substances 0.000 claims description 12
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- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 2
- 238000012545 processing Methods 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 7
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 2
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- 238000005468 ion implantation Methods 0.000 description 2
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- 239000000126 substance Substances 0.000 description 2
- 239000004963 Torlon Substances 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
- Y10T29/49829—Advancing work to successive stations [i.e., assembly line]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53022—Means to assemble or disassemble with means to test work or product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53539—Means to assemble or disassemble including work conveyor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
Description
Claims (20)
- キャリッジと、
間にワークピースを通過させる2つのレールであって、前記キャリッジの下方に配置されている2つのレールと、
前記キャリッジから所定距離突出しており、前記ワークピースのための輸送装置が有する柱部に沿って、または、前記柱部に接触するように延在するフィンガーと
を備える位置合わせ装置。 - 前記ワークピースは、太陽電池である請求項1に記載の位置合わせ装置。
- 前記キャリッジは、移動する請求項1または2に記載の位置合わせ装置。
- 前記2つのレールは、PEEKを含む材料で製造されており、
前記フィンガーは、テフロン(登録商標)を含む材料で製造されている請求項1から3のいずれか一項に記載の位置合わせ装置。 - 前記キャリッジに接続されているアームと、
前記キャリッジと前記アームとの間に設けられているバネと
をさらに備える請求項1から4のいずれか一項に記載の位置合わせ装置。 - 前記ワークピースは、コンベヤベルト上に配置されており、
前記位置合わせ装置はさらに、前記キャリッジを前記コンベヤベルトから離れるように第1の方向に移動させるアクチュエータを備える請求項1から5のいずれか一項に記載の位置合わせ装置。 - 前記キャリッジは、前記第1の方向に垂直な第2の方向に沿って移動し、
前記位置合わせ装置はさらに、前記キャリッジと前記アクチュエータとの間に設けられるバネを備える請求項6に記載の位置合わせ装置。 - 前記フィンガーは、斜面を含む請求項1から7のいずれか一項に記載の位置合わせ装置。
- コンベヤベルトと、
ワークピースを保持する輸送装置と、
キャリッジと、
前記キャリッジの下方で間に所定距離を設けて配置されている2つのレールであって、前記コンベヤベルトの上方に位置している2つのレールと、
前記キャリッジから突出しており、前記輸送装置が有する柱部に沿って、または、前記柱部に接触するように延在するフィンガーと
を備えるワークピースローディング装置。 - 前記ワークピースは、太陽電池である請求項9に記載のワークピースローディング装置。
- 前記輸送装置は、前記コンベヤベルトに平行な平面内で移動する請求項9または10に記載のワークピースローディング装置。
- 前記2つのレールは、PEEKを含む材料で製造されており、
前記フィンガーは、テフロン(登録商標)を含む材料で製造されている請求項9から11のいずれか一項に記載のワークピースローディング装置。 - 前記キャリッジに接続されているアームと、
前記キャリッジと前記アームとの間に配置されているバネと
をさらに備える請求項9から12のいずれか一項に記載のワークピースローディング装置。 - 前記コンベヤベルトから離れるように第1の方向に前記キャリッジを移動させるアクチュエータをさらに備える請求項9から13のいずれか一項に記載のワークピースローディング装置。
- 前記キャリッジは、前記第1の方向に垂直な第2の方向に沿って移動し、
前記ワークピースローディング装置はさらに、前記キャリッジと前記アクチュエータとの間に設けられるバネを備える請求項14に記載のワークピースローディング装置。 - 前記フィンガーは、斜面を含む請求項9から15のいずれか一項に記載のワークピースローディング装置。
- 複数のワークピースをコンベヤベルト上で輸送装置に向けて輸送する段階と、
前記複数のワークピースを前記輸送装置内の複数の位置に配置するように、前記輸送装置を第1の方向に移動する段階と、
前記移動する段階において、位置合わせ装置のフィンガーを前記輸送装置が有する柱部に沿って、または、前記柱部に接触するように延在させる段階と、
前記延在させる段階において、前記位置合わせ装置を用いて、前記コンベヤベルト上の前記複数のワークピースのそれぞれを、前記第1の方向に垂直な平面内で、位置合わせする段階と
を備える位置合わせ方法。 - 前記複数のワークピースは、太陽電池である請求項17に記載の位置合わせ方法。
- 前記第1の方向において前記位置合わせ装置の位置を変更する段階をさらに備える請求項17または18に記載の位置合わせ方法。
- 前記コンベヤベルトが前記輸送装置から前記複数のワークピースを取り出している場合、前記位置合わせ装置の位置を前記第1の方向において第1の位置から第2の位置へと変更して、前記輸送する段階のために、前記位置合わせ装置を前記第1の位置へと戻す段階をさらに備える請求項17から19のいずれか一項に記載の位置合わせ方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161451872P | 2011-03-11 | 2011-03-11 | |
US61/451,872 | 2011-03-11 | ||
US13/415,411 US8813338B2 (en) | 2011-03-11 | 2012-03-08 | Workpiece alignment device |
US13/415,411 | 2012-03-08 | ||
PCT/US2012/028479 WO2012125455A1 (en) | 2011-03-11 | 2012-03-09 | Workpiece alignment device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014509082A JP2014509082A (ja) | 2014-04-10 |
JP5983955B2 true JP5983955B2 (ja) | 2016-09-06 |
Family
ID=46794193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013557898A Expired - Fee Related JP5983955B2 (ja) | 2011-03-11 | 2012-03-09 | 位置合わせ装置、ワークピースローディング装置および位置合わせ方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8813338B2 (ja) |
JP (1) | JP5983955B2 (ja) |
KR (2) | KR101607615B1 (ja) |
CN (1) | CN103415919B (ja) |
TW (1) | TWI521634B (ja) |
WO (1) | WO2012125455A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9145271B2 (en) * | 2012-09-18 | 2015-09-29 | Varian Semiconductor Equipment Associates, Inc. | Optimization of conveyor belts used for workpiece processing |
CN114641827B (zh) * | 2019-11-12 | 2023-03-07 | 松下知识产权经营株式会社 | 定位装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1397861A (en) * | 1973-02-01 | 1975-06-18 | Dzus Fastener Europe | Quick-release fastener |
US4009785A (en) * | 1974-10-02 | 1977-03-01 | Motorola, Inc. | Fixture and system for handling plate like objects |
JPS6052437A (ja) * | 1983-09-02 | 1985-03-25 | Hitachi Ltd | ウエハ処理装置 |
JP2503301Y2 (ja) * | 1989-07-28 | 1996-06-26 | 関西日本電気株式会社 | ウェ―ハ立替装置 |
JPH0364923U (ja) * | 1989-10-26 | 1991-06-25 | ||
JP3524140B2 (ja) * | 1994-02-22 | 2004-05-10 | 東京エレクトロン株式会社 | 処理装置 |
US6183186B1 (en) | 1997-08-29 | 2001-02-06 | Daitron, Inc. | Wafer handling system and method |
US6062799A (en) * | 1998-06-23 | 2000-05-16 | Samsung Electronics Co., Ltd. | Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules |
JP2001180822A (ja) | 1999-12-24 | 2001-07-03 | Kanegafuchi Chem Ind Co Ltd | 基板の受渡し方法及び装置 |
JP2006079715A (ja) | 2004-09-09 | 2006-03-23 | Fuji Photo Film Co Ltd | 記録ディスクカートリッジ |
US20070201967A1 (en) * | 2005-11-07 | 2007-08-30 | Bufano Michael L | Reduced capacity carrier, transport, load port, buffer system |
JP2008251921A (ja) | 2007-03-30 | 2008-10-16 | Fujifilm Corp | 基板アライメント装置及び方法並びに描画装置 |
CN102089892B (zh) * | 2008-02-27 | 2013-02-13 | 应用材料公司 | 用于在太阳能电池上形成电连接的设备与方法 |
DE102009024239A1 (de) * | 2009-05-29 | 2010-12-02 | Schmid Technology Systems Gmbh | Vorrichtung und Verfahren zum Stapeln bzw. Transport einer Vielzahl von flachen Substraten |
-
2012
- 2012-03-08 US US13/415,411 patent/US8813338B2/en not_active Expired - Fee Related
- 2012-03-09 KR KR1020137026067A patent/KR101607615B1/ko active IP Right Grant
- 2012-03-09 CN CN201280012699.2A patent/CN103415919B/zh not_active Expired - Fee Related
- 2012-03-09 JP JP2013557898A patent/JP5983955B2/ja not_active Expired - Fee Related
- 2012-03-09 WO PCT/US2012/028479 patent/WO2012125455A1/en active Application Filing
- 2012-03-09 KR KR1020157016981A patent/KR101747287B1/ko active IP Right Grant
- 2012-03-12 TW TW101108280A patent/TWI521634B/zh not_active IP Right Cessation
-
2014
- 2014-08-26 US US14/468,732 patent/US9240338B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR101607615B1 (ko) | 2016-03-30 |
KR20140010128A (ko) | 2014-01-23 |
KR101747287B1 (ko) | 2017-06-14 |
CN103415919A (zh) | 2013-11-27 |
JP2014509082A (ja) | 2014-04-10 |
US8813338B2 (en) | 2014-08-26 |
KR20150080031A (ko) | 2015-07-08 |
TW201240008A (en) | 2012-10-01 |
CN103415919B (zh) | 2016-09-07 |
WO2012125455A1 (en) | 2012-09-20 |
US20120227233A1 (en) | 2012-09-13 |
US20140366358A1 (en) | 2014-12-18 |
TWI521634B (zh) | 2016-02-11 |
US9240338B2 (en) | 2016-01-19 |
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