JP5966171B2 - 集積アンテナパッケージ - Google Patents

集積アンテナパッケージ Download PDF

Info

Publication number
JP5966171B2
JP5966171B2 JP2011237604A JP2011237604A JP5966171B2 JP 5966171 B2 JP5966171 B2 JP 5966171B2 JP 2011237604 A JP2011237604 A JP 2011237604A JP 2011237604 A JP2011237604 A JP 2011237604A JP 5966171 B2 JP5966171 B2 JP 5966171B2
Authority
JP
Japan
Prior art keywords
electromagnetic bandgap
interposer
conductive
lossy
patch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011237604A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012105261A5 (fr
JP2012105261A (ja
Inventor
マクドナルド ジェームズ
マクドナルド ジェームズ
マッキンジー ザ サード ウィリアム
マッキンジー ザ サード ウィリアム
パーモン ウォルター
パーモン ウォルター
ルビン ローレンス
ルビン ローレンス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2012105261A publication Critical patent/JP2012105261A/ja
Publication of JP2012105261A5 publication Critical patent/JP2012105261A5/ja
Application granted granted Critical
Publication of JP5966171B2 publication Critical patent/JP5966171B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
    • H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/142—HF devices
    • H01L2924/1421—RF devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Security & Cryptography (AREA)
  • Toxicology (AREA)
  • Remote Sensing (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Transceivers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
JP2011237604A 2010-11-12 2011-10-28 集積アンテナパッケージ Active JP5966171B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/945,825 US9386688B2 (en) 2010-11-12 2010-11-12 Integrated antenna package
US12/945,825 2010-11-12

Publications (3)

Publication Number Publication Date
JP2012105261A JP2012105261A (ja) 2012-05-31
JP2012105261A5 JP2012105261A5 (fr) 2014-12-11
JP5966171B2 true JP5966171B2 (ja) 2016-08-10

Family

ID=44799845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011237604A Active JP5966171B2 (ja) 2010-11-12 2011-10-28 集積アンテナパッケージ

Country Status (3)

Country Link
US (1) US9386688B2 (fr)
EP (1) EP2453723B1 (fr)
JP (1) JP5966171B2 (fr)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101757719B1 (ko) * 2011-05-11 2017-07-14 한국전자통신연구원 안테나
DE102012201367B4 (de) * 2012-01-31 2020-04-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Millimeterwellen-Radar
DE102012202913A1 (de) * 2012-02-27 2013-08-29 Robert Bosch Gmbh Radarsensor
EP2832192B1 (fr) * 2012-03-28 2017-09-27 Keyssa, Inc. Redirection de signaux électromagnétiques à l'aide de structures de substrat
JP5670392B2 (ja) * 2012-07-27 2015-02-18 株式会社東芝 回路基板
US9356352B2 (en) * 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
KR101764193B1 (ko) 2013-12-03 2017-08-02 가부시키가이샤 무라타 세이사쿠쇼 패치 안테나
US20150262902A1 (en) 2014-03-12 2015-09-17 Invensas Corporation Integrated circuits protected by substrates with cavities, and methods of manufacture
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9620841B2 (en) 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US9917372B2 (en) * 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US9887449B2 (en) 2014-08-29 2018-02-06 Nxp Usa, Inc. Radio frequency coupling structure and a method of manufacturing thereof
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
US9444135B2 (en) 2014-09-19 2016-09-13 Freescale Semiconductor, Inc. Integrated circuit package
KR102139217B1 (ko) * 2014-09-25 2020-07-29 삼성전자주식회사 안테나 장치
US9941226B2 (en) 2014-12-15 2018-04-10 Industrial Technology Research Institute Integrated millimeter-wave chip package
FR3032556B1 (fr) * 2015-02-11 2017-03-17 Commissariat Energie Atomique Dispositif de transmission rf a reflecteur d'ondes electromagnetiques integre
JP6593350B2 (ja) * 2015-02-12 2019-10-23 日本電気株式会社 構造体および配線基板
US10205240B2 (en) * 2015-09-30 2019-02-12 The Mitre Corporation Shorted annular patch antenna with shunted stubs
US9991601B2 (en) 2015-09-30 2018-06-05 The Mitre Corporation Coplanar waveguide transition for multi-band impedance matching
US9780429B2 (en) 2015-10-16 2017-10-03 International Business Machines Corporation 3D-microstrip branchline coupler
CN107369673B (zh) * 2016-05-13 2019-11-05 华为技术有限公司 设置有天线的集成电路封装装置及其制造方法
US11128029B2 (en) 2016-09-26 2021-09-21 Intel Corporation Die with embedded communication cavity
US10002844B1 (en) 2016-12-21 2018-06-19 Invensas Bonding Technologies, Inc. Bonded structures
DE102016125190A1 (de) * 2016-12-21 2018-06-21 Infineon Technologies Ag Radarsysteme für Fahrzeuge und Verfahren zum Betreiben von Radarsystemen von Fahrzeugen
JP6602324B2 (ja) * 2017-01-17 2019-11-06 株式会社東芝 無線装置
US10522499B2 (en) 2017-02-09 2019-12-31 Invensas Bonding Technologies, Inc. Bonded structures
EP3370487A1 (fr) * 2017-03-02 2018-09-05 Nxp B.V. Circuits rf encapsulés et unité radio
US10508030B2 (en) 2017-03-21 2019-12-17 Invensas Bonding Technologies, Inc. Seal for microelectronic assembly
US10199336B2 (en) 2017-05-24 2019-02-05 Advanced Semiconductor Engineering, Inc. Antenna package device
KR102513750B1 (ko) * 2017-11-28 2023-03-24 삼성전자 주식회사 도전성 패턴을 포함하는 인쇄회로기판 및 그 인쇄회로기판을 포함하는 전자 장치
US10923408B2 (en) 2017-12-22 2021-02-16 Invensas Bonding Technologies, Inc. Cavity packages
US11380597B2 (en) 2017-12-22 2022-07-05 Invensas Bonding Technologies, Inc. Bonded structures
JP6776280B2 (ja) * 2018-01-10 2020-10-28 株式会社東芝 無線通信モジュール、プリント基板、および製造方法
KR102442131B1 (ko) * 2018-01-26 2022-09-13 삼성전자 주식회사 안테나 장치 및 안테나 장치를 포함하는 전자 장치
DE102018203106A1 (de) * 2018-03-01 2019-09-05 Conti Temic Microelectronic Gmbh Radarsystem zur Umfelderfassung eines Kraftfahrzeugs mit einer Kunststoffantenne
US20190326232A1 (en) * 2018-04-23 2019-10-24 Wei-Cheng Lin Receiver and transmitter chips packaging structure and automotive radar detector device using same
US10741508B2 (en) * 2018-04-30 2020-08-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device having antenna and manufacturing method thereof
US11004757B2 (en) 2018-05-14 2021-05-11 Invensas Bonding Technologies, Inc. Bonded structures
JP7095625B2 (ja) * 2019-03-01 2022-07-05 株式会社デンソー 車載用レーダ装置
US11646498B2 (en) * 2019-05-16 2023-05-09 Intel Corporation Package integrated cavity resonator antenna
CN112398497A (zh) * 2019-08-16 2021-02-23 华为技术有限公司 射频装置及射频装置的组装方法
WO2021059738A1 (fr) * 2019-09-27 2021-04-01 株式会社村田製作所 Module d'antenne et son procédé de fabrication, et substrat à agrégat
CN113497341A (zh) * 2020-03-18 2021-10-12 康普技术有限责任公司 天线组件和基站天线
JP7477628B2 (ja) * 2020-09-28 2024-05-01 富士フイルム株式会社 積層体の製造方法、アンテナインパッケージの製造方法、及び積層体
TWI789877B (zh) * 2021-08-19 2023-01-11 特崴光波導股份有限公司 天線結構
US20230253702A1 (en) * 2022-02-10 2023-08-10 Swiftlink Technologies Co., Ltd. Periodic Mode-Selective Structure for Surface Wave Scattering Mitigation in Millimeter Wave Antenna Arrays

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096457A (en) 1976-10-29 1978-06-20 Harvard Industries, Inc. Low pass harmonic absorber
US4268803A (en) 1979-05-24 1981-05-19 Communications Satellite Corporation Periodic lid for integrated circuit
US4320402A (en) * 1980-07-07 1982-03-16 General Dynamics Corp./Electronics Division Multiple ring microstrip antenna
US4697192A (en) 1985-04-16 1987-09-29 Texas Instruments Incorporated Two arm planar/conical/helix antenna
US4800389A (en) 1986-12-05 1989-01-24 Mars Electronics Radar apparatus
US5191351A (en) 1989-12-29 1993-03-02 Texas Instruments Incorporated Folded broadband antenna with a symmetrical pattern
JPH06147811A (ja) 1992-11-04 1994-05-27 Fujitsu Ltd 回転角度検出方式
US5821454A (en) 1995-08-30 1998-10-13 Hewlett-Packard Co. Method and apparatus for reducing electromagnetic emissions from openings in the enclosure of an electronic device
US6262495B1 (en) 1998-03-30 2001-07-17 The Regents Of The University Of California Circuit and method for eliminating surface currents on metals
JP2000278009A (ja) * 1999-03-24 2000-10-06 Nec Corp マイクロ波・ミリ波回路装置
JP3739230B2 (ja) 1999-04-26 2006-01-25 株式会社日立製作所 高周波通信装置
JP3589137B2 (ja) 2000-01-31 2004-11-17 株式会社日立製作所 高周波通信装置およびその製造方法
EP1126522A1 (fr) * 2000-02-18 2001-08-22 Alcatel Circuit intégré empaqueté avec antenne radiofréquence
US6426722B1 (en) 2000-03-08 2002-07-30 Hrl Laboratories, Llc Polarization converting radio frequency reflecting surface
US6483481B1 (en) 2000-11-14 2002-11-19 Hrl Laboratories, Llc Textured surface having high electromagnetic impedance in multiple frequency bands
WO2002103846A1 (fr) 2001-06-15 2002-12-27 E-Tenna Corporation Antenne a ouverture equipee d'un support a faible impedance
JP2003008309A (ja) 2001-06-25 2003-01-10 Nec Corp マイクロ波帯干渉防止パッケージ
JP3973402B2 (ja) 2001-10-25 2007-09-12 株式会社日立製作所 高周波回路モジュール
SE0103783D0 (sv) 2001-11-12 2001-11-12 Kildal Antenn Consulting Ab Strip-loaded dielectric substrates for improvements of antennas and microwave devices
JP2004022587A (ja) * 2002-06-12 2004-01-22 Denso Corp 筐体
JP2003204211A (ja) * 2002-09-30 2003-07-18 Nec Corp マイクロ波・ミリ波回路装置
US7215007B2 (en) 2003-06-09 2007-05-08 Wemtec, Inc. Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
US7250835B2 (en) 2004-02-20 2007-07-31 Teledyne Licensing, Llc Waveguide band-stop filter
US6967282B2 (en) 2004-03-05 2005-11-22 Raytheon Company Flip chip MMIC on board performance using periodic electromagnetic bandgap structures
US7123118B2 (en) 2004-03-08 2006-10-17 Wemtec, Inc. Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
US7157992B2 (en) 2004-03-08 2007-01-02 Wemtec, Inc. Systems and methods for blocking microwave propagation in parallel plate structures
US20060066414A1 (en) 2004-09-28 2006-03-30 Rockwell Scientific Licensing, Llc Method and apparatus for changing the polarization of a signal
CN101160597A (zh) 2005-04-18 2008-04-09 哈里斯股份有限公司 电子零件及该电子零件的制造方法
US7372408B2 (en) * 2006-01-13 2008-05-13 International Business Machines Corporation Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas
US7518229B2 (en) * 2006-08-03 2009-04-14 International Business Machines Corporation Versatile Si-based packaging with integrated passive components for mmWave applications
US7525509B1 (en) 2006-08-08 2009-04-28 Lockheed Martin Tunable antenna apparatus
US7444737B2 (en) * 2006-12-07 2008-11-04 The Boeing Company Method for manufacturing an antenna
US8514036B2 (en) * 2007-08-14 2013-08-20 Wemtec, Inc. Apparatus and method for mode suppression in microwave and millimeterwave packages
US8816798B2 (en) * 2007-08-14 2014-08-26 Wemtec, Inc. Apparatus and method for electromagnetic mode suppression in microwave and millimeterwave packages
US7852281B2 (en) * 2008-06-30 2010-12-14 Intel Corporation Integrated high performance package systems for mm-wave array applications
US7855691B2 (en) 2008-08-07 2010-12-21 Toyota Motor Engineering & Manufacturing North America, Inc. Automotive radar using a metamaterial lens
US20120086463A1 (en) * 2010-10-12 2012-04-12 Boybay Muhammed S Metamaterial Particles for Near-Field Sensing Applications

Also Published As

Publication number Publication date
CN102543906A (zh) 2012-07-04
US20120119969A1 (en) 2012-05-17
EP2453723B1 (fr) 2020-03-18
US9386688B2 (en) 2016-07-05
EP2453723A2 (fr) 2012-05-16
EP2453723A3 (fr) 2017-10-25
JP2012105261A (ja) 2012-05-31

Similar Documents

Publication Publication Date Title
JP5966171B2 (ja) 集積アンテナパッケージ
US9553371B2 (en) Radar module
KR102099578B1 (ko) 무선 주파수 장치 패키지 및 이의 형성 방법
CN108428693B (zh) 集成电路封装
JP7303815B2 (ja) 合成樹脂製アンテナを備えた車両の周辺把握のためのレーダーシステム
EP2905632B1 (fr) Module radar et dispositif de mesure de vitesse l'utilisant
EP2901523B1 (fr) Module radiofréquence
US7342299B2 (en) Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
CN113646890B (zh) 封装上天线集成电路器件
US9444135B2 (en) Integrated circuit package
KR101295926B1 (ko) 링 및/또는 오프셋 캐비티들에 집적 개구-결합 패치 안테나(들)을 갖는 무선 주파수 집적회로 패키지들
JP2010256327A (ja) ミリ波撮像装置およびレーダーのためのデュアルバンドアンテナアレイおよびｒｆフロントエンド
US11791542B2 (en) RF devices including conformal antennas and methods for manufacturing thereof
CN109326584B (zh) 封装天线及其制造方法
WO2021106418A1 (fr) Capteur d'ondes radio millimétriques et véhicule le comportant
CN113678250A (zh) 封装上天线集成电路器件
JP6408561B2 (ja) 集積アンテナ用ホーン様延長部
EP4071807A1 (fr) Dispositif à circuit intégré encapsulé avec symétriseurs intégrés
US20220189892A1 (en) High frequency devices including attenuating dielectric materials
CN116345100A (zh) 具有非均一微带线宽度以改进s参数对准的平面平衡-不平衡转换器

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20120227

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141027

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20141027

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160318

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160607

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160609

R150 Certificate of patent or registration of utility model

Ref document number: 5966171

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250