JP5956877B2 - 吸着テーブル - Google Patents

吸着テーブル Download PDF

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Publication number
JP5956877B2
JP5956877B2 JP2012193716A JP2012193716A JP5956877B2 JP 5956877 B2 JP5956877 B2 JP 5956877B2 JP 2012193716 A JP2012193716 A JP 2012193716A JP 2012193716 A JP2012193716 A JP 2012193716A JP 5956877 B2 JP5956877 B2 JP 5956877B2
Authority
JP
Japan
Prior art keywords
bar
support
suction
elevating
lift
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012193716A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014049703A (ja
Inventor
順 白戸
順 白戸
隆善 工藤
隆善 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2012193716A priority Critical patent/JP5956877B2/ja
Priority to TW102121067A priority patent/TWI505401B/zh
Priority to KR20130087141A priority patent/KR101485966B1/ko
Priority to CN201310395196.4A priority patent/CN103681436B/zh
Publication of JP2014049703A publication Critical patent/JP2014049703A/ja
Application granted granted Critical
Publication of JP5956877B2 publication Critical patent/JP5956877B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Accommodation For Nursing Or Treatment Tables (AREA)
  • Liquid Crystal (AREA)
JP2012193716A 2012-09-04 2012-09-04 吸着テーブル Active JP5956877B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012193716A JP5956877B2 (ja) 2012-09-04 2012-09-04 吸着テーブル
TW102121067A TWI505401B (zh) 2012-09-04 2013-06-14 吸著台
KR20130087141A KR101485966B1 (ko) 2012-09-04 2013-07-24 흡착 테이블
CN201310395196.4A CN103681436B (zh) 2012-09-04 2013-09-03 吸附台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012193716A JP5956877B2 (ja) 2012-09-04 2012-09-04 吸着テーブル

Publications (2)

Publication Number Publication Date
JP2014049703A JP2014049703A (ja) 2014-03-17
JP5956877B2 true JP5956877B2 (ja) 2016-07-27

Family

ID=50318586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012193716A Active JP5956877B2 (ja) 2012-09-04 2012-09-04 吸着テーブル

Country Status (4)

Country Link
JP (1) JP5956877B2 (ko)
KR (1) KR101485966B1 (ko)
CN (1) CN103681436B (ko)
TW (1) TWI505401B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108897156B (zh) * 2018-08-16 2023-10-27 武汉精测电子集团股份有限公司 一种垂直压接pogo导通装置
KR102537104B1 (ko) * 2021-02-05 2023-05-26 주식회사 야스 기판 전면부 접촉 없이 다 모델 대응 가능한 분할형 기판 홀딩 장치
CN114967189B (zh) * 2021-02-22 2024-02-06 广州视源电子科技股份有限公司 贴合装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3457900B2 (ja) * 1998-11-18 2003-10-20 東京エレクトロン株式会社 基板熱処理装置及び基板熱処理方法
KR100519369B1 (ko) * 2002-03-05 2005-10-07 엘지.필립스 엘시디 주식회사 액정표시소자용 합착 장치
JP2005165015A (ja) * 2003-12-03 2005-06-23 Seiko Epson Corp 膜形成用マスク、膜形成装置、電気光学装置および電子機器
CN100485874C (zh) * 2004-04-16 2009-05-06 东京毅力科创株式会社 被处理体的处理装置
CN100510874C (zh) * 2004-11-24 2009-07-08 喜开理株式会社 附带倾斜功能的浮起单元及浮起装置
JP2006201330A (ja) * 2005-01-19 2006-08-03 Fujitsu Ltd 貼合せ基板製造装置及び貼合せ基板製造方法
JP2007086186A (ja) * 2005-09-20 2007-04-05 Sharp Corp 基板加熱装置
JP2010016053A (ja) * 2008-07-01 2010-01-21 Tokyo Electron Ltd 被検査体の受け渡し機構
JP4964861B2 (ja) * 2008-12-03 2012-07-04 アドヴァンスド・ディスプレイ・プロセス・エンジニアリング・コーポレーション・リミテッド 基板支持装置
JP2011029565A (ja) * 2009-07-29 2011-02-10 Toppan Printing Co Ltd 基板保持装置
KR101130969B1 (ko) * 2009-09-17 2012-04-03 주성엔지니어링(주) 기판 지지부재와 이를 포함하는 기판 가열 장치
TWI447846B (zh) * 2011-12-23 2014-08-01 Au Optronics Corp 基板固定裝置

Also Published As

Publication number Publication date
KR101485966B1 (ko) 2015-01-23
CN103681436B (zh) 2016-08-17
TWI505401B (zh) 2015-10-21
CN103681436A (zh) 2014-03-26
JP2014049703A (ja) 2014-03-17
TW201411771A (zh) 2014-03-16
KR20140031101A (ko) 2014-03-12

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